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12 条记录 (耗时 0.02 秒)

    METHOD FOR IMPROVING HEAT TRANSFER OF A FOCUS RING TO A TARGET SUBSTRATE MOUNTING DEVICE
    3.
    发明申请
    METHOD FOR IMPROVING HEAT TRANSFER OF A FOCUS RING TO A TARGET SUBSTRATE MOUNTING DEVICE 有权
    将聚焦环转移到目标基板安装装置的方法

    公开(公告)号：US20080166894A1

    公开(公告)日：2008-07-10

    申请号：US11970612

    申请日：2008-01-08

    申请人： Masaaki MIYAGAWA ,  Akihiro Yoshimura

    发明人： Masaaki MIYAGAWA ,  Akihiro Yoshimura

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6831 ,  H01L21/67103

    摘要： A focus ring heat transfer method improves heat transfer of a focus ring arranged in an outer peripheral portion of a mounting surface of a mounting table adapted to mount a target substrate in a chamber. The method includes steps of: disposing a heat transfer sheet between the focus ring and the mounting table; and vacuum-evacuating the chamber prior to processing the target substrate and then restoring the pressure the inside of the chamber to an atmospheric pressure or a light vacuum pressure. Therefore, air present in a fine gap between the heat transfer sheet and the mounting surface is removed to allow the heat transfer sheet to adhere to the mounting surface.

    摘要翻译： 聚焦环传热方法改善了布置在适于将目标基板安装在室中的安装台的安装表面的外周部分中的聚焦环的热传递。 该方法包括以下步骤：在聚焦环和安装台之间设置传热片; 并且在处理目标基板之前对腔室进行真空抽真空，然后将腔室内部的压力恢复到大气压力或轻的真空压力。 因此，除去传热片与安装面之间的微细间隙的空气，使传热片粘附在安装面上。

    Method for improving heat transfer of a focus ring to a target substrate mounting device
    4.
    发明授权
    Method for improving heat transfer of a focus ring to a target substrate mounting device 有权
    用于改善聚焦环向目标基板安装装置的传热的方法

    公开(公告)号：US07655579B2

    公开(公告)日：2010-02-02

    申请号：US11970612

    申请日：2008-01-08

    申请人： Masaaki Miyagawa ,  Akihiro Yoshimura

    发明人： Masaaki Miyagawa ,  Akihiro Yoshimura

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6831 ,  H01L21/67103

    摘要： A focus ring heat transfer method improves heat transfer of a focus ring arranged in an outer peripheral portion of a mounting surface of a mounting table adapted to mount a target substrate in a chamber. The method includes steps of: disposing a heat transfer sheet between the focus ring and the mounting table; and vacuum-evacuating the chamber prior to processing the target substrate and then restoring the pressure the inside of the chamber to an atmospheric pressure or a light vacuum pressure. Therefore, air present in a fine gap between the heat transfer sheet and the mounting surface is removed to allow the heat transfer sheet to adhere to the mounting surface.

    摘要翻译： 聚焦环传热方法改善了布置在适于将目标基板安装在室中的安装台的安装表面的外周部分中的聚焦环的热传递。 该方法包括以下步骤：在聚焦环和安装台之间设置传热片; 并且在处理目标基板之前对腔室进行真空抽真空，然后将腔室内部的压力恢复到大气压力或轻的真空压力。 因此，除去传热片与安装面之间的微细间隙的空气，使传热片粘附在安装面上。

    PLASMA PROCESSING APPARATUS AND METHOD, AND BAFFLE PLATE OF THE PLASMA PROCESSING APPARATUS
    5.
    发明申请
    PLASMA PROCESSING APPARATUS AND METHOD, AND BAFFLE PLATE OF THE PLASMA PROCESSING APPARATUS 审中-公开
    等离子体加工装置和方法，等离子体加工装置的平板

    公开(公告)号：US20090206055A1

    公开(公告)日：2009-08-20

    申请号：US12388843

    申请日：2009-02-19

    申请人： Tetsuji SATO ,  Akihiro Yoshimura

    发明人： Tetsuji SATO ,  Akihiro Yoshimura

    IPC分类号： H01L21/306

    CPC分类号： H01J37/32633 ,  H01J37/32449 ,  H01J37/32623

    摘要： In a plasma processing apparatus for performing a plasma process on a target substrate, a baffle plate has an opening through which the process passes and partitions the internal space of the processing container into a plasma process space and an exhaust space, the opening being a single continuous slit. The baffle plate is disposed in an annular gas exhaust path around the mounting table, and the slit includes a plurality of linear slit portions extending in a radial direction of the annular baffle plate and a plurality of curved slit portions, each of which interconnects ends of a pair of the adjacent linear slit portions, so that the slit is formed in a wave shape in its entirety.

    摘要翻译： 在用于在目标基板上进行等离子体处理的等离子体处理装置中，挡板具有开口，工序通过该开口并将处理容器的内部空间分隔成等离子体处理空间和排气空间，该开口为单个 连续缝 挡板设置在安装台周围的环形排气通道中，狭缝包括沿环形挡板的径向延伸的多个线性狭缝部分和多个弯曲狭缝部分，每个弯曲狭缝部分将 一对相邻的线状狭缝部，使得狭缝整体形成波形。

    SUBSTRATE MOUNTING TABLE OF SUBSTRATE PROCESSING APPARATUS
    6.
    发明申请
    SUBSTRATE MOUNTING TABLE OF SUBSTRATE PROCESSING APPARATUS 有权
    基板加工装置基板安装台

    公开(公告)号：US20110116207A1

    公开(公告)日：2011-05-19

    申请号：US12947214

    申请日：2010-11-16

    申请人： Tetsuji SATO ,  Takashi Kitazawa ,  Akihiro Yoshimura

    发明人： Tetsuji SATO ,  Takashi Kitazawa ,  Akihiro Yoshimura

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6831

    摘要： A substrate mounting table of a substrate processing apparatus includes a base portion and a circular plate-shaped electrostatic chuck adhered to an upper surface of the base portion by an adhesive layer. The electrostatic chuck has a circular attracting surface to support a substrate. The substrate mounting table further includes an annular focus ring arranged around the electrostatic chuck to surround the substrate and to cover an outer peripheral portion of the upper surface of the base portion. The electrostatic chuck has a two-layer structure including an upper circular part and a lower circular part having a diameter larger than that of the upper circular part. An outer peripheral portion of the lower circular part and an outer peripheral portion of the adhesive layer adhering the lower circular part to the base portion are covered with the focus ring.

    摘要翻译： 基板处理装置的基板安装台包括基部和通过粘合层粘附到基部的上表面的圆形板状静电卡盘。 静电吸盘具有支撑衬底的圆形吸引表面。 基板安装台还包括围绕静电卡盘布置以围绕基板并覆盖基部的上表面的外周部分的环形聚焦环。 静电卡盘具有包括上部圆形部分和直径大于上部圆形部分的直径的下部圆形部分的两层结构。 下部圆形部分的外围部分和将下部圆形部分粘附到基部的粘合剂层的外周部分被聚焦环覆盖。

    Substrate processing apparatus
    7.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US09455125B2

    公开(公告)日：2016-09-27

    申请号：US13070115

    申请日：2011-03-23

    申请人： Akihiro Yoshimura ,  Tetsuji Sato ,  Masato Horiguchi ,  Nobuhiro Wada ,  Makoto Kobayashi ,  Hiroshi Tsujimoto ,  Jun Tamura ,  Mamoru Naoi

    发明人： Akihiro Yoshimura ,  Tetsuji Sato ,  Masato Horiguchi ,  Nobuhiro Wada ,  Makoto Kobayashi ,  Hiroshi Tsujimoto ,  Jun Tamura ,  Mamoru Naoi

    IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32

    CPC分类号： H01J37/32091 ,  H01J37/32568

    摘要： Disclosed is a substrate processing apparatus capable of suppressing generation of plasma in the space between a moving electrode and an end wall at one side of a cylindrical chamber. The substrate processing apparatus includes a cylindrical chamber to receive a wafer, a shower head movable along a central axis of the chamber inside the chamber, a susceptor opposing the shower head in the chamber, and a flexible bellows connecting the shower head to a cover of the chamber, wherein a high frequency power is applied to a processing space presented between the shower head and the susceptor, processing gas is introduced into the processing space, the shower head and the side wall of the chamber are non-contact to each other, and a bypass member is installed electrically connecting the shower head and the cover or the side wall of the chamber.

    摘要翻译： 公开了一种能够抑制在圆筒形室的一侧的移动电极与端壁之间的空间中产生等离子体的基板处理装置。 基板处理装置包括用于容纳晶片的圆柱形室，可沿着室内的室的中心轴线移动的喷头，与腔室中的淋浴喷头相对的基座，以及柔性波纹管，其将淋浴头连接到 所述室，其中向所述淋浴喷头和所述基座之间呈现的处理空间施加高频功率，将处理气体引入所述处理空间中，所述淋浴喷头和所述室的侧壁彼此不接触， 并且旁路部件被安装成电连接淋浴头和盖子或室的侧壁。

    Substrate mounting table of substrate processing apparatus
    8.
    发明授权
    Substrate mounting table of substrate processing apparatus 有权
    基板加工装置基板安装台

    公开(公告)号：US08687343B2

    公开(公告)日：2014-04-01

    申请号：US12947214

    申请日：2010-11-16

    申请人： Tetsuji Sato ,  Takashi Kitazawa ,  Akihiro Yoshimura

    发明人： Tetsuji Sato ,  Takashi Kitazawa ,  Akihiro Yoshimura

    IPC分类号： H01L21/683 ,  C23F1/00

    CPC分类号： H01L21/6831

    摘要： A substrate mounting table of a substrate processing apparatus includes a base portion and a circular plate-shaped electrostatic chuck adhered to an upper surface of the base portion by an adhesive layer. The electrostatic chuck has a circular attracting surface to support a substrate. The substrate mounting table further includes an annular focus ring arranged around the electrostatic chuck to surround the substrate and to cover an outer peripheral portion of the upper surface of the base portion. The electrostatic chuck has a two-layer structure including an upper circular part and a lower circular part having a diameter larger than that of the upper circular part. An outer peripheral portion of the lower circular part and an outer peripheral portion of the adhesive layer adhering the lower circular part to the base portion are covered with the focus ring.

    摘要翻译： 基板处理装置的基板安装台包括基部和通过粘合层粘附到基部的上表面的圆形板状静电卡盘。 静电吸盘具有支撑衬底的圆形吸引表面。 基板安装台还包括围绕静电卡盘布置以围绕基板并覆盖基部的上表面的外周部分的环形聚焦环。 静电卡盘具有包括上部圆形部分和直径大于上部圆形部分的直径的下部圆形部分的两层结构。 下部圆形部分的外围部分和将下部圆形部分粘附到基部的粘合剂层的外周部分被聚焦环覆盖。