Gated resonant tunneling device and fabricating method thereof
    3.
    发明授权
    Gated resonant tunneling device and fabricating method thereof 失效
    门式谐振隧穿装置及其制造方法

    公开(公告)号:US5962864A

    公开(公告)日:1999-10-05

    申请号:US912925

    申请日:1997-08-15

    摘要: A semiconductor device comprises mutually separated first and third barrier layers interposed between the first and second patterned terminals. The device operates by the resonant tunneling of carriers from the second terminal to the first terminal. The first terminal is patterned into a section and a plurality of layers comprising the mutually separated first and second barrier layers are formed on top of the first terminal. A second terminal is then formed on top of the plurality of semiconductor layers. The second terminal is then patterned so that it only overlies the first terminal in confined region. A front-gate is then formed on top of the patterned second terminal.

    摘要翻译: 半导体器件包括介于第一和第二图案化端子之间的相互分离的第一和第三阻挡层。 该装置通过从第二端子到第一端子的载流子的谐振隧穿来工作。 第一端子被图案化为一部分,并且包括相互分离的第一和第二阻挡层的多个层形成在第一端子的顶部上。 然后在多个半导体层的顶部上形成第二端子。 然后将第二端子图案化,使得其仅在有限区域中的第一端子上方覆盖。 然后在图案化的第二端子的顶部上形成前栅极。