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    Electrolytic processing apparatus and substrate processing method
    2.
    发明授权
    Electrolytic processing apparatus and substrate processing method 失效
    电解处理装置及基板处理方法

    公开(公告)号：US07374646B2

    公开(公告)日：2008-05-20

    申请号：US10767253

    申请日：2004-01-30

    申请人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

    发明人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

    IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D7/12

    CPC分类号： H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  H01L21/76877

    摘要： The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate has a large area, and controlling more uniformly a speed, over the entire surface to be processed of the substrate. The electrolytic processing apparatus of this invention includes: a substrate holder for holding a substrate, a first electrode for being brought into contact with the substrate to supply current to a surface, to be processed, of the substrate; a second electrode disposed substantially parallel to the surface, to be processed, of the substrate in a position facing the surface, to be processed, of the substrate held by the substrate holder; a high resistance structure disposed between the substrate held by the substrate holder and the second electrode; an electrolytic solution introducing portion for introducing an electrolytic solution into a region across which the substrate held by the substrate holder and the high resistance structure face each other, from laterally of the high resistance structure; and a power source for applying a voltage between the first electrode and the second electrode.

    摘要翻译： 本发明提供一种电解处理装置，其能够通过使基板的整个表面上的电场分布更均匀，从而提高镀膜的膜厚的面内均匀性， 大面积，并且在基板的整个待处理表面上更均匀地控制速度。 本发明的电解处理装置包括：用于保持基板的基板保持器，用于与基板接触的第一电极，以将基板的待加工表面供给电流; 基板平行于被处理面的基板平面的第二电极，所述第一电极与所述基板保持器保持的所述基板面对所述要被处理的表面的位置; 设置在由衬底保持器保持的衬底和第二电极之间的高电阻结构; 电解液引入部分，用于将电解溶液引入到由所述衬底保持器保持的所述衬底和所述高电阻结构面对的区域中，从所述高电阻结构的侧面引出; 以及用于在第一电极和第二电极之间施加电压的电源。

    Plating apparatus, plating method and substrate processing apparatus
    4.
    发明申请
    Plating apparatus, plating method and substrate processing apparatus 审中-公开
    电镀装置，电镀方法和基板处理装置

    公开(公告)号：US20050023149A1

    公开(公告)日：2005-02-03

    申请号：US10860115

    申请日：2004-06-04

    申请人： Tsutomu Nakada ,  Junji Kunisawa ,  Hiroyuki Kanda ,  Mizuki Nagai ,  Satoru Yamamoto ,  Koji Mishima ,  Shinya Morisawa ,  Seiji Katsuoka ,  Natsuki Makino ,  Yukio Fukunaga

    发明人： Tsutomu Nakada ,  Junji Kunisawa ,  Hiroyuki Kanda ,  Mizuki Nagai ,  Satoru Yamamoto ,  Koji Mishima ,  Shinya Morisawa ,  Seiji Katsuoka ,  Natsuki Makino ,  Yukio Fukunaga

    IPC分类号： C25D5/00 ,  C25D7/12 ,  C25D17/06

    CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06

    摘要： The present invention provides a plating apparatus which uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate. The plating apparatus includes: a substrate holder for holding a substrate; a cathode section including a seal ring for contacting a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder to seal the peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate; a vertically-movable electrode head provided above the cathode section, including an anode chamber housing an anode made of an insoluble material and having a bottom opening closed with a water-permeable porous member; a plating solution injection section for injecting a plating solution between the anode and the surface, to be plated, of the substrate held by the substrate holder; a power source for applying a plating voltage between the cathode and the anode; and a gas discharge line for discharging a gas from the anode chamber.

    摘要翻译： 本发明提供一种电镀装置，其使用不溶性阳极，并且可以在防止由于使用不溶性阳极而产生的氧气导致基板中的缺陷的同时稳定地进行基板的电镀。 电镀装置包括：用于保持基板的基板保持件; 阴极部分，包括用于接触被基板保持器保持的基板的周边部分的密封环，以密封周边部分，以及用于接触基板以向基板供应电流的阴极 ; 设置在所述阴极部分上方的可垂直移动的电极头，包括容纳由不溶性材料制成的阳极并且具有用透水性多孔构件封闭的底部开口的阳极室; 电镀溶液注入部，用于在被基板保持器保持的基板的阳极和要被电镀的表面之间注入电镀液; 用于在阴极和阳极之间施加电镀电压的电源; 以及用于从阳极室排出气体的气体排出管线。

    Substrate polishing apparatus and method
    7.
    发明授权
    Substrate polishing apparatus and method 有权
    基材抛光装置及方法

    公开(公告)号：US07976362B2

    公开(公告)日：2011-07-12

    申请号：US12534465

    申请日：2009-08-03

    申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    IPC分类号： B24B29/00

    CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

    摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

    摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

    Substrate polishing apparatus and method
    8.
    发明授权
    Substrate polishing apparatus and method 有权
    基材抛光装置及方法

    公开(公告)号：US07585205B2

    公开(公告)日：2009-09-08

    申请号：US11905687

    申请日：2007-10-03

    申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

    IPC分类号： B24B49/00

    CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

    摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

    摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

    Substrate holding apparatus, substrate holding method, and substrate processing apparatus
    10.
    发明申请
    Substrate holding apparatus, substrate holding method, and substrate processing apparatus 有权
    基板保持装置，基板保持方法和基板处理装置

    公开(公告)号：US20070070575A1

    公开(公告)日：2007-03-29

    申请号：US10578100

    申请日：2004-12-22

    申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

    发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

    IPC分类号： H01T23/00

    CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

    摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder (84) for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member (92); and a substrate pressing section (85) for lowering relative to the substrate holder (84) so as to press the substrate (W) held by the substrate holder (84) downward, thereby bringing the first sealing member (92) into pressure contact with the substrate (W); wherein the substrate pressing section (85) is provided with a second ring-shaped sealing member (170) which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder (84), thereby sealing the peripheral region of the substrate pressing section (85).

    摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：通过使基板（W）的表面的周边部分与第一密封构件（92）接触来支撑基板（W）的基板保持件（84）; 以及用于相对于基板保持件（84）下降以便将由基板保持件（84）保持的基板（W）向下压的基板按压部（85），从而使第一密封部件（92）与 基板（W）; 其中，所述基板按压部（85）设置有与所述基板保持件（84）的环状保持部的上表面压力接触的第二环状密封部件（170），从而密封所述基板保持部 基板按压部（85）。