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公开(公告)号：US5207318A
公开(公告)日：1993-05-04
申请号：US737201
申请日：1991-07-29
申请人： Leonard A. Roland , David T. Ko , Michael T. Long
发明人： Leonard A. Roland , David T. Ko , Michael T. Long
摘要： A switch is described that includes a plunger (20, FIG. 1 ) moveable between up and down position and having upper contacts (22, 24) and lower contacts (26, 28). When the plunger is moved to a down position, opposite ends of the upper contact (22) move down against first and second terminals (12, 14) to interconnect them. When the plunger is moved to an up position, opposite ends of the lower contact (26) move up against the first terminal (12) and a third terminal (16) to interconnect them. The plunger can move within a hole in a circuit board and carry two upper and two lower contacts to connect four terminals in two different ways. Each terminal can include upper and lower terminal pads (120, 122, FIG. 5 ) lying respectively on upper and lower surfaces of the circuit board and interconnected through plated-through holes (124) in the board.
摘要翻译： 描述了一种开关，其包括可在上下位置之间移动并具有上触头（22,24）和下触点（26,28）的柱塞（20），其可移动。 当柱塞移动到向下位置时，上触点（22）的相对端相对于第一和第二端子（12,14）向下移动以使它们互连。 当柱塞移动到向上位置时，下触头（26）的相对端部向上移动抵靠第一端子（12）和第三端子（16）以将它们互连。 柱塞可以在电路板的一个孔内移动，并承载两个上下两个触点，以两种不同的方式连接四个端子。 每个端子可以包括分别位于电路板的上表面和下表面上的上和下端子焊盘（120,122，图5），并通过电路板中的电镀通孔（124）互连。
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公开(公告)号：US4686492A
公开(公告)日：1987-08-11
申请号：US708129
申请日：1985-03-04
IPC分类号： H03H7/38 , H01L23/50 , H01L23/66 , H01L25/04 , H01L25/16 , H01L25/18 , H01L27/13 , H01P3/08 , H01P5/02 , H01P5/08 , H01P5/00
CPC分类号： H01L24/48 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/49 , H01L25/16 , H01L2223/6611 , H01L2223/6627 , H01L2224/04042 , H01L2224/05553 , H01L2224/4554 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49174 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/15787 , H01L2924/1903 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , Y10T29/49124 , Y10T29/49162
摘要： A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.
摘要翻译： 两个半导体器件之间的接合线连接通过提供补偿感抗的电容效应来缓解高频感应负载的问题。 电容效应通过在公共电连接点处利用多个并联层的接合线来提供。 当增加更多的层时，可以控制净阻抗以匹配驱动下游半导体的阻抗。
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3.发明授权
公开(公告)号：US4600907A
公开(公告)日：1986-07-15
申请号：US709463
申请日：1985-03-07
CPC分类号： H01L24/50 , H01L23/66 , H01L24/36 , H01L24/40 , H01L24/41 , H01P1/047 , H01L2223/6611 , H01L2223/6627 , H01L2224/40225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/15787 , H01L2924/1903 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149
摘要： An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.
摘要翻译： 两个半导体器件之间的电连接采用共面微带波导，其包括嵌入在聚酰亚胺基底中的多个导电金属薄带，其尺寸设计为展现共面波导的性质。 波导结构提供两个器件之间适当的阻抗匹配，使它们能够处理频率在千兆赫兹范围内的信号。
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公开(公告)号：US20100060304A1
公开(公告)日：2010-03-11
申请号：US12206620
申请日：2008-09-08
CPC分类号： H05K3/403 , G01R1/06772 , G01R1/06788 , G01R3/00 , H05K1/092 , H05K1/167 , H05K3/245 , H05K2201/0367 , H05K2201/09172 , H05K2203/1476 , Y10T29/49121 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49204
摘要： The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.
摘要翻译： 具有印刷尖端的探针由具有连接到其端部边缘的多个探针尖端的基底组成，多个测试路径，每个连接到探针尖端中的一个并且沿着基底延伸，并且至少一个测试路径包括 与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。
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公开(公告)号：US4695811A
公开(公告)日：1987-09-22
申请号：US890044
申请日：1986-07-28
CPC分类号： H01P1/125
摘要： A high frequency coaxial switch has a coaxial connector mounted on a housing to provide electrical access to a cavity within the housing, the cavity being small to suppress moding. The coaxial connector is electrically connected to a microstrip conductor on a hybrid circuit board within the cavity, and switching is accomplished by compensated contact striplines which electrically make or break contact with the microstrip conductor.
摘要翻译： 高频同轴开关具有安装在壳体上的同轴连接器，以提供对壳体内的空腔的电气通路，该腔体很小以抑制调制。 同轴连接器电连接到空腔内的混合电路板上的微带导体，并且通过与微带导体电接触或断开接触的补偿接触带状线实现切换。
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公开(公告)号：US08091225B2
公开(公告)日：2012-01-10
申请号：US12948713
申请日：2010-11-17
IPC分类号： H01R43/16
CPC分类号： H05K3/403 , G01R1/06772 , G01R1/06788 , G01R3/00 , H05K1/092 , H05K1/167 , H05K3/245 , H05K2201/0367 , H05K2201/09172 , H05K2203/1476 , Y10T29/49121 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49204
摘要： The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.
摘要翻译： 具有印刷末端的探针的制造方法由具有连接到其端部边缘的多个探针尖端的基底，多个测试路径组成，每个测试路径连接到探针尖端中的一个并且沿着基底延伸，以及至少一个 测试路径包括与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。
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公开(公告)号：US20110121849A1
公开(公告)日：2011-05-26
申请号：US12948713
申请日：2010-11-17
CPC分类号： H05K3/403 , G01R1/06772 , G01R1/06788 , G01R3/00 , H05K1/092 , H05K1/167 , H05K3/245 , H05K2201/0367 , H05K2201/09172 , H05K2203/1476 , Y10T29/49121 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49204
摘要： The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.
摘要翻译： 具有印刷尖端的探针由具有连接到其端部边缘的多个探针尖端的基底组成，多个测试路径，每个连接到探针尖端中的一个并且沿着基底延伸，并且至少一个测试路径包括 与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。
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公开(公告)号：US4670723A
公开(公告)日：1987-06-02
申请号：US713134
申请日：1985-03-18
CPC分类号： H01P1/227
摘要： A broad band, thin film attenuator for microwave circuits is constructed by placing a ground plane conductor on one side of a ceramic, insulating substrate, and conductive, resistive, and reactive elements on the other side of the substrate. Capacitive stubs are provided to compensate for inductance in grounding conductors between resistance elements and the ground plane conductor. Constrictions are provided in input and output conductors to provide increased series inductance to compensate for distributed capacitance of the resistance elements. One resistance element is constructed so that the interface between the input conductor and that resistance element forms an obtuse interior angle with an adjoining transitional edge extending from the input conductor to the grounding conductor, and the transitional edge forms an obtuse interior angle with the adjoining edge of the grounding conductor, so as to minimize current density concentrations and distributed capacitance. A second resistance element is employed to achieve additional attenuation.
摘要翻译： 用于微波电路的宽带薄膜衰减器通过在基板的另一侧上放置陶瓷，绝缘基板和导电，电阻和反应元件的一侧上的接地平面导体来构造。 提供电容性短截线以补偿电阻元件和接地平面导体之间接地导体的电感。 在输入和输出导体中提供了限制，以提供增加的串联电感来补偿电阻元件的分布电容。 一个电阻元件被构造成使得输入导体和该电阻元件之间的界面与从输入导体延伸到接地导体的相邻过渡边缘形成钝角内角，并且过渡边缘与邻接边缘形成钝角内角 的接地导体，以便最小化电流密度浓度和分布电容。 采用第二电阻元件来实现额外的衰减。
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公开(公告)号：US07940067B2
公开(公告)日：2011-05-10
申请号：US12206620
申请日：2008-09-08
IPC分类号： G01R31/20
CPC分类号： H05K3/403 , G01R1/06772 , G01R1/06788 , G01R3/00 , H05K1/092 , H05K1/167 , H05K3/245 , H05K2201/0367 , H05K2201/09172 , H05K2203/1476 , Y10T29/49121 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49204
摘要： The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.
摘要翻译： 具有印刷尖端的探针由具有连接到其端部边缘的多个探针尖端的基底组成，多个测试路径，每个连接到探针尖端中的一个并且沿着基底延伸，并且至少一个测试路径包括 与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。
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公开(公告)号：US4831222A
公开(公告)日：1989-05-16
申请号：US728130
申请日：1985-04-29
摘要： An integrated pad switch has conductive contacts that may be embedded in a flexible substrate to form a wiper contact. The flexible substrate is backed by a foamed elastic block and mounted on a driver. The wiper contact moves across the surface of a hybrid circuit substrate having an electrical circuit to provide the desired switching function.
摘要翻译： 集成焊盘开关具有可以嵌入在柔性衬底中以形成擦拭器触点的导电触头。 柔性基板由发泡弹性块支撑并安装在驱动器上。 擦拭器触头跨越具有电路的混合电路基板的表面移动以提供期望的开关功能。
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