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公开(公告)号:US07554208B2
公开(公告)日:2009-06-30
申请号:US11756620
申请日:2007-05-31
申请人: Mark Chou , Michael Chen , Mou-Shiung Lin , Chien-Kang Chou
发明人: Mark Chou , Michael Chen , Mou-Shiung Lin , Chien-Kang Chou
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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2.
公开(公告)号:US20050017361A1
公开(公告)日:2005-01-27
申请号:US10796427
申请日:2004-03-09
申请人: Mou-Shiung Lin , Michael Chen , Chien Chou , Mark Chou
发明人: Mou-Shiung Lin , Michael Chen , Chien Chou , Mark Chou
IPC分类号: H01L23/485 , H01L23/522 , H01L23/532 , H01L23/48
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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公开(公告)号:US08529136B2
公开(公告)日:2013-09-10
申请号:US12384060
申请日:2009-03-30
申请人: Xiao-Jun Liu , Mark Chou
发明人: Xiao-Jun Liu , Mark Chou
IPC分类号: F16C33/32
CPC分类号: H01L21/67742 , F16C19/20 , F16C33/3713 , F16C33/586 , F16C33/62 , Y10T74/20329 , Y10T74/20335
摘要: A ball bearing having external surfaces coated with ceramic materials is provided. The raceways of the ball bearing may advantageously be formed of metal such as stainless steel. The ceramic coating acts as an insulator increasing the resistance of the ball bearing to heat within the ball bearing environment. The balls within the raceway of the ball bearing may advantageously be coated with a lubricant to decrease friction in the ball bearing because the insulating ceramic coating prevents the environmental heat from causing the degradation of the lubricant.
摘要翻译: 提供具有涂覆有陶瓷材料的外表面的滚珠轴承。 滚珠轴承的滚道可有利地由诸如不锈钢的金属形成。 陶瓷涂层充当绝缘体,增加球轴承在球轴承环境内加热的阻力。 滚珠轴承滚道内的滚珠可以有利地涂覆有润滑剂以降低滚珠轴承中的摩擦,因为绝缘陶瓷涂层防止环境热导致润滑剂的劣化。
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公开(公告)号:US08187965B2
公开(公告)日:2012-05-29
申请号:US11756621
申请日:2007-05-31
申请人: Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
发明人: Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
IPC分类号: H01L21/44
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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公开(公告)号:US07470997B2
公开(公告)日:2008-12-30
申请号:US10796427
申请日:2004-03-09
申请人: Mou-Shiung Lin , Michael Chen , Chien Kang Chou , Mark Chou
发明人: Mou-Shiung Lin , Michael Chen , Chien Kang Chou , Mark Chou
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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公开(公告)号:US20100247280A1
公开(公告)日:2010-09-30
申请号:US12384060
申请日:2009-03-30
申请人: Xiao-Jun Liu , Mark Chou
发明人: Xiao-Jun Liu , Mark Chou
IPC分类号: H01L21/683 , F16C33/62
CPC分类号: H01L21/67742 , F16C19/20 , F16C33/3713 , F16C33/586 , F16C33/62 , Y10T74/20329 , Y10T74/20335
摘要: A ball bearing having external surfaces coated with ceramic materials is provided. The raceways of the ball bearing may advantageously be formed of metal such as stainless steel. The ceramic coating acts as an insulator increasing the resistance of the ball bearing to heat within the ball bearing environment. The balls within the raceway of the ball bearing may advantageously be coated with a lubricant to decrease friction in the ball bearing because the insulating ceramic coating prevents the environmental heat from causing the degradation of the lubricant.
摘要翻译: 提供具有涂覆有陶瓷材料的外表面的滚珠轴承。 滚珠轴承的滚道可有利地由诸如不锈钢的金属形成。 陶瓷涂层充当绝缘体,增加球轴承在球轴承环境内加热的阻力。 滚珠轴承滚道内的滚珠可以有利地涂覆有润滑剂以降低滚珠轴承中的摩擦,因为绝缘陶瓷涂层防止环境热导致润滑剂的劣化。
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公开(公告)号:US20090053887A1
公开(公告)日:2009-02-26
申请号:US11756621
申请日:2007-05-31
申请人: Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
发明人: Mou-Shiung Lin , Michael Chen , Chien-Kang Chou , Mark Chou
IPC分类号: H01L21/44
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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公开(公告)号:US20070252281A1
公开(公告)日:2007-11-01
申请号:US11756620
申请日:2007-05-31
申请人: Mou-Shiung Lin , Michael Chen , Chien Chou , Mark Chou
发明人: Mou-Shiung Lin , Michael Chen , Chien Chou , Mark Chou
IPC分类号: H01L23/532
CPC分类号: H01L24/05 , H01L23/5222 , H01L23/53238 , H01L23/53252 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05157 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00
摘要: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
摘要翻译: 在本发明中,与金属盖的铜互连延伸到后钝化互连处理。 金属盖可以是铝。 可以在金属盖上形成金焊盘以允许引线接合和测试应用。 可以在集成电路上形成各种后钝化无源部件,并通过金属盖连接。
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公开(公告)号:US06840677B2
公开(公告)日:2005-01-11
申请号:US10424778
申请日:2003-04-29
CPC分类号: F16C33/102 , F16C17/02 , F16C33/043
摘要: A ceramic bearing structure is constructed to include an axle bush having an axially extended axle hole, and an axle pivoted to the axle hole of the axle bush, the axle bush having a radial open chamber extended across the axle hole. The radial open chamber diminishes the material of the axle bush, reduces the contact area between the axle and the axle bush, and provides a spacious lubrication grease accumulation chamber.
摘要翻译: 陶瓷轴承结构被构造成包括具有轴向延伸的轴孔的轴衬和枢转到轴衬的轴孔的轴,所述轴衬具有横跨所述轴孔延伸的径向开放室。 径向开放室减小了轴套的材料,减少了轴与轴套之间的接触面积,并提供了一个宽敞的润滑脂积存室。
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