利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.034 秒)

    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS
    4.
    发明申请
    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
    用于机械结合临时粘结半导体波导的装置

    公开(公告)号：US20100263794A1

    公开(公告)日：2010-10-21

    申请号：US12761014

    申请日：2010-04-15

    申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    IPC分类号： B32B38/10

    CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

    摘要： A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface. In operation, a wafer pair, comprising a carrier wafer stacked upon and being bonded to a device wafer via an adhesive layer and a release layer, is placed upon the chuck so that the ubonded surface of the device wafer is in contact with the chuck top surface. Next, the flex plate swings around the hinge and is placed above the bottom chuck so that its first surface is in contact with the unbonded surface of the carrier wafer. Next, the contact roller is driven upward until it contacts and pushes the second edge of the flex plate up while the carrier wafer is held by the flex plate and the device wafer is held by the chuck via the second and first wafer holders, respectively. The contact roller push flexes the second edge of the flex plate and causes delamination of the wafer pair along the release layer.

    摘要翻译： 用于通过与释放层临时粘合的晶片组合的粘合层分离两个脱粘器装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和构造成保持与卡盘的顶表面接触的晶片的第一晶片保持器。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括连接到铰链的第一边缘和与第一边缘径向相对的第二边缘，并且柔性板的第一边缘邻近卡盘的第一边缘布置，并且柔性板构造成围绕铰链摆动，并且 被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电动机构造成使接触辊垂直于卡盘顶表面的平面移动。 在操作中，包括经由粘合剂层和释放层堆叠在器件晶片上并且通过粘合剂层和释放层结合到器件晶片上的载体晶片的晶片对放置在卡盘上，使得器件晶片的ubonded表面与卡盘顶部接触 表面。 接下来，柔性板围绕铰链摆动并且被放置在底部卡盘的上方，使得其第一表面与载体晶片的未结合的表面接触。 接下来，接触辊被向上驱动，直到其接触并将柔性板的第二边缘向上推动，同时载体晶片被柔性板保持，并且装置晶片分别通过第二和第一晶片保持器由卡盘保持。 接触辊推动弯曲柔性板的第二边缘并导致晶片对沿着释放层的分层。

    METHOD AND APPARATUS FOR WAFER BONDING
    5.
    发明申请
    METHOD AND APPARATUS FOR WAFER BONDING 审中-公开
    用于波形粘结的方法和装置

    公开(公告)号：US20100089978A1

    公开(公告)日：2010-04-15

    申请号：US12481692

    申请日：2009-06-10

    申请人： EMMETT HUGHLETT ,  THOMAS PRICE ,  HALE JOHNSON

    发明人： EMMETT HUGHLETT ,  THOMAS PRICE ,  HALE JOHNSON

    IPC分类号： B23K20/24

    CPC分类号： H01L21/67092 ,  H01L21/2007 ,  H01L24/94 ,  H01L2224/7598 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

    摘要： An improved apparatus for bonding semiconductor structures includes equipment for treating a first surface of a first semiconductor structure and a first surface of a second semiconductor structure with formic acid, equipment for positioning the first surface of the first semiconductor structure directly opposite and in contact with the first surface of the second semiconductor structure and equipment for forming a bond interface between the treated first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together. The equipment for treating the surfaces of the first and second semiconductor structures with formic acid includes a sealed tank filled partially with liquid formic acid and partially with formic acid vapor. Opening an inlet valve connects the tank to a nitrogen gas source and allows nitrogen gas to flow through the tank. Opening an outlet valve allows a mixture of formic acid vapor with nitrogen gas to flow out of the tank. The mixture is used for treating the surfaces of the first and second semiconductor structures.

    摘要翻译： 用于接合半导体结构的改进的装置包括用于处理第一半导体结构的第一表面和具有甲酸的第二半导体结构的第一表面的设备，用于将第一半导体结构的第一表面直接相对并与其接触的设备 第二半导体结构的第一表面和用于通过将第一和第二半导体结构压在一起而在第一和第二半导体结构的经处理的第一表面之间形成结合界面的设备。 用甲酸处理第一和第二半导体结构的表面的设备包括部分填充有液体甲酸和部分用甲酸蒸气填充的密封罐。 打开入口阀将罐连接到氮气源，并允许氮气流过罐。 打开出口阀允许甲酸蒸汽与氮气的混合物从罐中流出。 该混合物用于处理第一和第二半导体结构的表面。

    DEVICE FOR CENTERING WAFERS
    7.
    发明申请
    DEVICE FOR CENTERING WAFERS 有权
    用于中心波浪的装置

    公开(公告)号：US20100266373A1

    公开(公告)日：2010-10-21

    申请号：US12761044

    申请日：2010-04-15

    申请人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

    发明人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

    IPC分类号： H01L21/68

    CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

    摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.

    摘要翻译： 用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。 左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。 右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。 第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。 中间定心连杆在第一端包括第三对准臂。 第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。 凸轮板包括第一和第二直线凸轮轮廓。 第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

    SYSTEM AMD METHOD FOR SUBSTRATE HOLDING
    8.
    发明申请
    SYSTEM AMD METHOD FOR SUBSTRATE HOLDING 审中-公开
    系统AMD基板控制方法

    公开(公告)号：US20150206783A1

    公开(公告)日：2015-07-23

    申请号：US14597298

    申请日：2015-01-15

    申请人： HALE JOHNSON ,  GREGORY GEORGE

    发明人： HALE JOHNSON ,  GREGORY GEORGE

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6719 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/68728 ,  Y10T279/1291 ,  Y10T279/19 ,  Y10T279/1986 ,  Y10T279/21 ,  Y10T279/26

    摘要： A system for mechanically holding a substrate during processing includes a closeable processing chamber and an upper block assembly located inside the processing chamber and configured to hold a wafer via three mechanical holding assemblies. The three mechanical holding assemblies protrude above a cover of the wafer processing chamber and are configured to hold the wafer at an edge of the wafer and to be adjusted from outside of the processing chamber. Two of the mechanical holding assemblies are lockable in position relative to the wafer edge and one of the mechanical holding assemblies is configured to maintain a hold preload on the wafer edge via a preload mechanism.

    摘要翻译： 一种用于在处理过程中机械地保持衬底的系统包括可关闭的处理室和位于处理室内部的上部块组件，并被配置为通过三个机械保持组件保持晶片。 三个机械保持组件突出在晶片处理室的盖上方，并且被配置为将晶片保持在晶片的边缘并且从处理室的外部调节。 两个机械保持组件相对于晶片边缘可锁定就位，并且一个机械保持组件被配置为通过预加载机构保持晶片边缘上的保持预载。

    APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANCING AND CONTACT SENSING
    9.
    发明申请
    APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANCING AND CONTACT SENSING 有权
    半导体波浪平衡，力平衡和接触感应的装置和方法

    公开(公告)号：US20140318683A1

    公开(公告)日：2014-10-30

    申请号：US14330536

    申请日：2014-07-14

    申请人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    发明人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    IPC分类号： H01L21/68

    CPC分类号： H01L21/68 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

    摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.

    摘要翻译： 晶片接合装置包括下卡盘，上卡盘，处理室和三个调节机构。 三个调节机构围绕彼此间隔开的顶盖布置并且位于处理室的外部。 每个调节机构包括用于感测与上卡盘的接触的部件，用于调节上卡盘的预加载力的部件和用于调平上卡盘的部件。

    APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS
    10.
    发明申请
    APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS 有权
    用于对准和中心波形的装置和方法

    公开(公告)号：US20140319786A1

    公开(公告)日：2014-10-30

    申请号：US14330497

    申请日：2014-07-14

    申请人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    发明人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    IPC分类号： H01L21/68 ,  H01L21/683

    CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26

    摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

    摘要翻译： 用于定位和接合圆形晶片周界上的凹口的装置包括凹口定位部件和第一板。 凹口定位部件被构造成沿着第一轴线性地移动并且包括沿垂直于第一轴线的第二轴线延伸的前部细长部件，并且具有前表面，与前表面相对的后表面和从该前表面延伸的第一突出部 细长部件的前表面。 第一突起具有补充形成在圆形晶片的周边上的凹口的形状的形状。 当切口定位部件沿着第一轴线朝向圆形晶片的周边被驱动时，测量细长部件的后表面与第一板的前表面之间的距离，并且使用测量的距离的值来确定 第一突起与凹口的接合。