公开(公告)号：US20120312428A1

公开(公告)日：2012-12-13

申请号：US13499977

申请日：2011-06-10

Applicant: Michitaka Mikami

Inventor： Michitaka Mikami

IPC: C22C5/02

CPC classification number: C22C5/02 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/3013 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2224/48 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01006

Abstract: To acquire the best combination of elongation and break strength on the Au alloy bonding wire. Adding 0.5-30 wt % of at least one element among Cu, Ag, Pd and Pt to high purity Au, a flat area about elongation ratio change appears between the range of 450-650° C. of heat-treatment temperature at wire drawing. Though the wire strength becomes decrease at this range of temperature, the strength is maintained at higher level against the heat treatment temperature of a standard elongation ratio of 4% of high purity Au alloy wire. Therefore, by the heat treatment of this flat range, Au alloy bonding wire, which has certain level of strength regardless of the temperature change, is acquired. Moreover, by selecting appropriate temperature range, different strength characteristics wires corresponding to the elongation ratio are acquired.

Abstract translation: 获得Au合金接合线上伸长率和断裂强度的最佳组合。 在Cu，Ag，Pd和Pt中添加0.5-30重量％的至少一种元素到高纯度Au，拉伸比变化的平坦区域出现在拉丝热处理温度的450-650℃的范围内 。 尽管在该温度范围内线材强度降低，但是相对于标准伸长率为4％的高纯度Au合金线材的热处理温度，强度保持在较高水平。 因此，通过该平坦范围的热处理，获得了具有一定水平的强度而不管温度变化的Au合金接合线。 此外，通过选择适当的温度范围，获得与伸长率对应的不同的强度特性线。

公开(公告)号：US20110236697A1

公开(公告)日：2011-09-29

申请号：US12998861

申请日：2010-11-05

Applicant: Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

Inventor： Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

IPC: B32B15/04

CPC classification number: H01L24/43 ,  C22C21/00 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  Y10T428/31678 ,  H01L2924/01205 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2924/206

Abstract: [Issues to be Solved] To provide an aluminum ribbon for ultrasonic bonding, is able to realize the high bonding strength and is able to maintain defined level of bonding strength, during several ten thousand bonding cycles.[Means to be Solved] An aluminum ribbon for ultrasonic bonding is consisted aluminum metal or aluminum based alloy, the purity of aluminum is more than 99.99 wt %, and total amount of organic carbon non-ionic surfactant less than 500 molecular weight vaporized and adhered is 100-1,000 μg/m2 on the mirror finished bright surface of aluminum ribbon.

Abstract translation: [待解决的问题]为了提供用于超声波接合的铝带，能够实现高粘结强度并且能够在数万次粘合循环期间保持限定的粘结强度水平。 [待解决的方法]超声波接合用铝带由铝金属或铝基合金构成，铝的纯度大于99.99重量％，小于500分子量的有机碳非离子表面活性剂的总量蒸发并粘附 在铝带的镜面光亮表面上为100-1,000μg/ m2。

公开(公告)号：US20080075626A1

公开(公告)日：2008-03-27

申请号：US11664102

申请日：2005-09-29

Applicant: Michitaka Mikami ,  Takatoshi Arikawa

Inventor： Michitaka Mikami ,  Takatoshi Arikawa

IPC: C22C5/02

CPC classification number: C22C5/02 ,  B23K35/3013 ,  H01L24/11 ,  H01L24/12 ,  H01L24/43 ,  H01L24/45 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/01062 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2924/01201 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The present invention was held in order to resolve problems on above-mentioned conventional wire bumping material. This invention has the following purposes; (1) approximating Au—Ag alloy bumping balls to bond Al pads to ideal sphere shape (2) increasing assurance of Au—Ag alloy bump bonding to Al pads (3) shortening tail length of Au—Ag alloy bump (4) improving anti-Au consumption into solder (5) decreasing contamination of capillary tip by bump wire and hole around tip Means for resolution Au—Ag alloy for wire bumping comprising wherein Au, which purity is more than 99.99 mass %, comprising Au matrix and a particle of additive elements, consisting of 1 to 40 mass % Ag, which purity is more than 99.99 mass %.

Abstract translation: 本发明是为了解决上述现有的钢丝碰撞材料的问题而进行的。 本发明具有以下目的： （1）近似Au-Ag合金凸块，将Al焊盘接合到理想的球形（2）增加Au-Ag合金凸块接合到Al焊盘的保证（3）缩短Au-Ag合金凸块的尾部长度（4） - 消耗到焊料中（5）通过凸点焊丝减少毛细管尖端的污染和尖端附近的孔污染用于线材凸起的用于分辨率的Au-Ag合金的装置，其中纯度大于99.99质量％的Au包含Au基体和 添加元素由1〜40质量％Ag组成，纯度大于99.99质量％。

公开(公告)号：US20070298276A1

公开(公告)日：2007-12-27

申请号：US11791329

申请日：2005-11-22

Applicant: Satoshi Teshima ,  Michitaka Mikami

Inventor： Satoshi Teshima ,  Michitaka Mikami

IPC: H01L21/60 ,  C22C5/02

CPC classification number: C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  Y10T428/12431 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2924/01039 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/01062 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01006

Abstract: Issues to be Solved Au bonding wire for semiconductor device should be provided in circumstances such as reducing the diameter of bonding wire to less than 23 μm, squashed ball with superior roundness should be formed and with strong tensile strength endurable against wire flow. Means as Solution Au bonding wire for semiconductor device, consisting of Au matrix and functional additives, containing: said Au matrix alloy including 3-15 mass ppm of Be, 3-40 mass ppm of Ca, and 3-20 mass ppm of La and roundness of squashed ball said Au alloy is 0.95-1.05.

Abstract translation: 要解决的问题半导体器件的焊接接线应在将接合线的直径减小到小于23μm的情况下提供，应形成具有优异圆度的压扁球，并具有抗拉线强度。 作为解决方案的解决方案用于半导体器件的Au接合线由Au基体和功能添加剂组成，包含：所述Au基体合金包含3-15质量ppm的Be，3-40质量ppm的Ca和3-20质量ppm的La和 压扁球的圆度表示Au合金为0.95-1.05。

公开(公告)号：US20130164559A1

公开(公告)日：2013-06-27

申请号：US13392754

申请日：2010-09-09

Applicant: Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

Inventor： Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

IPC: C22C21/00

CPC classification number: H01L24/45 ,  H01L24/43 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T428/12993 ,  H01L2924/01202 ,  H01L2924/01028 ,  H01L2924/01014 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/00013 ,  H01L2924/206

Abstract: [Problem to be Solved]The invention providesa bonding ribbon which can guarantee a uniform fusing over the entire joint area throughout hundreds of thousands of continuous ultrasonic bonding cycles and which can realize an improved bonding strength and which also can avoid being broken while it is looped.[Solution]The aluminum ribbon for ultrasonic bonding is formed of an aluminum alloy with aluminum content of 99 mass % or higher, and this ribbon is characterized in that it is in a shape of an extremely thin tape which is obtained by rolling a wire taken from a multi-stage wire drawing, that an average grain size within the cross section of this ribbon is 5-200 micrometers (μm), that the surface(s) of this extremely thin tape is mirror-finished to an extent that the surface roughness Rz is 2 micrometers (μm) or smaller, and that the ribbon has been subjected to an immersion treatment or a gas-exposure treatment wherein the liquid or gas comprises a substance having a vapor pressure higher than water such as a water-soluble hydrocarbons solvent, an alcoholic solvent, a ketone solvent, or an ether type solvent.

Abstract translation: [待解决的问题]本发明提供了一种粘结带，其能够在数十万次连续超声波接合循环中保证在整个接合区域上的均匀熔合，并且可以实现改进的接合强度，并且还可以避免在环路时破坏 。 [解决方案]超声波接合用铝带由铝含量为99质量％以上的铝合金形成，该带的特征在于，其是通过卷绕所获得的线而获得的极薄的带状 从多级拉丝中，该带的横截面内的平均晶粒尺寸为5-200微米（mum），这种非常薄的带的表面被镜面加工到表面 粗糙度Rz为2微米（小时）以下，并且已对带进行了浸渍处理或气体暴露处理，其中液体或气体包括蒸汽压高于水的物质，例如水溶性烃 溶剂，醇溶剂，酮溶剂或醚类溶剂。

公开(公告)号：US08440137B2

公开(公告)日：2013-05-14

申请号：US11791329

申请日：2005-11-22

Applicant: Satoshi Teshima ,  Michitaka Mikami

Inventor： Satoshi Teshima ,  Michitaka Mikami

IPC: C22C5/02 ,  H01L21/60

CPC classification number: C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  Y10T428/12431 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2924/01039 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/01062 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01006

Abstract: An Au bonding wire for semiconductor device, comprising a wire-shaped Au alloy material consisting of: 3-15 mass ppm of Be, 3-40 mass ppm of Ca, 3-20 mass ppm of La, 3-20 mass ppm of at least one functional element selected from the group of Ce, Eu, Mg, and Si, and the remainder of Au, wherein the diameter of said Au alloy bonding wire is less than 23 microns, wherein said bonding wire has improved roundness of compressed bonded ball and improved fracture stress.

Abstract translation: 一种用于半导体器件的Au接合线，包括线状Au合金材料，其由以下组成：3-15质量ppm的Be，3-40质量ppm的Ca，3-20质量ppm的La，3-20质量ppm的 选自Ce，Eu，Mg和Si中的至少一种功能元素，余量为Au，其中所述Au合金接合线的直径小于23微米，其中所述接合线具有改善的压缩粘结球的圆度 并提高骨折应力。