公开(公告)号：US20050051434A1

公开(公告)日：2005-03-10

申请号：US10933353

申请日：2004-09-03

申请人： Koji Mishima ,  Masao Hodai ,  Hiroyuki Kanda ,  Kunihito Ide ,  Satoru Yamamoto ,  Seiji Katsuoka ,  Masaaki Kinbara ,  Masaji Akahori ,  Sota Nakagawa

发明人： Koji Mishima ,  Masao Hodai ,  Hiroyuki Kanda ,  Kunihito Ide ,  Satoru Yamamoto ,  Seiji Katsuoka ,  Masaaki Kinbara ,  Masaji Akahori ,  Sota Nakagawa

IPC分类号： C25D21/16 ,  C25D21/12 ,  C25D21/18 ,  C25D21/22 ,  C25D21/06 ,  C25C7/00

CPC分类号： C25D21/12 ,  C25D21/22

摘要： An electrolytic solution control method can control the composition of an electrolytic solution efficiently with high precision, and can remove a partially decomposed product of an organic component from an electrolytic solution. The electrolytic solution control method includes storing an electrolytic solution containing an organic component and an inorganic component in an electrolytic solution storage tank while controlling and keeping the electrolytic solution at a predetermined composition, adjusting an inorganic component of the waste electrolytic solution after use in electrolytic processing in an electrolytic processing apparatus, and then returning the waste electrolytic solution to the electrolytic solution storage tank.

摘要翻译： 电解液控制方法能够高精度地有效地控制电解液的组成，能够从电解液中除去有机成分的部分分解产物。 电解液控制方法包括将电解液储存罐中含有有机成分和无机成分的电解液同时控制并保持电解液为规定的组成，在电解处理后调整废电解液的无机成分 在电解处理装置中，然后将废电解液返回到电解液储罐。

公开(公告)号：US20070158202A1

公开(公告)日：2007-07-12

申请号：US11488150

申请日：2006-07-18

申请人： Mizuki Nagai ,  Masao Hodai ,  Hiroyuki Kanda ,  Tsutomu Nakada ,  Takashi Kawakami

发明人： Mizuki Nagai ,  Masao Hodai ,  Hiroyuki Kanda ,  Tsutomu Nakada ,  Takashi Kawakami

IPC分类号： C25D21/18

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/002 ,  C25D21/14 ,  C25D21/18 ,  H01L21/2885 ,  H01L21/76877

摘要： A plating apparatus can keep concentrations of components of a plating solution constant over a long period of time and can stably form a plated film having a more uniform thickness on a surface of a substrate while minimizing an amount of the plating solution used. The plating apparatus includes a plating cell for carrying out electroplating of a surface of a substrate with a space between the surface of the substrate, serving as a cathode, and an insoluble anode filled with a plating solution, a plating solution circulation system for supplying the plating solution to the plating cell and recovering the plating solution in a circulatory manner, and a plating solution component replenishment system for supplying a replenisher solution, containing a component of the plating solution in a higher concentration than that in the plating solution, to the plating solution which circulates in the plating solution circulation system, thereby maintaining the concentration of the component in the plating solution within a predetermined range.

摘要翻译： 电镀装置能够使电镀液的成分浓度恒定长时间稳定地形成在基材表面上具有更均匀厚度的电镀膜，同时最小化所用电镀液的量。 电镀装置包括：电镀单元，用于在作为阴极的基板的表面和填充有电镀液的不溶性阳极之间具有空间的基板的表面进行电镀;电镀液循环系统， 电镀液，并以循环方式回收电镀溶液，以及电镀液成分补充系统，用于将含有比镀液中的电镀液浓度高的电镀液成分的补充液供给电镀液 溶液在电镀液循环系统中循环，从而将电镀溶液中的组分的浓度保持在预定范围内。

公开(公告)号：US20050155865A1

公开(公告)日：2005-07-21

申请号：US10845429

申请日：2004-05-14

申请人： Koji Mishima ,  Keisuke Namiki ,  Masao Hodai ,  Junji Kunisawa ,  Natsuki Makino ,  Yukio Fukunaga

发明人： Koji Mishima ,  Keisuke Namiki ,  Masao Hodai ,  Junji Kunisawa ,  Natsuki Makino ,  Yukio Fukunaga

IPC分类号： C25D7/12 ,  C25B9/00 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00

CPC分类号： C25D17/00 ,  C25D17/02

摘要： There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.

摘要翻译： 提供一种电解处理装置和方法，其能够生产具有提高的生产率的各种规格的产品，从而降低生产成本，并且可以灵活地响应于朝向半导体器件中更精细的互连的移动。 根据本发明的电解处理装置包括：电解处理单元，包括用于保持基板的基板保持器和与由基板保持器保持的基板相对设置的对置电极板，所述电解处理单元通过填充电解处理单元进行电解处理 在供电的同时由衬底保持器保持的衬底与电极板之间的电解槽的间隔; 以及用于供给不同种类的电解液的多个电解液供给装置; 其中所述电解处理单元可选择性地连接到所述多个电解溶液供应设备中的一个。

公开(公告)号：US20050236268A1

公开(公告)日：2005-10-27

申请号：US11109720

申请日：2005-04-20

申请人： Koji Mishima ,  Hiroyuki Kanda ,  Seiji Katsuoka ,  Masao Hodai ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Naoki Matsuda

发明人： Koji Mishima ,  Hiroyuki Kanda ,  Seiji Katsuoka ,  Masao Hodai ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Naoki Matsuda

IPC分类号： C23C18/16 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768

CPC分类号： H01L21/6723 ,  C23C18/1632 ,  C25D5/48 ,  C25D5/50 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  H01L21/2885 ,  H01L21/67017 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/76877

摘要： A substrate processing apparatus has a plating apparatus configured to plate a substrate to deposit a metal on a surface of the substrate and an additional process apparatus configured to perform an additional process on the substrate. The plating apparatus has a substrate placement stage on which the substrate to be transferred to the additional process apparatus is placed. The additional process apparatus has an additional process unit configured to perform the additional process on the substrate and a substrate transfer device operable to transfer the substrate between the substrate placement stage of the plating apparatus and the additional process unit. The substrate processing apparatus can perform an additional process in addition to a plating process without lowering a throughput of the apparatus and can upgrade the additional process at a low cost.

摘要翻译： 基板处理装置具有：电镀装置，其被配置为对基板进行平板化以在基板的表面上沉积金属;以及附加处理装置，被配置为在所述基板上执行附加处理。 电镀装置具有基板放置台，放置要转移到附加处理装置的基板。 所述附加处理装置具有被配置为在所述基板上执行附加处理的附加处理单元以及可操作以在所述电镀装置的所述基板放置阶段和所述附加处理单元之间转移所述基板的基板转移装置。 基板处理装置除了电镀工艺之外还可以执行附加处理，而不降低装置的生产量，并且可以以低成本升级附加处理。