摘要:
An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.
摘要:
A via drilling system is preferably constructed to process one target at a time. The via drilling system preferably provides a relatively small footprint for the via drilling system, relatively small moment arms between via drilling system components, a relatively short stiffness loop, and a relatively fast processing time for a target. Multiple tools are preferably provided to perform multiple operations substantially simultaneously on the target.
摘要:
A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.
摘要:
A rigid support structure allows for faster and more accurate positioning of axially adjustable optical components in a laser processing system. Vibrational and thermal stability is improved when an optics assembly is housed in a rigid air bearing sleeve that is mounted to a support structure above a specimen stage.
摘要:
A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.
摘要:
A laser beam propagates along a beam axis for incidence on a work surface mounted on a support. The support operatively connects to a positioning system moving at least one of the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. At least one force reaction compensation motor is located in a common force plane with, and as close as possible to, a corresponding stage motor. Any moment arm between the compensation motor and the corresponding stage motor is reduced or eliminated, allowing the compensation motor to directly couple and react to stage forces with virtually zero moment arm. Six degrees of freedom can be controlled with only four motors, since each compensation motor is directly coupled and aligned to a corresponding stage motor.
摘要:
A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.
摘要:
An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.
摘要:
A rigid support structure allows for faster and more accurate positioning of axially adjustable optical components in a laser processing system. Vibrational and thermal stability is improved when an optics assembly is housed in a rigid air bearing sleeve that is mounted to a support structure above a specimen stage.
摘要:
A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.