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公开(公告)号：US06988882B2
公开(公告)日：2006-01-24
申请号：US11209156
申请日：2005-08-22
IPC分类号： A23P1/00
CPC分类号： H01L21/565 , H01L21/563 , H01L23/3128 , H01L2224/16 , H01L2224/83104 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2224/0401
摘要： A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting the first and second cavities. The first cavity is adapted to enclose the integrated circuit chip on the substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.
摘要翻译： 一种用于封装和底部填充集成电路芯片组件的方法，模具和装置。 模具具有第一部分和第二部分，其中第一部分具有第一和第二空腔以及互连第一和第二空腔的至少一个通道。 第一腔适于将集成电路芯片封装在基板上。 夹持力被施加到模具的第一和第二部分，以将基板夹在它们之间，并与位于第一腔中的集成电路芯片夹紧。 从第一个腔排出空气。 密封剂在远离通道的连接点的第一部分中的位置被注入到第一部分的第一腔中，使得密封剂在集成电路芯片周围和下方流动并且通过通道进入第二腔，由此底部填充， 封装集成电路组件。
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2.发明授权公开(公告)号：US06547452B1
公开(公告)日：2003-04-15
申请号：US09568978
申请日：2000-05-11
申请人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
发明人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
IPC分类号： G02B636
CPC分类号： B29C45/14655 , B29C45/14065 , G02B6/4201 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4239 , G02B6/4255 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.
摘要翻译： 用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。 包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。 包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。 保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征 在基板上。 柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。
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公开(公告)号：US06956296B2
公开(公告)日：2005-10-18
申请号：US10681513
申请日：2003-10-08
CPC分类号： H01L21/565 , H01L21/563 , H01L23/3128 , H01L2224/16 , H01L2224/83104 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2224/0401
摘要： A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.
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公开(公告)号：US06822875B2
公开(公告)日：2004-11-23
申请号：US10281036
申请日：2002-10-24
申请人： Benson Chan , Paul Francis Fortier , Ladd William Freitag , Gary T. Galli , Francois Guindon , Glen Walden Johnson , Martial Letourneau , John H. Sherman , Real Tetreault
发明人： Benson Chan , Paul Francis Fortier , Ladd William Freitag , Gary T. Galli , Francois Guindon , Glen Walden Johnson , Martial Letourneau , John H. Sherman , Real Tetreault
IPC分类号： H05K710
CPC分类号： H01L23/3737 , G02B6/4201 , G02B6/421 , G02B6/4245 , G02B6/4249 , G02B6/4253 , G02B6/4255 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H01L23/3733 , H01L2224/32057 , H01L2224/45144 , H01L2224/83385 , H01L2924/01079 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
摘要翻译： 一种用于收发机光电模块的散热器，包括双重直接热路径以及封闭多个芯片的结构，该芯片具有将发射机和接收机芯片彼此电隔离的中心腹板。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。
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公开(公告)号：US06508595B1
公开(公告)日：2003-01-21
申请号：US09569029
申请日：2000-05-11
申请人： Benson Chan , Paul Francis Fortier , Ladd William Freitag , Gary T. Galli , Francois Guindon , Glen Walden Johnson , Martial Letourneau , John H. Sherman , Real Tetreault
发明人： Benson Chan , Paul Francis Fortier , Ladd William Freitag , Gary T. Galli , Francois Guindon , Glen Walden Johnson , Martial Letourneau , John H. Sherman , Real Tetreault
IPC分类号： G02B642
CPC分类号： H01L23/3737 , G02B6/4201 , G02B6/421 , G02B6/4245 , G02B6/4249 , G02B6/4253 , G02B6/4255 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H01L23/3733 , H01L2224/32057 , H01L2224/45144 , H01L2224/83385 , H01L2924/01079 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
摘要翻译： 一种用于收发器光电模块的散热器，包括双重直接热路径和结构，其包围具有将发射器和接收器芯片彼此电隔离的中心腹板的多个芯片。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。
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公开(公告)号：US06656773B2
公开(公告)日：2003-12-02
申请号：US10167635
申请日：2002-06-12
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L21/563 , H01L23/3128 , H01L2224/16 , H01L2224/83104 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2224/0401
摘要： There is provided a method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly including an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means, e.g., a clamp, applies a clamping force to the first and the second portions of the mold to clamp the substrate between the first and second portions with the integrated circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.
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公开(公告)号：US06309575B1
公开(公告)日：2001-10-30
申请号：US09291131
申请日：1999-04-12
IPC分类号： B29C7070
CPC分类号： H01L21/565 , H01L23/3128 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2924/00014 , H01L2924/12033 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2224/4554
摘要： A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.
摘要翻译： 公开了一种方法和所得到的集成电路封装，用于使用传统模制技术以已知为空腔封装的形式封装集成电路芯片。 每个芯片定位在由层叠体或印刷线路板包围的空腔内，该层叠体或印刷线路板提供一组触点。 触点提供与外部电路板/卡的连接，并且触点也内部间接连接到芯片。 空腔，芯片和层压板，接触件和互连件中的一些位于载体的同一侧。 液体塑料通过模具中的浇道通过载体底部的浇口被迫进入空腔中，以封装所有这些组分。
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公开(公告)号：US20050275091A1
公开(公告)日：2005-12-15
申请号：US11209156
申请日：2005-08-22
CPC分类号： H01L21/565 , H01L21/563 , H01L23/3128 , H01L2224/16 , H01L2224/83104 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2224/0401
摘要： A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. A clamping force is applied to the first and second portions of the mold to clamp the substrate between them with the integrated circuit chip located in the first cavity. Vents exhaust air from the first cavity. Encapsulant is injected into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the second cavity to thereby underfill and encapsulate the integrated circuit assembly.
摘要翻译： 一种用于封装和底部填充集成电路芯片组件的方法，模具和装置。 模具具有第一部分和第二部分，其中第一部分具有第一和第二空腔以及互连所述第一和第二空腔的至少一个通道。 第一腔适于将所述集成电路芯片封装在所述衬底上。 夹持力被施加到模具的第一和第二部分，以将基板夹在它们之间，并与位于第一腔中的集成电路芯片夹紧。 从第一个腔排出空气。 密封剂在远离通道的连接点的第一部分中的位置被注入到第一部分的第一腔中，使得密封剂在集成电路芯片周围和下方流动并且通过通道进入第二腔，由此底部填充， 封装集成电路组件。
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公开(公告)号：US5939778A
公开(公告)日：1999-08-17
申请号：US889378
申请日：1997-07-08
IPC分类号： B29C45/26 , B29C45/02 , B29C70/70 , B29L31/34 , H01L21/56 , H01L23/02 , H01L23/12 , H01L23/24 , H01L23/29 , H01L23/50
CPC分类号： H01L21/565 , H01L23/3128 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L24/48 , H01L2924/00014 , H01L2924/12033 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181
摘要： A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.
摘要翻译： 公开了一种方法和所得到的集成电路封装，用于使用传统模制技术以已知为空腔封装的形式封装集成电路芯片。 每个芯片定位在由层叠体或印刷线路板包围的空腔内，该层叠体或印刷线路板提供一组触点。 触点提供与外部电路板/卡的连接，并且触点也内部间接连接到芯片。 空腔，芯片和层压板，接触件和互连件中的一些位于载体的同一侧。 液体塑料通过模具中的浇道通过载体底部的浇口被迫进入空腔中，以封装所有这些组分。
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