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公开(公告)号：US20120006494A1
公开(公告)日：2012-01-12
申请号：US13220630
申请日：2011-08-29
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
IPC: B29C65/48
CPC classification number: H05K3/361 , H05K3/3494 , H05K2201/056 , H05K2203/0278 , Y10T29/49083 , Y10T29/49401 , Y10T29/5313 , Y10T29/53174
Abstract: A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.
Abstract translation: 用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置包括封闭的工作区域; 第一加热器组件，设置在封闭的工作区域内并沿第一路径移动; 弯曲机构，其设置在所述封闭的工作区域内并适于弯曲所述粘合的PCB; 第二加热器组件，其设置在所述封闭的工作区域内并沿着第二路径移动; 用于接收打印头组件的嵌套结构，所述嵌套结构可沿着第三路径移动; 以及用于控制加热器组件的操作的控制系统，弯曲机构和嵌套结构。 第一路径和第二路径被限制在封闭的工作区域内的区域，并且第三路径穿过封闭的工作区域的边界。
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公开(公告)号：US07967046B2
公开(公告)日：2011-06-28
申请号：US12193740
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
CPC classification number: B29C66/96 , B29C35/02 , B29C65/52 , B29C65/523 , B29C65/524 , B29C65/526 , B29C65/7841 , B29C66/54 , B29C66/8242 , B29C66/8322 , B29C66/8746 , B29C66/9221 , B29C66/9231 , B29C66/9241 , B29C66/9261 , B29C66/961 , B29C66/9672 , B29K2105/0079 , B29L2031/3425 , B29L2031/767 , Y10T156/17 , Y10T156/1744 , Y10T156/179 , Y10T156/1798
Abstract: The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.
Abstract translation: 本发明涉及一种用于组装机器的粘合剂施加装置，用于组装用于承载打印头集成电路的操作上部和下部部件。 应用装置包括板和分配机构，其包括粘合剂储存器，所述机构以密封和滑动方式与所述板可操作地接合，所述机构构造成当沿板滑动时将粘合剂分配到板上。 所述装置还包括用于沿着板滑动分配机构的移动机构，以及控制分配和移动机构的操作的控制系统。
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公开(公告)号：US20100043217A1
公开(公告)日：2010-02-25
申请号：US12193736
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
IPC: B23P19/00
CPC classification number: B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , Y10T29/5193 , Y10T29/5313 , Y10T29/5317 , Y10T29/53265
Abstract: The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is confinctionfigured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly.
Abstract translation: 本发明涉及一种用于将柔性印刷电路板（PCB）紧固到打印头组件的紧固装置。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 紧固装置包括支撑组件。 认证系统布置在支撑组件上，并且被配置成认证打印头组件。 至少一个接合组件被配置为将PCB粘合到打印头组件。 控制器被配置为在打印头组件的认证之后控制粘合组件以将PCB粘合到打印头组件。
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公开(公告)号：US08296933B2
公开(公告)日：2012-10-30
申请号：US12193736
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
CPC classification number: B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , Y10T29/5193 , Y10T29/5313 , Y10T29/5317 , Y10T29/53265
Abstract: The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is configured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly.
Abstract translation: 本发明涉及一种用于将柔性印刷电路板（PCB）紧固到打印头组件的紧固装置。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 紧固装置包括支撑组件。 认证系统被布置在支撑组件上并且被配置为认证打印头组件。 至少一个接合组件被配置为将PCB粘合到打印头组件。 控制器被配置为在打印头组件的认证之后控制粘合组件以将PCB粘合到打印头组件。
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公开(公告)号：US08020281B2
公开(公告)日：2011-09-20
申请号：US12193734
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
IPC: H05K13/04
CPC classification number: H05K3/361 , H05K3/3494 , H05K2201/056 , H05K2203/0278 , Y10T29/49083 , Y10T29/49401 , Y10T29/5313 , Y10T29/53174
Abstract: The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.
Abstract translation: 本发明涉及一种用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 接合装置包括支撑结构组件和布置在支撑结构组件上的第一加热器组件，以可沿着第一路径移动并且构造成将柔性PCB结合到打印头。 弯曲机构布置在支撑结构上，并被构造成弯曲粘合的PCB。 第二加热器组件布置在支撑结构组件上以可沿着第二路径移动并且被配置为将弯曲的PCB接合到打印头托架。 控制系统控制加热器组件和弯曲机构的操作。
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Patent Agency Ranking
6.发明授权Method for connecting a flexible printed circuit board (PCB) to a printhead assembly 有权将柔性印刷电路板（PCB）连接到打印头组件的方法公开(公告)号：US07877875B2
公开(公告)日：2011-02-01
申请号：US12193735
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
CPC classification number: H05K3/361 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , H01R12/62 , H05K1/0266 , H05K3/3494 , H05K2201/056 , H05K2201/09927 , H05K2203/0195 , H05K2203/0278 , H05K2203/1476 , Y10T29/42 , Y10T29/49083 , Y10T29/49117 , Y10T29/49401
Abstract: A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the steps of: adhering the PCB to a first surface of the printhead; receiving the printhead and PCB in a mechanical nest, and actuating the nest into a position below a heated platen assembly; heating the heated platen assembly and actuating the heated platen assembly rectilinearly towards the nest, the heated platen assembly thereby compressing the PCB and the printhead; actuating a forming bar assembly, provided adjacent the heated platen assembly, rectilinearly towards the nest, the forming bar assembly thereby bending a portion of the PCB extending beyond the printhead towards the printhead assembly; and heating a heater cartridge and actuating the heater cartridge rectilinearly towards the print head printhead in a direction substantially perpendicular to the direction in which the forming bar assembly is actuated, whereby the PCB is connected to the printhead and bonded to the printhead carrier.
Abstract translation: 一种用于将柔性印刷电路板（PCB）连接到打印头组件的方法，该打印头组件包括打印头托架和由托架承载的喷墨打印头。 该方法包括以下步骤：将PCB粘附到打印头的第一表面; 将所述打印头和PCB接收在机械嵌套中，并且将所述嵌套驱动到加热的压板组件下方的位置; 加热加热的压板组件并使加热的压板组件直线地朝向嵌套，加热的压板组件由此压缩PCB和打印头; 致动成形条组件，其邻近加热的压板组件直线地朝向嵌套，成形条组件从而将PCB的部分延伸超过打印头朝向打印头组件; 并且加热加热器盒并且在基本上垂直于成形条组件被致动的方向的方向上朝向打印头打印头直线地致动加热器盒，由此PCB连接到打印头并结合到打印头托架。
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公开(公告)号：US07721420B2
公开(公告)日：2010-05-25
申请号：US12193737
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
IPC: B23P19/00
CPC classification number: B23P19/04 , B41J2/175 , B41J29/02 , Y10T29/49025 , Y10T29/5313 , Y10T29/53265 , Y10T29/53465 , Y10T29/53478
Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.
Abstract translation: 提供了用于组装用于支撑打印头集成电路的载体的汇编器。 载体具有可操作地紧固在一起的上部和下部。 组装件包括支撑结构，其构造成在预紧固位置支撑下部;以及保持机构，其布置在支撑结构上，用于将上部部分保持在预紧固位置。 汇编器还包括布置在支撑结构上的移位机构，用于移动保持机构以使部件彼此有效对准;以及紧固装置，用于将部件紧固在一起。
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8.发明申请METHOD FOR CONNECTING A FLEXIBLE PRINTED CIRCUIT BOARD (PCB) TO A PRINTHEAD ASSEMBLY 有权将柔性印刷电路板（PCB）连接到印刷电路板组件的方法公开(公告)号：US20100043220A1
公开(公告)日：2010-02-25
申请号：US12193735
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , Stephen John Sleijpen , James Andrew , Craig Donald Strudwicke , William Granger , Mark Janos
IPC: H01R43/00
CPC classification number: H05K3/361 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , H01R12/62 , H05K1/0266 , H05K3/3494 , H05K2201/056 , H05K2201/09927 , H05K2203/0195 , H05K2203/0278 , H05K2203/1476 , Y10T29/42 , Y10T29/49083 , Y10T29/49117 , Y10T29/49401
Abstract: The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path.
Abstract translation: 本发明涉及一种将柔性印刷电路板（PCB）连接到打印头组件的方法。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 该方法包括使用可沿着第一路径移动的第一加热器组件将柔性PCB连接到打印头的步骤。 然后，连接的PCB然后弯曲。 该方法还包括使用可沿着第二路径移动的第二加热器组件将弯曲PCB连接到打印头托架的步骤。
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公开(公告)号：US07845068B2
公开(公告)日：2010-12-07
申请号：US12193738
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
IPC: B23P19/00
CPC classification number: B29C66/54 , B29C35/02 , B29C65/52 , B29C65/523 , B29C65/524 , B29C65/526 , B29C65/7841 , B29C66/8242 , B29C66/8322 , B29C66/8746 , B29C66/92211 , B29C66/9231 , B29C66/9241 , B29C66/9261 , B29C66/961 , B29C66/9672 , B29K2105/0079 , B29L2031/3425 , B29L2031/767 , Y10T29/5313
Abstract: The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.
Abstract translation: 本发明涉及一种用于组装用于集成电路的载体的方法。 载体具有上部和下部。 该方法包括以下步骤：将下部部分定位在保持在底部夹具容器中的底部夹持部分中，将顶部夹持部分定位在顶部夹具容器中，夹紧部分被配置为以锁定方式彼此接合，并将 上部在第一把手。 该方法还具有以下步骤：将粘合剂施加到至少一个部件，用第一夹持器将所述上部部分压到由底部夹具容器保持的底部上，同时用第二夹持器取回顶部夹持部分， 顶部夹紧部分到底部夹具部分，第二夹具将部件夹紧在一起。
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10.发明申请公开(公告)号：US20100043218A1
公开(公告)日：2010-02-25
申请号：US12193737
申请日：2008-08-19
Applicant: Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
Inventor： Stephen Richard O'Farrell , Jan Waszczuk , David Bernardi , Toby Desmond Oste , Mark Janos , William Granger
IPC: B23P19/00
CPC classification number: B23P19/04 , B41J2/175 , B41J29/02 , Y10T29/49025 , Y10T29/5313 , Y10T29/53265 , Y10T29/53465 , Y10T29/53478
Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.
Abstract translation: 提供了用于组装用于支撑打印头集成电路的载体的汇编器。 载体具有可操作地紧固在一起的上部和下部。 组装件包括支撑结构，其构造成在预紧固位置支撑下部;以及保持机构，其布置在支撑结构上，用于将上部部分保持在预紧固位置。 汇编器还包括布置在支撑结构上的移位机构，用于移动保持机构以使部件彼此有效对准;以及紧固装置，用于将部件紧固在一起。
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