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    Apparatus and method for in-situ monitoring of wafer bonding time
    3.
    发明授权
    Apparatus and method for in-situ monitoring of wafer bonding time 有权
    晶圆接合时间的现场监测装置及方法

    公开(公告)号：US07612895B2

    公开(公告)日：2009-11-03

    申请号：US12118100

    申请日：2008-05-09

    申请人： Markus Gabriel ,  Matthew Stiles

    发明人： Markus Gabriel ,  Matthew Stiles

    IPC分类号： G01B11/14 ,  H01L21/66

    CPC分类号： H01L22/14

    摘要： An apparatus and a method for semiconductor wafer bonding provide in-situ and real time monitoring of semiconductor wafer bonding time. Deflection of the wafer edges during the last phase of the direct bonding process indicates the end of the bonding process. The apparatus utilizes a distance sensor to measure the deflection of the wafer edges and the bonding time is measured as the time between applying the force (bonding initiation) and completion of the bonding process. The bonding time is used as a real-time quality control parameter for the wafer bonding process.

    摘要翻译： 半导体晶片接合的装置和方法提供半导体晶片接合时间的原位和实时监测。 在直接接合过程的最后阶段期间，晶片边缘的偏转指示结合过程的结束。 该装置利用距离传感器来测量晶片边缘的偏转，并且结合时间被测量为施加力（接合起始）和结合过程完成之间的时间。 接合时间用作晶片接合工艺的实时质量控制参数。

    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS
    5.
    发明申请
    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
    用于机械结合临时粘结半导体波导的装置

    公开(公告)号：US20100263794A1

    公开(公告)日：2010-10-21

    申请号：US12761014

    申请日：2010-04-15

    申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    IPC分类号： B32B38/10

    CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

    摘要： A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface. In operation, a wafer pair, comprising a carrier wafer stacked upon and being bonded to a device wafer via an adhesive layer and a release layer, is placed upon the chuck so that the ubonded surface of the device wafer is in contact with the chuck top surface. Next, the flex plate swings around the hinge and is placed above the bottom chuck so that its first surface is in contact with the unbonded surface of the carrier wafer. Next, the contact roller is driven upward until it contacts and pushes the second edge of the flex plate up while the carrier wafer is held by the flex plate and the device wafer is held by the chuck via the second and first wafer holders, respectively. The contact roller push flexes the second edge of the flex plate and causes delamination of the wafer pair along the release layer.

    摘要翻译： 用于通过与释放层临时粘合的晶片组合的粘合层分离两个脱粘器装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和构造成保持与卡盘的顶表面接触的晶片的第一晶片保持器。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括连接到铰链的第一边缘和与第一边缘径向相对的第二边缘，并且柔性板的第一边缘邻近卡盘的第一边缘布置，并且柔性板构造成围绕铰链摆动，并且 被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电动机构造成使接触辊垂直于卡盘顶表面的平面移动。 在操作中，包括经由粘合剂层和释放层堆叠在器件晶片上并且通过粘合剂层和释放层结合到器件晶片上的载体晶片的晶片对放置在卡盘上，使得器件晶片的ubonded表面与卡盘顶部接触 表面。 接下来，柔性板围绕铰链摆动并且被放置在底部卡盘的上方，使得其第一表面与载体晶片的未结合的表面接触。 接下来，接触辊被向上驱动，直到其接触并将柔性板的第二边缘向上推动，同时载体晶片被柔性板保持，并且装置晶片分别通过第二和第一晶片保持器由卡盘保持。 接触辊推动弯曲柔性板的第二边缘并导致晶片对沿着释放层的分层。

    APPARATUS AND METHOD FOR IN-SITU MONITORING OF WAFER BONDING TIME
    9.
    发明申请
    APPARATUS AND METHOD FOR IN-SITU MONITORING OF WAFER BONDING TIME 有权
    WAFER粘结时间的现场监测装置及方法

    公开(公告)号：US20080285059A1

    公开(公告)日：2008-11-20

    申请号：US12118100

    申请日：2008-05-09

    申请人： MARKUS GABRIEL ,  MATTHEW STILES

    发明人： MARKUS GABRIEL ,  MATTHEW STILES

    IPC分类号： H01L21/66 ,  G01B11/14

    CPC分类号： H01L22/14

    摘要： An apparatus and a method for semiconductor wafer bonding provide in-situ and real time monitoring of semiconductor wafer bonding time. Deflection of the wafer edges during the last phase of the direct bonding process indicates the end of the bonding process. The apparatus utilizes a distance sensor to measure the deflection of the wafer edges and the bonding time is measured as the time between applying the force (bonding initiation) and completion of the bonding process. The bonding time is used as a real-time quality control parameter for the wafer bonding process.

    摘要翻译： 半导体晶片接合的装置和方法提供半导体晶片接合时间的原位和实时监测。 在直接接合过程的最后阶段期间，晶片边缘的偏转指示结合过程的结束。 该装置利用距离传感器来测量晶片边缘的偏转，并且结合时间被测量为施加力（接合起始）和结合过程完成之间的时间。 接合时间用作晶片接合工艺的实时质量控制参数。