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公开(公告)号：US20120108129A1
公开(公告)日：2012-05-03
申请号：US13282518
申请日：2011-10-27
Applicant: Andri E. Elia , Olaf Norbert Kirchner , David V. Mesaros , Martyn Douglas Wakeman , Shengmei Yuan
Inventor： Andri E. Elia , Olaf Norbert Kirchner , David V. Mesaros , Martyn Douglas Wakeman , Shengmei Yuan
CPC classification number: B32B27/34 , B29C45/0001 , B29C45/14786 , B29K2077/00 , B29K2677/00 , B29K2709/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/12 , B32B2307/306 , B32B2307/308 , B32B2307/546 , B32B2605/00 , C08J5/043 , C08J2377/06 , C08K7/20 , C08L77/06 , C08L2205/02 , Y10T428/249921 , Y10T428/249924 , Y10T428/24994 , Y10T428/31623 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2041 , Y10T442/2631 , Y10T442/2721 , Y10T442/2762 , Y10T442/2861 , Y10T442/2984 , Y10T442/2992 , Y10T442/674
Abstract: Disclosed herein are composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C. and comprise a fibrous material being impregnated with a matrix resin composition, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.
Abstract translation: 本文公开了复合结构及其制备方法。 所公开的复合结构包括具有由表面树脂组合物制成的至少一部分的表面，所述表面树脂组合物选自聚酰胺组合物，所述聚酰胺组合物包含熔点为至少250℃的两种或更多种完全脂族聚酰胺的共混物，并且包含纤维材料 用基质树脂组合物浸渍，并且其中基质树脂组合物选自包含熔点至少为250℃的一种或多种完全脂族聚酰胺的聚酰胺组合物。
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2.发明申请OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION 审中-公开过氧化物复合材料结构及其制备方法公开(公告)号：US20120108122A1
公开(公告)日：2012-05-03
申请号：US13282516
申请日：2011-10-27
Applicant: Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Shengmei Yuan
Inventor： Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Shengmei Yuan
CPC classification number: B32B27/34 , B29C45/0001 , B29C45/14786 , B29K2077/00 , B29K2677/00 , B29K2709/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/12 , B32B2307/306 , B32B2307/308 , B32B2307/546 , B32B2605/00 , C08J5/043 , C08J2377/06 , C08K7/20 , C08L77/06 , C08L2205/02 , Y10T428/249921 , Y10T428/249924 , Y10T428/24994 , Y10T428/31623 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2041 , Y10T442/2631 , Y10T442/2721 , Y10T442/2762 , Y10T442/2861 , Y10T442/2984 , Y10T442/2992 , Y10T442/674
Abstract: Disclosed are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component. The surface resin composition is selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected from group (I) polyamides having a melting point of less than 230° C., and (B) one or more polyamides selected from group (II) polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is selected from (B) or blends of (A) and (B).
Abstract translation: 公开了包覆成型的聚酰胺复合材料结构及其制备方法。 所公开的包覆成型的复合结构包括：i）具有表面的第一部件，该表面具有由表面树脂组合物制成的至少一部分，并且包含纤维材料，ii）包含二次成型树脂组合物的第二组分， 分量在所述第一部件的表面的至少一部分上。 表面树脂组合物选自聚酰胺组合物，其包含（A）选自熔点低于230℃的（I）组聚酰胺的一种或多种完全脂族聚酰胺和（B）选自一种或多种聚酰胺的共混物的共混物 （II）聚酰胺，其熔点至少为250℃，其中基质树脂组合物选自（B）或（A）和（B）的共混物。
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3.发明申请公开(公告)号：US20100291819A1
公开(公告)日：2010-11-18
申请号：US12775575
申请日：2010-05-07
Applicant: Olaf Norbert Kirchner , Martyn Douglas Wakeman , Andri E. Elia
Inventor： Olaf Norbert Kirchner , Martyn Douglas Wakeman , Andri E. Elia
CPC classification number: C08J5/04 , B29C70/00 , B29C70/68 , B29K2077/00 , B32B5/022 , B32B5/024 , B32B5/08 , B32B5/26 , B32B17/04 , B32B27/12 , B32B27/18 , B32B27/34 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/06 , B32B2262/08 , B32B2262/101 , B32B2262/103 , B32B2262/105 , B32B2262/106 , B32B2262/14 , B32B2270/00 , B32B2307/306 , B32B2307/50 , B32B2307/714 , B32B2307/718 , B32B2419/00 , B32B2457/00 , B32B2457/12 , B32B2509/00 , B32B2605/08 , B32B2605/10 , B32B2605/18 , C08J2377/00 , Y10T428/249921 , Y10T428/249924 , Y10T428/249939 , Y10T428/24994 , Y10T442/20 , Y10T442/2041 , Y10T442/2762 , Y10T442/2902 , Y10T442/2984 , Y10T442/2992
Abstract: The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise a first component having a surface, which surface has at least a portion made of a surface polyamide resin composition, and having a fibrous material impregnated with a matrix resin composition, and comprise a second component comprising an overmolding resin composition. The second component is adhered to the first component over at least a portion of the surface of said first component. One of the overmolding resin composition and the surface polyamide resin composition is made of a polyamide composition comprising a blend of one or more semi-aromatic polyamides (A) and one or more fully aliphatic polyamides (B) and the other of the overmolding resin composition and the surface polyamide resin composition is made of one or more polyamides.
Abstract translation: 本发明涉及包覆成型聚酰胺复合材料结构及其制备方法。 所公开的包覆成型的复合结构包括具有表面的第一部件，该表面具有由表面聚酰胺树脂组合物制成的至少一部分，并且具有浸渍有基质树脂组合物的纤维材料，并且包含第二组分，其包含包覆成型树脂组合物 。 第二部件在所述第一部件的表面的至少一部分上附着到第一部件上。 包覆成型树脂组合物和表面聚酰胺树脂组合物中的一种由包含一种或多种半芳族聚酰胺（A）和一种或多种完全脂族聚酰胺（B）的共混物和另一种包覆成型树脂组合物的聚酰胺组合物制成 表面聚酰胺树脂组合物由一种或多种聚酰胺制成。
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公开(公告)号：US09597861B2
公开(公告)日：2017-03-21
申请号：US13282545
申请日：2011-10-27
Applicant: Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Shengmei Yuan
Inventor： Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Shengmei Yuan
IPC: B32B27/12 , B32B27/34 , B32B5/02 , B32B5/26 , C08J5/04 , C08L77/06 , B29C45/00 , B29C45/14 , B29K77/00 , B29K677/00 , B29K709/08
CPC classification number: B32B27/34 , B29C45/0001 , B29C45/14786 , B29K2077/00 , B29K2677/00 , B29K2709/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/12 , B32B2307/306 , B32B2307/308 , B32B2307/546 , B32B2605/00 , C08J5/043 , C08J2377/06 , C08K7/20 , C08L77/06 , C08L2205/02 , Y10T428/249921 , Y10T428/249924 , Y10T428/24994 , Y10T428/31623 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2041 , Y10T442/2631 , Y10T442/2721 , Y10T442/2762 , Y10T442/2861 , Y10T442/2984 , Y10T442/2992 , Y10T442/674
Abstract: Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.
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5.发明申请OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION 审中-公开过氧化物复合材料结构及其制备方法公开(公告)号：US20120108136A1
公开(公告)日：2012-05-03
申请号：US13282511
申请日：2011-10-27
Applicant: Andri E. Elia , Olaf Norbert Kirchner , David V. Mesaros , Martyn Douglas Wakeman , Shengmei Yuan
Inventor： Andri E. Elia , Olaf Norbert Kirchner , David V. Mesaros , Martyn Douglas Wakeman , Shengmei Yuan
CPC classification number: B32B27/34 , B29C45/0001 , B29C45/14786 , B29K2077/00 , B29K2677/00 , B29K2709/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/12 , B32B2307/306 , B32B2307/308 , B32B2307/546 , B32B2605/00 , C08J5/043 , C08J2377/06 , C08K7/20 , C08L77/06 , C08L2205/02 , Y10T428/249921 , Y10T428/249924 , Y10T428/24994 , Y10T428/31623 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2041 , Y10T442/2631 , Y10T442/2721 , Y10T442/2762 , Y10T442/2861 , Y10T442/2984 , Y10T442/2992 , Y10T442/674
Abstract: Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.
Abstract translation: 本文公开了包覆成型的聚酰胺复合材料结构及其制备方法。 所公开的包覆成型的复合结构包括：i）具有表面的第一部件，其表面的至少一部分由表面树脂组合物制成，所述表面树脂组合物选自聚酰胺组合物，所述聚酰胺组合物包含至少具有熔点的两种或更多种完全脂族聚酰胺的共混物 250℃，并且包括用基质树脂组合物浸渍的纤维材料，ii）包含包覆成型树脂组合物的第二组分，在所述第一组分的至少一部分表面上附着到所述第一组分上，并且其中 基质树脂组合物选自包含熔点至少为250℃的一种或多种完全脂族聚酰胺的聚酰胺组合物
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Patent Agency Ranking
公开(公告)号：US20130004696A1
公开(公告)日：2013-01-03
申请号：US13534081
申请日：2012-06-27
Applicant: Pieter Theodorus Gerardus Volgers , Martyn Douglas Wakeman
IPC: B65D65/28
CPC classification number: B60N2/42709 , B60N2/682 , Y10T428/15
Abstract: A component made of a thermoplastic composite material comprises fibers and thermoplastic polymer wherein the has a hole defined therein for receiving a member to form a connection, and reinforcement provided in the region of the hole and arranged to define a predetermined rip-through path to be followed by the member in the event that a failure load is applied.
Abstract translation: 由热塑性复合材料制成的部件包括纤维和热塑性聚合物，其中具有限定在其中的用于接纳构件以形成连接的孔，以及设置在孔的区域中并且布置成限定预定的穿透路径的加强层 在发生故障加载的情况下，该成员接着是该成员。
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7.发明申请HEAT RESISTANT SEMI-AROMATIC POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION 审中-公开耐热半芳族聚酰胺复合结构及其制备方法公开(公告)号：US20110028060A1
公开(公告)日：2011-02-03
申请号：US12846247
申请日：2010-07-29
Applicant: Martyn Douglas Wakeman , Olaf Norbert Kirchner , Shengmei Yuan
Inventor： Martyn Douglas Wakeman , Olaf Norbert Kirchner , Shengmei Yuan
CPC classification number: C08L77/06 , C08J5/04 , C08J5/043 , C08J5/10 , C08J2377/00 , C08K5/053 , C08K7/02 , C08L77/00 , Y10T442/20 , Y10T442/259 , Y10T442/2631 , Y10T442/2762 , Y10T442/2893 , Y10T442/2984 , Y10T442/2992
Abstract: The invention relates to the field of composite structures comprising a fibrous material, a matrix resin composition and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more semi-aromatic polyamides and one or more polyhydric alcohols.
Abstract translation: 本发明涉及包含纤维材料，基质树脂组合物和由表面树脂组合物制成的部分的复合结构领域，其中组合物选自包含一种或多种半芳族聚酰胺和一种或多种多元醇的组合物。
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8.发明授权公开(公告)号：US08334046B2
公开(公告)日：2012-12-18
申请号：US12775575
申请日：2010-05-07
Applicant: Olaf Norbert Kirchner , Martyn Douglas Wakeman , Andri E. Elia
Inventor： Olaf Norbert Kirchner , Martyn Douglas Wakeman , Andri E. Elia
CPC classification number: C08J5/04 , B29C70/00 , B29C70/68 , B29K2077/00 , B32B5/022 , B32B5/024 , B32B5/08 , B32B5/26 , B32B17/04 , B32B27/12 , B32B27/18 , B32B27/34 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/06 , B32B2262/08 , B32B2262/101 , B32B2262/103 , B32B2262/105 , B32B2262/106 , B32B2262/14 , B32B2270/00 , B32B2307/306 , B32B2307/50 , B32B2307/714 , B32B2307/718 , B32B2419/00 , B32B2457/00 , B32B2457/12 , B32B2509/00 , B32B2605/08 , B32B2605/10 , B32B2605/18 , C08J2377/00 , Y10T428/249921 , Y10T428/249924 , Y10T428/249939 , Y10T428/24994 , Y10T442/20 , Y10T442/2041 , Y10T442/2762 , Y10T442/2902 , Y10T442/2984 , Y10T442/2992
Abstract: The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise a first component having a surface, which surface has at least a portion made of a surface polyamide resin composition, and having a fibrous material impregnated with a matrix resin composition, and comprise a second component comprising an overmolding resin composition. The second component is adhered to the first component over at least a portion of the surface of said first component. One of the overmolding resin composition and the surface polyamide resin composition is made of a polyamide composition comprising a blend of one or more semi-aromatic polyamides (A) and one or more fully aliphatic polyamides (B) and the other of the overmolding resin composition and the surface polyamide resin composition is made of one or more polyamides.
Abstract translation: 本发明涉及包覆成型聚酰胺复合材料结构及其制备方法。 所公开的包覆成型的复合结构包括具有表面的第一部件，该表面具有由表面聚酰胺树脂组合物制成的至少一部分，并且具有浸渍有基质树脂组合物的纤维材料，并且包含第二组分，其包含包覆成型树脂组合物 。 第二部件在所述第一部件的表面的至少一部分上附着到第一部件上。 包覆成型树脂组合物和表面聚酰胺树脂组合物中的一种由包含一种或多种半芳族聚酰胺（A）和一种或多种完全脂族聚酰胺（B）的共混物和另一种包覆成型树脂组合物的聚酰胺组合物制成 表面聚酰胺树脂组合物由一种或多种聚酰胺制成。
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公开(公告)号：US20120178325A1
公开(公告)日：2012-07-12
申请号：US13192919
申请日：2011-07-28
Applicant: Martyn Douglas Wakeman , Olaf Norbert Kirchner
Inventor： Martyn Douglas Wakeman , Olaf Norbert Kirchner
CPC classification number: C08J5/04 , B32B27/08 , B32B27/12 , B32B27/34 , B32B2260/023 , B32B2260/046 , B32B2262/0269 , B32B2262/06 , B32B2262/101 , B32B2262/106 , B32B2270/00 , C08J2377/00 , C08L77/02 , C08L77/06 , Y10T442/20 , Y10T442/2631 , Y10T442/2762 , Y10T442/2902 , Y10T442/2984 , Y10T442/2992
Abstract: The invention relates to composite structures having surface, which surface has at least a portion made of a composition comprising one or more polyamides having an excess of amine end groups such that the ratio of the amine end groups to the acid end groups is at least 1.5:1.0.
Abstract translation: 本发明涉及具有表面的复合结构，该表面具有至少一部分由包含一种或多种具有过量胺端基的聚酰胺的组合物制成的部分，使得胺端基与酸端基的比例为至少1.5 ：1.0。
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10.发明申请OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESS FOR THEIR PREPARATION 审中-公开OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESS FOR THE PRACARATION公开(公告)号：US20120108130A1
公开(公告)日：2012-05-03
申请号：US13282521
申请日：2011-10-27
Applicant: Shengmei Yuan , Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Bryan Benedict Sauer , Phong Du
Inventor： Shengmei Yuan , Andri E. Elia , Olaf Norbert Kirchner , Martyn Douglas Wakeman , Bryan Benedict Sauer , Phong Du
CPC classification number: B32B27/34 , B29C45/0001 , B29C45/14786 , B29K2077/00 , B29K2677/00 , B29K2709/08 , B32B5/024 , B32B5/26 , B32B27/12 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2264/12 , B32B2307/306 , B32B2307/308 , B32B2307/546 , B32B2605/00 , C08J5/043 , C08J2377/06 , C08K7/20 , C08L77/06 , C08L2205/02 , Y10T428/249921 , Y10T428/249924 , Y10T428/24994 , Y10T428/31623 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2041 , Y10T442/2631 , Y10T442/2721 , Y10T442/2762 , Y10T442/2861 , Y10T442/2984 , Y10T442/2992 , Y10T442/674
Abstract: Disclosed herein are overmolded composite structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, of which at least a portion made of a surface resin composition, and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, wherein said second component is adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition and the surface resin composition are identical or different polyamide compositions.
Abstract translation: 本文公开了包覆成型复合结构及其制备方法。 所公开的包覆成型复合结构包括：i）具有表面的第一部件，其表面树脂组合物至少由一部分制成，并且包含用基质树脂组合物浸渍的纤维材料，ii）包含二次模塑树脂 组合物，其中所述第二组分在所述第一组分的表面的至少一部分上粘附到所述第一组分，并且其中所述基质树脂组合物和所述表面树脂组合物是相同或不同的聚酰胺组合物。
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