公开(公告)号：US08702903B2

公开(公告)日：2014-04-22

申请号：US12055633

申请日：2008-03-26

申请人： Masaaki Miyagawa ,  Akihiro Yoshimura

发明人： Masaaki Miyagawa ,  Akihiro Yoshimura

IPC分类号： C23C16/50 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67103 ,  H01J37/32091 ,  H01J37/32642 ,  H01J2237/2001 ,  H01L21/67005 ,  H01L21/67069 ,  H01L21/68735

摘要： A thermally conductive sheet is used between a mounting table for mounting thereon a target substrate and an annular focus ring mounted on the mounting table to surround a circumferential peripheral portion of the target substrate. Further, the mounting table includes therein a cooling unit and is disposed in a depressurized accommodating chamber for accommodating therein the target substrate. The thermally conductive sheet has a non-adhesive layer on each of one or more surfaces thereof.

摘要翻译： 在用于安装目标基板的安装台和安装在安装台上的环形聚焦环之间使用导热片以包围目标基板的圆周周边部分。 此外，安装台包括冷却单元，并且设置在减压容纳室中，用于容纳目标基板。 导热片在其一个或多个表面中的每一个上具有非粘性层。

公开(公告)号：US08524005B2

公开(公告)日：2013-09-03

申请号：US11774420

申请日：2007-07-06

申请人： Masaaki Miyagawa ,  Tetsuji Sato

发明人： Masaaki Miyagawa ,  Tetsuji Sato

IPC分类号： C23C16/44 ,  H01L21/3065

CPC分类号： H01J37/32642 ,  H01J37/32623 ,  H01J2237/2001

摘要： A heat-transfer structure which can keep a consumable component at a temperature of 225° C. or less during etching of a substrate. The heat-transfer structure is disposed in a chamber where plasma processing is performed on a wafer as the substrate under a reduced pressure. The heat-transfer structure is comprised of a focus ring having an exposed surface exposed to plasma, a susceptor and an electrostatic chuck that cool the consumable component, and a heat-transfer sheet interposed between the focus ring and the electrostatic chuck and made of a gel-like material. The ratio of hardness of the heat-transfer sheet expressed in Asker C to thermal conductivity of the heat-transfer sheet expressed in W/m·K is less than 20.

摘要翻译： 一种传热结构，其可以在蚀刻基板期间将可消耗部件保持在225℃或更低的温度。 传热结构设置在作为基板的减压下进行等离子体处理的室中。 传热结构包括具有暴露于等离子体的暴露表面的聚焦环，冷却可消耗部件的基座和静电卡盘以及插入聚焦环和静电卡盘之间的热转印片，并由 凝胶状材料。 以Asker C表示的热转印片的硬度与以W / m·K表示的热转印片的导热率的比率小于20。

公开(公告)号：US20100012274A1

公开(公告)日：2010-01-21

申请号：US12504043

申请日：2009-07-16

申请人： Masaaki Miyagawa ,  Katsuhiko Ono ,  Chishio Koshimizu ,  Kazuki Denpoh ,  Tatsuo Matsudo ,  Yasuhiro Hamada

发明人： Masaaki Miyagawa ,  Katsuhiko Ono ,  Chishio Koshimizu ,  Kazuki Denpoh ,  Tatsuo Matsudo ,  Yasuhiro Hamada

IPC分类号： C23F1/08

CPC分类号： H01J37/32642 ,  H01J37/32623 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/68735

摘要： A focus ring is placed on a substrate mounting table for mounting a target substrate thereon to surround the target substrate. The focus ring converges plasma on the target substrate when the target substrate is subjected to plasma processing. The focus ring is configured to create a temperature difference in its radial direction and over its full circumference during the plasma-processing of the target substrate. The focus ring also includes a radial outer region as a higher temperature region and a radial inner region as a lower temperature region. A groove is formed between the radial outer region and the radial inner region to extend over the full circumference of the focus ring.

摘要翻译： 将聚焦环放置在基板安装台上，用于在其上安装目标基板以围绕目标基板。 当目标衬底进行等离子体处理时，聚焦环会将等离子体收敛在目标衬底上。 聚焦环被配置成在靶基质的等离子体处理期间在其径向方向和其整个圆周上产生温度差。 聚焦环还包括作为较高温度区域的径向外部区域和作为较低温度区域的径向内部区域。 在径向外部区域和径向内部区域之间形成凹槽以在聚焦环的整个圆周上延伸。

公开(公告)号：US20080210379A1

公开(公告)日：2008-09-04

申请号：US12016607

申请日：2008-01-18

申请人： Masaaki MIYAGAWA ,  Eiichi Nishimura

发明人： Masaaki MIYAGAWA ,  Eiichi Nishimura

IPC分类号： H01L21/3065

CPC分类号： H01J37/32642 ,  H01J37/32623

摘要： A substrate processing apparatus that can reliably improve the efficiency of heat transfer between a focus ring and a mounting stage. A housing chamber with the interior thereof evacuated houses a substrate. The substrate is mounted on a mounting stage that is disposed in the housing chamber. An annular focus ring is mounted on the mounting stage such as to surround a peripheral portion of the mounted substrate. A heat transfer film is formed on a surface of the focus ring which contacts the mounting stage by printing processing.

摘要翻译： 一种能够可靠地提高聚焦环和安装台之间的热传递效率的基板处理装置。 其内部抽真空的容纳室容纳衬底。 基板安装在设置在壳体室中的安装台上。 环形聚焦环安装在安装台上，以便围绕安装的基板的周边部分。 在通过打印处理接触安装台的聚焦环的表面上形成传热膜。

公开(公告)号：US20070169891A1

公开(公告)日：2007-07-26

申请号：US10933383

申请日：2004-09-03

申请人： Akira Koshiishi ,  Hideaki Tanaka ,  Nobuyuki Okayama ,  Masaaki Miyagawa ,  Shunsuke Mizukami ,  Wataru Shimizu ,  Jun Hirose ,  Toshikatsu Wakaki ,  Tomonori Miwa ,  Jun Ooyabu ,  Daisuke Hayashi

发明人： Akira Koshiishi ,  Hideaki Tanaka ,  Nobuyuki Okayama ,  Masaaki Miyagawa ,  Shunsuke Mizukami ,  Wataru Shimizu ,  Jun Hirose ,  Toshikatsu Wakaki ,  Tomonori Miwa ,  Jun Ooyabu ,  Daisuke Hayashi

IPC分类号： C23F1/00

CPC分类号： H01L21/68735 ,  H01J37/32642 ,  H01L21/68757

摘要： A focus ring and a plasma processing apparatus capable of improving an in-surface uniformity of a surface and reducing occurrences of deposition on a backside surface of a peripheral portion of a semiconductor wafer compared to a conventional case are provided. Installed in a vacuum chamber is a susceptor for mounting the semiconductor wafer thereon and a focus ring is installed to surround the semiconductor wafer mounted on the susceptor. The focus ring includes an annular lower member made of a dielectric, and an annular upper member made of a conductive material and mounted on the lower member. The upper member includes a flat portion which is an outer peripheral portion having a top surface positioned higher than a surface to be processed of the semiconductor wafer W, and an inclined portion which is an inner peripheral portion inclined inwardly.

摘要翻译： 提供了一种聚焦环和等离子体处理装置，其能够改善表面的表面均匀性并减少与常规情况相比在半导体晶片的周边部分的背面上沉积的情况。 安装在真空室中的是用于在其上安装半导体晶片的基座，并且安装聚焦环以围绕安装在基座上的半导体晶片。 聚焦环包括由电介质制成的环形下部构件和由导电材料制成并安装在下部构件上的环形上部构件。 上部构件包括平坦部，该平坦部是具有位于比半导体晶片W的待加工表面高的顶面的外周部，以及作为向内倾斜的内周部的倾斜部。

公开(公告)号：USD709536S1

公开(公告)日：2014-07-22

申请号：US29417056

申请日：2012-03-29

申请人： Akihiro Yoshimura ,  Masaaki Miyagawa ,  Tetsuji Sato

设计人： Akihiro Yoshimura ,  Masaaki Miyagawa ,  Tetsuji Sato

公开(公告)号：US07655579B2

公开(公告)日：2010-02-02

申请号：US11970612

申请日：2008-01-08

申请人： Masaaki Miyagawa ,  Akihiro Yoshimura

发明人： Masaaki Miyagawa ,  Akihiro Yoshimura

IPC分类号： H01L21/00

CPC分类号： H01L21/6831 ,  H01L21/67103

摘要： A focus ring heat transfer method improves heat transfer of a focus ring arranged in an outer peripheral portion of a mounting surface of a mounting table adapted to mount a target substrate in a chamber. The method includes steps of: disposing a heat transfer sheet between the focus ring and the mounting table; and vacuum-evacuating the chamber prior to processing the target substrate and then restoring the pressure the inside of the chamber to an atmospheric pressure or a light vacuum pressure. Therefore, air present in a fine gap between the heat transfer sheet and the mounting surface is removed to allow the heat transfer sheet to adhere to the mounting surface.

摘要翻译： 聚焦环传热方法改善了布置在适于将目标基板安装在室中的安装台的安装表面的外周部分中的聚焦环的热传递。 该方法包括以下步骤：在聚焦环和安装台之间设置传热片; 并且在处理目标基板之前对腔室进行真空抽真空，然后将腔室内部的压力恢复到大气压力或轻的真空压力。 因此，除去传热片与安装面之间的微细间隙的空气，使传热片粘附在安装面上。

公开(公告)号：US20080236746A1

公开(公告)日：2008-10-02

申请号：US12057827

申请日：2008-03-28

申请人： Jun OYABU ,  Masaaki MIYAGAWA

发明人： Jun OYABU ,  Masaaki MIYAGAWA

IPC分类号： H01L21/306

CPC分类号： H01J37/32642 ,  H01J37/32623

摘要： A substrate processing apparatus that can prevent a heat transfer sheet from becoming attached to a focus ring mounting surface of a substrate mounting stage. The substrate mounting stage is disposed in a housing chamber of the substrate processing apparatus, and a substrate is mounted on the substrate mounting stage. A focus ring that surrounds a peripheral portion of the mounted substrate is mounted on the focus ring mounting surface. The heat transfer sheet is interposed between the focus ring and the focus ring mounting surface, and a fluorine coating is formed on the focus ring mounting surface.

摘要翻译： 一种能够防止热转印片附着到基板安装台的聚焦环安装面的基板处理装置。 基板安装台设置在基板处理装置的收容室中，基板安装在基板安装台上。 围绕安装的基板的周边部分的聚焦环安装在聚焦环安装表面上。 传热片介于聚焦环和聚焦环安装面之间，在聚焦环安装面上形成氟涂层。

公开(公告)号：US20080239691A1

公开(公告)日：2008-10-02

申请号：US12055633

申请日：2008-03-26

申请人： Masaaki MIYAGAWA ,  Akihiro YOSHIMURA

发明人： Masaaki MIYAGAWA ,  Akihiro YOSHIMURA

IPC分类号： H05K7/02 ,  F28F7/00

CPC分类号： H01L21/67103 ,  H01J37/32091 ,  H01J37/32642 ,  H01J2237/2001 ,  H01L21/67005 ,  H01L21/67069 ,  H01L21/68735

摘要： A thermally conductive sheet is used between a mounting table for mounting thereon a target substrate and an annular focus ring mounted on the mounting table to surround a circumferential peripheral portion of the target substrate. Further, the mounting table includes therein a cooling unit and is disposed in a depressurized accommodating chamber for accommodating therein the target substrate. The thermally conductive sheet has a non-adhesive layer on each of one or more surfaces thereof.

摘要翻译： 在用于安装目标基板的安装台和安装在安装台上的环形聚焦环之间使用导热片以包围目标基板的圆周周边部分。 此外，安装台包括冷却单元，并且设置在减压容纳室中，用于容纳目标基板。 导热片在其一个或多个表面中的每一个上具有非粘性层。

公开(公告)号：US08043472B2

公开(公告)日：2011-10-25

申请号：US12016607

申请日：2008-01-18

申请人： Masaaki Miyagawa ,  Eiichi Nishimura

发明人： Masaaki Miyagawa ,  Eiichi Nishimura

IPC分类号： C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC分类号： H01J37/32642 ,  H01J37/32623

摘要： A substrate processing apparatus that can reliably improve the efficiency of heat transfer between a focus ring and a mounting stage. A housing chamber with the interior thereof evacuated houses a substrate. The substrate is mounted on a mounting stage that is disposed in the housing chamber. An annular focus ring is mounted on the mounting stage such as to surround a peripheral portion of the mounted substrate. A heat transfer film is formed on a surface of the focus ring which contacts the mounting stage by printing processing.

摘要翻译： 一种能够可靠地提高聚焦环和安装台之间的热传递效率的基板处理装置。 其内部抽真空的容纳室容纳衬底。 基板安装在设置在壳体室中的安装台上。 环形聚焦环安装在安装台上，以便围绕安装的基板的周边部分。 在通过打印处理接触安装台的聚焦环的表面上形成传热膜。