公开(公告)号：US4394711A

公开(公告)日：1983-07-19

申请号：US153565

申请日：1980-05-27

申请人： Larry R. Conley

发明人： Larry R. Conley

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/06

CPC分类号： H01R12/58 ,  H05K3/328 ,  H05K3/4015 ,  H05K7/06 ,  H05K1/0286 ,  H05K1/0287 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10962 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/3468

摘要： A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

摘要翻译： 一种具有多个连接区域的电路板装置，每个连接区域可以各自形成与部件的引线的焊接连接以及与焊丝的焊接连接，这使得在焊丝期间可能损坏该区域并且有利于修复。 印刷电路板的每个连接区域包括至少两个电镀通孔，这些电镀通孔由诸如铜的可焊接材料电镀，也可以连接这些孔，以及一个可焊接但可焊接材料的销，例如不锈钢，其位于 并且与孔的壁压配合接触。 组件引线可以通过波峰焊技术焊接到无孔孔中，而不用焊料涂覆引脚，并且可以通过缝线技术将引线焊接到引脚上。 这些销允许对其进行焊缝焊接，而不需要大的焊接电流通过板的薄镀层，并且还通过更换销来便于修理损坏的焊接。

公开(公告)号：US4242719A

公开(公告)日：1980-12-30

申请号：US44404

申请日：1979-06-01

申请人： Larry R. Conley

发明人： Larry R. Conley

IPC分类号： H05K1/02 ,  H01R12/55 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/4015 ,  H01R12/58 ,  H05K3/328 ,  H05K1/0286 ,  H05K1/0287 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10962 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/3468

摘要： A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

摘要翻译： 一种具有多个连接区域的电路板装置，每个连接区域可以各自形成与部件的引线的焊接连接以及与焊丝的焊接连接，这使得在焊丝期间可能损坏该区域并且有利于修复。 印刷电路板的每个连接区域包括至少两个电镀通孔，这些电镀通孔由诸如铜的可焊接材料电镀，也可以连接这些孔，以及一个可焊接但可焊接材料的销，例如不锈钢，其位于 并且与孔的壁压配合接触。 组件引线可以通过波峰焊技术焊接到无孔孔中，而不用焊料涂覆引脚，并且可以通过缝线技术将引线焊接到引脚上。 这些销允许对其进行焊缝焊接，而不需要大的焊接电流通过板的薄镀层，并且还通过更换销来便于修理损坏的焊接。

公开(公告)号：US4878155A

公开(公告)日：1989-10-31

申请号：US252260

申请日：1988-09-30

申请人： Larry R. Conley

发明人： Larry R. Conley

IPC分类号： H01L23/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/3442 ,  H01L23/642 ,  H05K1/184 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K3/222 ,  H05K3/4046 ,  Y02P70/611 ,  Y02P70/613

摘要： Decoupling capacitance is provided with negligible inductance in a high speed discrete wire logic panel by the use of SMT (surface mounting) capacitors that are mounted in holes in the circuit board. A hole is formed in the circuit board under each location where a dual-in-line IC (integrated circuit) is to be mounted, and an SMT capacitor is mounted in the hole, with the opposite terminals of the capacitor soldered to the conductive layers on opposite board surfaces. Each quantity of solder extends substantially in the plane of a corresponding conductive layer. Only one side of each capacitor terminal is soldered to a conductive layer, to permit flux washout. In the PGA (pin grid array) area of the circuit board, a capacitor is selectively mounted under an IC by removing a pin from a hole lying under the pin-free area in the center of the IC, and installing a capacitor in the hole.

摘要翻译： 去耦电容通过使用安装在电路板上的孔中的SMT（表面安装）电容器在高速离散线逻辑面板中提供可忽略的电感。 在要安装双列直插IC（集成电路）的每个位置的电路​​板中形成一个孔，并且在该孔中安装一个SMT电容器，其中电容器的相对端焊接到导电层 对面板表面。 每一量的焊料基本上在相应导电层的平面内延伸。 每个电容器端子只有一侧焊接到导电层，以允许焊剂清除。 在电路板的PGA（引脚格栅阵列）区域中，通过从位于IC中心的无引脚区域下方的孔中移除引脚，选择性地将电容器安装在IC下方，并将电容器安装在孔中 。