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公开(公告)号：US20110164384A1
公开(公告)日：2011-07-07
申请号：US12683006
申请日：2010-01-06
CPC分类号： F28D1/05366 , F28D1/024 , F28F1/126 , F28F1/40 , H05K7/20172
摘要： A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.
摘要翻译： 具有气流矫直热交换器的串联风扇系统从气流中除去热量，同时提供最佳气流压力。 串联风扇系统包括第一风扇组件和第二风扇组件，其中每个风扇组件具有入口面和出口面，并且包括至少一个风扇，其构造成将空气流从入口面推到出口面。 串联风扇系统还包括联接在第一和第二风扇组件之间的热交换器，其中热交换器包括至少一个翅片阵列和一个或多个热管。 翅片阵列和热管组合被构造成从流过热交换器的空气流中吸取热量，并且使空气的流动变平，使得流动垂直于第二风扇组件的入口面。
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2.发明申请LIQUID-COOLED RACK WITH PRE-COOLER AND POST-COOLER HEAT EXCHANGERS USED FOR EMI SHIELDING 有权具有用于EMI屏蔽的预冷却器和后冷却器热交换器的液体冷却架公开(公告)号：US20100033921A1
公开(公告)日：2010-02-11
申请号：US12188734
申请日：2008-08-08
CPC分类号： H05K7/20781
摘要： A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.
摘要翻译： 用于机架式服务器的冷却系统包括设置在机架安装服务器内并被配置为产生通过机架安装服务器的气流的风扇和设置在机架安装服务器内的气流穿过的路径中的热交换器 机架式服务器。 热交换器包括液体循环路径结构和气流路径结构。 气流路径结构用于屏蔽电磁干扰。
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3.发明申请公开(公告)号：US20100032142A1
公开(公告)日：2010-02-11
申请号：US12189577
申请日：2008-08-11
CPC分类号： G05D23/1925 , H05K7/20781 , H05K7/20836
摘要： A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, a pump connected to the liquid cooling line, at least one heat exchanger connected to the liquid cooling line, a fan module, a control module connected to the fan module and the pump, a feedback module connected to the control module and comprising a sensor configured to measure a feedback control signal, where the control module is configured to adjust an air flow rate through the fan module or a liquid coolant flow rate through the pump based on the feedback control signal.
摘要翻译： 一种用于包括至少一个叶片的机架安装服务器的冷却系统，包括液体冷却管线，连接到液体冷却管线的泵，连接到液体冷却管线的至少一个热交换器，风扇模块，连接到 风扇模块和泵，连接到控制模块的反馈模块，包括被配置为测量反馈控制信号的传感器，其中控制模块被配置为调节通过风扇模块的空气流速或通过液体冷却剂流速 该泵基于反馈控制信号。
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公开(公告)号：US07266964B2
公开(公告)日：2007-09-11
申请号：US10794730
申请日：2004-03-04
申请人： Marlin R. Vogel , Shlomo Novotny , Mario Lee
发明人： Marlin R. Vogel , Shlomo Novotny , Mario Lee
CPC分类号： H05K7/20745 , F24F11/0001 , F24F2221/40
摘要： A method and system of deflecting air circulated in a data center room are disclosed. A method for controlling air circulation within a room having an aisle between racks with computer systems mounted thereon comprises supplying cooling air to computer systems in the racks via holes in a floor of the room and using a deflector to reduce flow of cooling air along the aisle toward an air intake of a cooling unit without passing the computer systems.
摘要翻译： 公开了一种使数据中心室内循环的空气偏转的方法和系统。 一种用于控制在具有安装在其上的计算机系统的机架之间的具有通道的房间中的空气循环的方法包括：通过室内的孔中的孔将冷却空气供给到机架中的计算机系统，并且使用偏转器来减少沿着通道的冷却空气流 朝向冷却单元的进气口，而不通过计算机系统。
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公开(公告)号：US5380956A
公开(公告)日：1995-01-10
申请号：US87950
申请日：1993-07-06
申请人： Mike C. Loo , Marlin R. Vogel
发明人： Mike C. Loo , Marlin R. Vogel
IPC分类号： H01L23/473 , H05K7/20 , H05K1/00
CPC分类号： H01L23/473 , H01L2924/0002
摘要： A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips. A gasket is used between each substrate. The gasket is made if a Z-axis elastromeric material that is impervious to liquid and therefore directs the flow of the coolant in the module and makes the module liquid tight. The material also is conductive in the Z direction, but not the X or Y direction, thereby making electrical communication between the chips on different substrate levels possible. The module is intended to be attached to a circuit board, thus simplifying the layout of liquid cooled chips on the board.
摘要翻译： 公开了一种用于半导体芯片的液体冷却模块。 该模块包括多个基板，每个基板至少包含一个芯片。 衬底布置在模块中，使得当冷却剂流过模块时，冷却剂暴露于芯片的顶部和底部表面。 在每个基板之间使用垫圈。 如果使用不透液体的Z轴弹性体材料制造垫圈，因此引导冷却剂在模块中的流动，并使模块液体密封。 该材料也在Z方向上导电，而不是X或Y方向，从而使得在不同衬底层上的芯片之间的电连通成为可能。 该模块旨在连接到电路板，从而简化了板上液体冷却芯片的布局。
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公开(公告)号：US08085540B2
公开(公告)日：2011-12-27
申请号：US12683006
申请日：2010-01-06
CPC分类号： F28D1/05366 , F28D1/024 , F28F1/126 , F28F1/40 , H05K7/20172
摘要： A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.
摘要翻译： 具有气流矫直热交换器的串联风扇系统从气流中除去热量，同时提供最佳气流压力。 串联风扇系统包括第一风扇组件和第二风扇组件，其中每个风扇组件具有入口面和出口面，并且包括至少一个风扇，其构造成将空气流从入口面推到出口面。 串联风扇系统还包括联接在第一和第二风扇组件之间的热交换器，其中热交换器包括至少一个翅片阵列和一个或多个热管。 翅片阵列和热管组合被构造成从流过热交换器的空气流中吸取热量，并且使空气的流动变平，使得流动垂直于第二风扇组件的入口面。
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公开(公告)号：US06317326B1
公开(公告)日：2001-11-13
申请号：US09661969
申请日：2000-09-14
申请人： Marlin R. Vogel , David G. Love
发明人： Marlin R. Vogel , David G. Love
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： An integrated circuit device package is integrated with a heat dissipation member to reduce the number of junctions in a packaged integrated circuit device. For example, the integrated circuit device package may include a substrate and a thermally conductive lid coupled to a first surface of the substrate, forming a closed cavity which encloses an integrated circuit die. The thermally conductive lid may be integrated with the heat dissipation member.
摘要翻译： 集成电路器件封装与散热构件集成以减少封装集成电路器件中的结的数量。 例如，集成电路器件封装可以包括衬底和耦合到衬底的第一表面的导热盖，形成封闭集成电路管芯的闭合腔。 导热盖可与散热构件一体化。
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公开(公告)号：US20100059201A1
公开(公告)日：2010-03-11
申请号：US12208744
申请日：2008-09-11
CPC分类号： F28F9/0075 , H05K7/20781
摘要： A liquid cooled rack with compliant heat exchanger support structure includes a rack having a rigid frame for supporting electronic components therein, a plurality of flexible supports connected to the rigid frame, and a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports. The plurality of flexible supports are connected to the heat exchanger and configured to flexibly support the liquid-fed heat exchanger with respect to the rigid frame.
摘要翻译： 具有顺从热交换器支撑结构的液冷机架包括具有用于在其中支撑电子部件的刚性框架的齿条，连接到刚性框架的多个柔性支撑件以及经由多个柔性装置安装在机架内的液体供给热交换器 支持。 多个柔性支撑件连接到热交换器并且构造成相对于刚性框架柔性地支撑液体供给的热交换器。
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9.发明申请LIQUID-COOLED RACK WITH OPTIMIZED RACK HEAT EXCHANGER DESIGN FOR NON-UNIFORM POWER DISSIPATION 有权液体冷却机架与优化的机架式换热器设计用于非均匀功率放电公开(公告)号：US20100033923A1
公开(公告)日：2010-02-11
申请号：US12187190
申请日：2008-08-06
IPC分类号： G06F1/20
CPC分类号： H05K7/20736
摘要： A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server
摘要翻译： 一种用于包括至少一个叶片和系统壳体的机架安装服务器的冷却系统包括液体冷却管线，连接到液体冷却管线的至少一个热交换器，并且包括被分成多个部分中的一个或多个部分的多个翅片 的翅片，其中所述多个翅片的翅片密度在所述一个或多个部分上变化，并且多个风扇构造成吹送空气通过所述至少一个热交换器并且冷却所述机架安装服务器中的所述至少一个叶片
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10.发明申请LIQUID COOLED RACK WITH OPTIMIZED LIQUID FLOW PATH DRIVEN BY ELECTRONIC COOLING DEMAND 审中-公开液体冷却机架采用电子冷却需求驱动的优化液体流路公开(公告)号：US20100032140A1
公开(公告)日：2010-02-11
申请号：US12187209
申请日：2008-08-06
CPC分类号： H05K7/20736 , F28D15/00 , G05D23/1919 , H05K7/20836
摘要： A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, at least one adjustable valve connected to the liquid cooling line, at least one heat exchanger connected to the at least one adjustable valve, a control module connected to the at least one valve, and a feedback module connected to the control module and including a sensor configured to measure a feedback control signal. The control module is configured to adjust the at least one adjustable valve and a flow rate of liquid through the liquid cooling line based on a feedback control signal measured by the sensor.
摘要翻译： 一种用于包括至少一个叶片的机架安装式服务器的冷却系统包括液体冷却管线，连接到液体冷却管线的至少一个可调节阀，连接到所述至少一个可调节阀门的至少一个热交换器，连接到控制模块 至少一个阀，以及连接到控制模块的反馈模块，并且包括配置成测量反馈控制信号的传感器。 控制模块被配置为基于由传感器测量的反馈控制信号来调节至少一个可调节阀和液体通过液体冷却管线的流速。
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