摘要:
A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.
摘要:
A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.
摘要:
A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.
摘要:
A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.
摘要:
An internal combustion engine diagnostic device and an internal combustion engine diagnostic method identify an abnormal cylinder having an abnormal air-fuel ratio among a plurality of cylinders during the operation of an internal combustion engine. The internal combustion engine diagnostic device comprises: an air-fuel ratio control unit for changing the air-fuel ratio in a stepwise manner by controlling a fuel injection amount adjusting means that adjusts the fuel injection amount of each of the plurality of cylinders; and an abnormal cylinder identification unit for identifying an abnormal cylinder on the basis of the relationship between each air-fuel ratio changed in a stepwise manner and the number of misfires occurring in the plurality of cylinders, the number being counted by a misfire counter for each air-fuel ratio changed in a stepwise manner.
摘要:
A gas generator includes a holder made of metal having assembled thereto a cup filled with a gas generating agent and an igniter for burning the gas generating agent. The holder includes a body part, and an igniter fixing engagement part and a cup fixing engagement part projecting from the body part. These engagement parts are bent, so that the igniter and the cup are fixed by crimping to the holder. The engagement parts are both finish shaped by forging processing. A metal flow appearing in superficial layers of the engagement parts extends continuously from the body part through the engagement parts to return to the body part, without being divided in surfaces of the engagement parts.
摘要:
According to one embodiment, the luminescent material emits light with an emission peak within a wavelength range of 490 to 580 nm when excited with light having a wavelength range of 250 to 500 nm and includes a particle containing a Sr3Si13Al3O2N21-based crystal activated by Eu. The particle includes an outer region which is within a depth of 5 nm from a surface of the particle and an inner region which is deeper than the outer region. The outer region and the inner region satisfy a ratio Oouter/Oinner of 1.0 to 3.8. Oouter is an average of oxygen concentration in the outer region and Oinner is an average of oxygen concentration in the inner region.
摘要:
A torque distribution apparatus acquires instructed torque input and a motor efficiency map; detects vehicular speed and drive wheel rotational speed; calculates based on the speeds, a relational expression of a slip rate at drive wheels and a friction coefficient; creates based on the relational expression, a performance curve expression that indicates torque-drive wheel rotational speed relations, superimposes the performance curve expression on the motor efficiency map, creates an efficiency variation expression that indicates for each vehicular speed, the torque and efficiency values of the motor efficiency map, and calculates torque that optimizes efficiency, from the efficiency variation expression; calculates within a range of the slip rate being 0 to 0.2 and based on the instructed torque and torque optimizing efficiency, a torque distribution value for each of the motors such that total efficiency ηtotal=Σ((Tn/T)×ηdn×ηλn) is maximized; and controls based on the calculated torque distribution values, torque distribution among motors.
摘要:
This system for detecting the surrounding: conditions of a moving body forcibly changes the state of at least one of a plurality of lighting devices (change from an unlit stats to a lighting state or a blinking state, change in the emission color, or change in the luminance) installed inside the moving body if an object to which attention must be paid during traveling of the moving body is detected in the surroundings of the moving body.
摘要:
The present invention is directed to a method for producing a bonded wafer, the method in which heat treatment for flattening the surface of a thin film is performed on a bonded wafer made by the ion implantation delamination method in an atmosphere containing hydrogen or hydrogen chloride, wherein the surface of a susceptor on which the bonded wafer is to be placed, the susceptor used at the time of flattening heat treatment, is coated with a silicon film in advance. As a result, a method for producing a bonded wafer is provided, the method by which a bonded wafer having a thin film with good film thickness uniformity can be obtained even when heat treatment for flattening the surface of a thin film of a bonded wafer after delamination is performed in the ion implantation delamination method.