公开(公告)号：US20050176250A1

公开(公告)日：2005-08-11

申请号：US10486726

申请日：2002-08-08

申请人： Hideaki Takahashi ,  Koshi Okita ,  Kuon Miyazaki ,  Takayuki Matsuda

发明人： Hideaki Takahashi ,  Koshi Okita ,  Kuon Miyazaki ,  Takayuki Matsuda

IPC分类号： B24B37/04 ,  C09G1/04 ,  H01L21/321 ,  H01L21/302

CPC分类号： H01L21/3212 ,  B24B37/044 ,  C09G1/04

摘要： A polishing fluid for metallic films, wherein the etching rate is 10 nm/min. or less, the polishing rate under a load of 10 KPa is 200 nm/min. or more, and the contrast, a ratio of the above-mentioned polishing rate to the etching rate, is 20 or more; and a method for producing a semiconductor substrate using the same.

摘要翻译： 一种用于金属膜的抛光液，其中蚀刻速率为10nm / min。 10KPa以下的研磨速度为200nm /分钟以下。 以上，上述研磨速度与蚀刻速度的比例为20以上。 以及使用其制造半导体衬底的方法。

公开(公告)号：US08187788B2

公开(公告)日：2012-05-29

申请号：US12226227

申请日：2007-04-24

申请人： Kuon Miyazaki ,  Takashi Hayakawa

发明人： Kuon Miyazaki ,  Takashi Hayakawa

IPC分类号： G03F7/022 ,  G03F7/26 ,  G03F7/30 ,  C08F2/42 ,  G03C1/00 ,  C08J3/26

CPC分类号： C08L79/08 ,  C08G73/1046 ,  C08G73/1067 ,  C08G73/1071 ,  G03F7/0233 ,  G03F7/161 ,  G03F7/40 ,  H05K3/287 ,  Y10S522/91 ,  Y10T428/24802

摘要： Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 μm/sec. When a photosensitive layer having a thickness of 30 μm is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 μm/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.

摘要翻译： 公开了一种包含碱溶性树脂的光敏树脂组合物，其中碱溶性树脂在碳酸钠水溶液中的溶解速率不小于0.04微米/秒。 当通过将感光性树脂组合物涂布在基材上并通过加热除去溶剂来形成厚度为30μm的感光层时，用1000mJ / cm 2以下的活性光线照射所得到的感光层， 由感光性树脂组合物制成的感光层中用活性射线照射的部分的比例不小于0.22μm/ sec，未用活性射线照射的部分的膜残留率不小于90％。

公开(公告)号：US07569260B2

公开(公告)日：2009-08-04

申请号：US10567355

申请日：2004-08-18

申请人： Kuon Miyazaki ,  Hideaki Takahashi

发明人： Kuon Miyazaki ,  Hideaki Takahashi

IPC分类号： C09K10/00 ,  C08L63/00

CPC分类号： C08G59/62 ,  Y10T428/1073

摘要： There is provided a photosensitive composition excellent in photo-curability which comprises an epoxy compound having two or more epoxy groups, a polynuclear phenol compound having a specific structure and an energy beam-sensitive cationic polymerization initiator, and optionally a predetermined percentage of a hydroxyl group-containing compound having one or more hydroxyl groups and one or more of at least one of a vinyl ether group and an oxetanyl group in a molecule, and a cured product of the same whose film is excellent in adhesion to various substrates, water resistance and flexibility.

摘要翻译： 提供光固化性优异的感光性组合物，其包含具有两个以上环氧基的环氧化合物，具有特定结构的多核酚化合物和能量束敏感性阳离子聚合引发剂，以及任选地，预定百分比的羟基 分子内具有一个或多个羟基和一个或多个至少一个乙烯基醚基和氧杂环丁烷基的化合物及其与各种基材的粘附性优异的膜的固化产物，耐水性和 灵活性。

公开(公告)号：US20060222999A1

公开(公告)日：2006-10-05

申请号：US10567355

申请日：2004-08-18

申请人： Kuon Miyazaki ,  Hideaki Takahashi

发明人： Kuon Miyazaki ,  Hideaki Takahashi

IPC分类号： G03C1/00

CPC分类号： C08G59/62 ,  Y10T428/1073

摘要： There is provided a photosensitive composition excellent in photo-curability which comprises an epoxy compound having two or more epoxy groups, a polynuclear phenol compound having a specific structure and an energy beam-sensitive cationic polymerization initiator, and optionally a predetermined percentage of a hydroxyl group-containing compound having one or more hydroxyl groups and one or more of at least one of a vinyl ether group and an oxetanyl group in a molecule, and a cured product of the same whose film is excellent in adhesion to various substrates, water resistance and flexibility.

公开(公告)号：US07935739B2

公开(公告)日：2011-05-03

申请号：US11813297

申请日：2006-02-15

申请人： Atsushi Shimizu ,  Masao Kondo ,  Kuon Miyazaki

发明人： Atsushi Shimizu ,  Masao Kondo ,  Kuon Miyazaki

IPC分类号： C09J11/00 ,  C09D11/00 ,  C09D163/00 ,  C09D183/00 ,  C08G59/18 ,  C08G65/02 ,  C08L63/04 ,  C08L83/00

CPC分类号： C09J11/00 ,  B41M7/0072 ,  C08L61/06 ,  C08L83/02 ,  C09D4/00 ,  C09D11/101 ,  C09D161/14 ,  C08L83/00 ,  C08L2666/16

摘要： An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.

摘要翻译： 本发明的目的是提供一种低粘度的阳离子可固化组合物，即使在空气中也能快速光固化，对玻璃或树脂等基材具有良好的粘合性，并且具有优异的耐玻璃清洁剂和水 抵抗性; 喷墨油墨，凹版油墨和包含该组合物的硬涂层材料; 及其固化物。 一种阳离子可固化组合物，其包含：（A）每分子具有1至100重量份的具有3个或更多芳环的苯酚衍生物，其中所述芳环具有其中芳族的酚羟基的一部分或全部氢原子的结构 环被可聚合官能团取代; （B）1〜500重量份的阳离子聚合性化合物; 和（C）0.05〜20重量份的光 - 和/或热 - 阳离子引发剂。

公开(公告)号：US20090203811A1

公开(公告)日：2009-08-13

申请号：US11813297

申请日：2006-02-15

申请人： Atsushi Shimizu ,  Masao Kondo ,  Kuon Miyazaki

发明人： Atsushi Shimizu ,  Masao Kondo ,  Kuon Miyazaki

IPC分类号： C08J3/28 ,  C08L61/06

CPC分类号： C09J11/00 ,  B41M7/0072 ,  C08L61/06 ,  C08L83/02 ,  C09D4/00 ,  C09D11/101 ,  C09D161/14 ,  C08L83/00 ,  C08L2666/16

摘要： An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.

摘要翻译： 本发明的目的是提供一种低粘度的阳离子可固化组合物，即使在空气中也能快速光固化，对玻璃或树脂等基材具有良好的粘合性，并且具有优异的耐玻璃清洁剂和水 抵抗性; 喷墨油墨，凹版油墨和包含该组合物的硬涂层材料; 及其固化物。 一种阳离子可固化组合物，其包含：（A）每分子具有1至100重量份的具有3个或更多芳环的苯酚衍生物，其中所述芳环具有其中芳族的酚羟基的一部分或全部氢原子的结构 环被可聚合官能团取代; （B）1〜500重量份的阳离子聚合性化合物; 和（C）0.05〜20重量份的光 - 和/或热 - 阳离子引发剂。

公开(公告)号：US20090191385A1

公开(公告)日：2009-07-30

申请号：US12226227

申请日：2007-04-24

申请人： Kuon Miyazaki ,  Takashi Hayakawa

发明人： Kuon Miyazaki ,  Takashi Hayakawa

IPC分类号： B32B3/10 ,  G03F7/039 ,  G03F7/20

CPC分类号： C08L79/08 ,  C08G73/1046 ,  C08G73/1067 ,  C08G73/1071 ,  G03F7/0233 ,  G03F7/161 ,  G03F7/40 ,  H05K3/287 ,  Y10S522/91 ,  Y10T428/24802

摘要： Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 μm/sec. When a photosensitive layer having a thickness of 30 μm is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 μm/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.

摘要翻译： 公开了一种包含碱溶性树脂的光敏树脂组合物，其中碱溶性树脂在碳酸钠水溶液中的溶解速率不低于0.04mum / sec。 当通过将感光性树脂组合物涂布在基材上并通过加热除去溶剂来形成厚度为30μm的感光层时，用1000mJ / cm 2以下的活性射线照射所得到的感光层， 由感光性树脂组合物制成的感光层中用活性射线照射的部分的速率不小于0.22μm/ sec，未用活性射线照射的部分的膜残留率不小于90％。