公开(公告)号：US06309575B1

公开(公告)日：2001-10-30

申请号：US09291131

申请日：1999-04-12

申请人： Lynda Boutin ,  Martial A. Letourneau ,  Real Tetreault

发明人： Lynda Boutin ,  Martial A. Letourneau ,  Real Tetreault

IPC分类号： B29C7070

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/4554

摘要： A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.

摘要翻译： 公开了一种方法和所得到的集成电路封装，用于使用传统模制技术以已知为空腔封装的形式封装集成电路芯片。 每个芯片定位在由层叠体或印刷线路板包围的空腔内，该层叠体或印刷线路板提供一组触点。 触点提供与外部电路板/卡的连接，并且触点也内部间接连接到芯片。 空腔，芯片和层压板，接触件和互连件中的一些位于载体的同一侧。 液体塑料通过模具中的浇道通过载体底部的浇口被迫进入空腔中，以封装所有这些组分。

公开(公告)号：US06547452B1

公开(公告)日：2003-04-15

申请号：US09568978

申请日：2000-05-11

申请人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B636

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4255 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

摘要翻译： 用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。 包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。 包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。 保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征 在基板上。 柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

公开(公告)号：US5939778A

公开(公告)日：1999-08-17

申请号：US889378

申请日：1997-07-08

申请人： Lynda Boutin ,  Martial A. Letourneau ,  Real Tetreault

发明人： Lynda Boutin ,  Martial A. Letourneau ,  Real Tetreault

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C70/70 ,  B29L31/34 ,  H01L21/56 ,  H01L23/02 ,  H01L23/12 ,  H01L23/24 ,  H01L23/29 ,  H01L23/50

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181

摘要： A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.

摘要翻译： 公开了一种方法和所得到的集成电路封装，用于使用传统模制技术以已知为空腔封装的形式封装集成电路芯片。 每个芯片定位在由层叠体或印刷线路板包围的空腔内，该层叠体或印刷线路板提供一组触点。 触点提供与外部电路板/卡的连接，并且触点也内部间接连接到芯片。 空腔，芯片和层压板，接触件和互连件中的一些位于载体的同一侧。 液体塑料通过模具中的浇道通过载体底部的浇口被迫进入空腔中，以封装所有这些组分。