ADHESIVE SHEET FOR PROCESSING OF SEMICONDUCTOR WAFTER
    6.
    发明申请
    ADHESIVE SHEET FOR PROCESSING OF SEMICONDUCTOR WAFTER 审中-公开
    用于半导体波导处理的粘合片

    公开(公告)号:US20120114938A1

    公开(公告)日:2012-05-10

    申请号:US13381760

    申请日:2011-04-14

    IPC分类号: C09J7/02 C09J133/08

    摘要: An adhesive sheet for processing of a semiconductor wafer has an adhesive layer disposed on at least one surface of a base substrate, the adhesive layer includes a base polymer, a plasticizer and a surfactant, an SP value of the plasticizer and the surfactant satisfies the relationship: 0.9≦(the plasticizer SP value)/(the surfactant SP value)≦1.0. The present invention has the object of providing an adhesive sheet for processing of a semiconductor wafer that exhibits superior storage stability under a range of environments, and that prevents contamination of the adherend after use.

    摘要翻译: 用于处理半导体晶片的粘合片具有设置在基底基材的至少一个表面上的粘合剂层,粘合剂层包括基础聚合物,增塑剂和表面活性剂,增塑剂和表面活性剂的SP值满足关系 :0.9≦̸(增塑剂SP值)/(表面活性剂SP值)≦̸ 1.0。 本发明的目的是提供一种用于处理半导体晶片的粘合片,其在一系列环境下表现出优异的储存稳定性,并且防止了使用后被粘物的污染。