Abstract:
The present disclosure involves a FinFET. The FinFET includes a fin structure formed over a substrate. A gate dielectric layer is least partially wrapped around a segment of the fin structure. The gate dielectric layer contains a high-k gate dielectric material. The FinFET includes a polysilicon layer conformally formed on the gate dielectric layer. The FinFET includes a metal gate electrode layer formed over the polysilicon layer. The present disclosure provides a method of fabricating a FinFET. The method includes providing a fin structure containing a semiconductor material. The method includes forming a gate dielectric layer over the fin structure, the gate dielectric layer being at least partially wrapped around the fin structure. The method includes forming a polysilicon layer over the gate dielectric layer, wherein the polysilicon layer is formed in a conformal manner. The method includes forming a dummy gate layer over the polysilicon layer.
Abstract:
A method includes providing a first mask pattern over a substrate, forming first spacers adjoining sidewalls of the first mask pattern, removing the first mask pattern, forming second spacers adjoining sidewalls of the first spacers, forming a filling layer over the substrate and between the second spacers, and forming a second mask pattern over the substrate.
Abstract:
An apparatus and method, as may be used for predicting solar irradiance variation, are provided. The apparatus may include a solar irradiance predictor processor (10) configured to process a sequence of images (e.g., sky images). The irradiance predictor processor may include a cloud classifier module (18) configured to classify respective pixels of an image of a cloud to indicate a solar irradiance-passing characteristic of at least a portion of the cloud. A cloud motion predictor (22) may be configured to predict motion of the cloud over a time horizon. An event predictor (24) may be configured to predict over the time horizon occurrence of a solar obscuration event. The prediction of the solar obscuration event may be based on the predicted motion of the cloud. The event predictor may include an irradiance variation prediction for the obscuration event based on the solar irradiance-passing characteristic of the cloud.
Abstract:
The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patternable layer over a substrate. The method includes forming a first layer over the patternable layer. The method includes forming a second layer over the first layer. The second layer is substantially thinner than the first layer. The method includes patterning the second layer with a photoresist material through a first etching process to form a patterned second layer. The method includes patterning the first layer with the patterned second layer through a second etching process to form a patterned first layer. The first and second layers have substantially different etching rates during the second etching process. The method includes patterning the patternable layer with the patterned first layer through a third etching process.
Abstract:
The present disclosure provides a method of fabricating a semiconductor device that includes forming a mask layer over a substrate, forming a dummy layer having a first dummy feature and a second dummy feature over the mask layer, forming first and second spacer roofs to cover a top portion of the first and second dummy features, respectively, and forming first and second spacer sleeves to encircle side portions of the first and second dummy features, respectively, removing the first spacer roof and the first dummy feature while protecting the second dummy feature, removing a first end portion and a second end portion of the first spacer sleeve to form spacer fins, and patterning the mask layer using the spacer fins as a first mask element and the second dummy feature as a second mask element.
Abstract:
A method for plasma assisted etching of a polysilicon containing gate electrode to reduce or avoid polysilicon notching at a base portion including providing a semiconducting substrate; forming a gate dielectric layer on the semiconducting substrate; forming a polysilicon layer on the gate dielectric; patterning a photoresist layer over the polysilicon layer for etching a gate electrode; carrying out a first plasma assisted etch process to etch through a major thickness portion of the polysilicon layer; carrying out a first inert gas plasma treatment; carrying out a second plasma assisted etch process to include exposing portions of the underlying gate dielectric layer; carrying out a second inert gas plasma treatment; and, carrying out a third plasma assisted etch process to fully expose the underlying gate dielectric layer adjacent either side of the gate electrodes.
Abstract:
Partial photoresist etching is disclosed. A film on a semiconductor wafer includes a hard mask, doped polysilicon below the hard mask, undoped polysilicon below the doped polysilicon, and a stop layer below the undoped polysilicon. Photoresist etching is performed through the hard mask and the doped polysilicon by using a photoresist mask. After the photoresist mask is removed, photoresist-free etching is performed through the undoped polysilicon through to the stop layer by using the hard mask. A semiconductor device is disclosed that may be fabricated using this partial photoresist etching process.
Abstract:
The present invention provides an herbal composition for improving blood circulation and treating patients with coronary heart diseases and stroke. The herbal composition comprises 30-50 wt % of Dang Gui root (Radix Angelicae sinensis), 35-65 wt % of Chuan Xiong root (Radix Ligustici Chuanxiong), and 7-13 wt % of Ginseng root (Radix Ginseng). The present invention also provides methods of preparing the same.
Abstract:
An apparatus and method, as may be used for predicting solar irradiance variation, are provided. The apparatus may include a solar irradiance predictor processor (10) configured to process a sequence of images (e.g., sky images). The irradiance predictor processor may include a cloud classifier module (18) configured to classify respective pixels of an image of a cloud to indicate a solar irradiance-passing characteristic of at least a portion of the cloud. A cloud motion predictor (22) may be configured to predict motion of the cloud over a time horizon. An event predictor (24) may be configured to predict over the time horizon occurrence of a solar obscuration event. The prediction of the solar obscuration event may be based on the predicted motion of the cloud. The event predictor may include an irradiance variation prediction for the obscuration event based on the solar irradiance-passing characteristic of the cloud.
Abstract:
The disclosure relates to a dummy gate electrode of a semiconductor device. An embodiment comprises a substrate comprising a first surface; an insulation region covering a portion of the first surface, wherein the top of the insulation region defines a second surface; and a dummy gate electrode over the second surface, wherein the dummy gate electrode comprises a bottom and a base broader than the bottom, wherein a ratio of a width of the bottom to a width of the base is from about 0.5 to about 0.9.