公开(公告)号：US20110008949A1

公开(公告)日：2011-01-13

申请号：US12830543

申请日：2010-07-06

Applicant: Toshimasa SUGIMURA ,  Tomokazu Takahashi ,  Noriyoshi Kawashima ,  Fumiteru Asai

Inventor： Toshimasa SUGIMURA ,  Tomokazu Takahashi ,  Noriyoshi Kawashima ,  Fumiteru Asai

IPC: H01L21/78 ,  C09J7/02

CPC classification number: C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2400/226 ,  C09J2423/006 ,  C09J2467/006 ,  C09J2479/086 ,  Y10T428/264 ,  Y10T428/269 ,  Y10T428/2848

Abstract: An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.

Abstract translation: 用于切割具有层压板的半导体晶片的粘合片包括： 基膜，中间层和粘合剂层，中间层由熔点为50〜100℃的热塑性树脂形成。 并且基膜具有比中间层更高的熔点以及用于切割半导体晶片的方法，包括以下步骤：将根据上述的粘合片粘合到半导体晶片的波纹状表面，并且切割半导体晶片 。

公开(公告)号：US20100255299A1

公开(公告)日：2010-10-07

申请号：US12752403

申请日：2010-04-01

Applicant: Noriyoshi KAWASHIMA ,  Fumiteru ASAI

Inventor： Noriyoshi KAWASHIMA ,  Fumiteru ASAI

IPC: C09J7/02 ,  C09J5/06

CPC classification number: H01L21/6836 ,  B32B3/28 ,  B32B3/30 ,  B32B7/06 ,  B32B25/042 ,  B32B25/06 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/10 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/283 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B29/06 ,  B32B2255/10 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/50 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/29 ,  C09J2203/326 ,  C09J2467/006 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/2848

Abstract: The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surface of a semiconductor wafer a pressure-sensitive adhesive sheet for semiconductor wafer protection including a substrate, at least one interlayer, and a pressure-sensitive adhesive layer superposed in this order, in which the pressure-sensitive adhesive sheet is applied to the semiconductor wafer at an application temperature in the range of from 50° C. to 100° C. and the interlayer in contact with the pressure-sensitive adhesive layer has a loss tangent (tan δ) of 0.5 or larger at the application temperature.

Abstract translation: 本发明提供一种涂布半导体晶片保护用粘合片的方法，该方法包括向半导体晶片的表面施加用于半导体晶片保护的压敏粘合片，包括基板，至少一层，以及 粘合剂层按照该顺序重叠，其中将压敏粘合片在50℃至100℃的范围内施加到半导体晶片上，并且与 压敏粘合剂层在施加温度下的损耗角正切（tanδ）为0.5以上。

公开(公告)号：US20110008597A1

公开(公告)日：2011-01-13

申请号：US12834541

申请日：2010-07-12

Applicant: Fumiteru ASAI ,  Takatoshi SASAKI ,  Noriyoshi KAWASHIMA

Inventor： Fumiteru ASAI ,  Takatoshi SASAKI ,  Noriyoshi KAWASHIMA

IPC: C09J7/02 ,  B32B7/02

CPC classification number: H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6835 ,  H01L2221/68327 ,  Y10T428/2495 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891

Abstract: A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 μm height on its surface.

Abstract translation: 表面保护片包括在基膜的一侧具有多层的粘合剂层，所述粘合层具有10℃至100MPa的25℃的储能弹性模量和相对于硅镜晶片的粘合强度 在剥离表面保护片时为1.0N / 20mm以下。 表面保护片用于其表面上具有10至150μm高的突出电极的半导体晶片。

公开(公告)号：US20090221215A1

公开(公告)日：2009-09-03

申请号：US12394762

申请日：2009-02-27

Applicant: Noriyoshi Kawashima ,  Fumiteru Asai

Inventor： Noriyoshi Kawashima ,  Fumiteru Asai

IPC: B32B7/12 ,  B24B1/00

CPC classification number: H01L21/304 ,  C09J7/29 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2431/006 ,  C09J2433/00 ,  C09J2433/006 ,  H01L21/6835 ,  H01L2221/6834 ,  Y10T428/28

Abstract: The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 μm. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer.

Abstract translation: 本发明提供了一种用于研磨半导体晶片的背面的粘合片，当半导体晶片的背面被研磨时，半导体晶片的后表面将粘附到半导体晶片的电路形成表面，其中粘合片含有粘合层 ，中间层和基板，从电路形成表面侧开始，中间层的JIS-A硬度大于55至小于80，中间层的厚度为300-600μm。 此外，本发明还提供了一种用于研磨半导体晶片的背面的方法，包括将上述粘合片粘合到半导体晶片的电路形成表面，随后研磨半导体晶片的背表面。

公开(公告)号：US20080238137A1

公开(公告)日：2008-10-02

申请号：US11905390

申请日：2007-09-28

Applicant: Kenji Kobayashi ,  Noriyoshi Kawashima ,  Mitsuhiro Takahara ,  Masanori Aritake

Inventor： Kenji Kobayashi ,  Noriyoshi Kawashima ,  Mitsuhiro Takahara ,  Masanori Aritake

IPC: B60J10/00

CPC classification number: B60J10/84 ,  B60J10/248 ,  B60J10/32 ,  B60J10/34 ,  B60J10/76 ,  B60J10/86

Abstract: The weather strip of the invention has an attachment base and a sealing part to be integrally attached to the attachment base for sealing a gap between a vehicle body opening open/close member and a vehicle body opening part. The attachment base has a substantially U-shaped section or a substantially J-shaped section that is formed of a vehicle exterior side wall, a vehicle interior side wall, and a bottom wall, and a sealant member formed from an adhesive material is attached to an inner surface of the attachment base having the substantially U-shaped section or the substantially J-shaped section. The tip of the flange is inserted into an inner part of the sealant member, and the attachment base is attached by an adhesion force of the sealant member.

Abstract translation: 本发明的防风条具有安装基座和密封部件，其一体地附接到安装基座，用于密封车体开口打开/关闭部件和车身开启部件之间的间隙。 安装基座具有由车辆外侧壁，车辆内侧壁和底壁形成的大致U形截面或大致J字形的部分，并且由粘合剂材料形成的密封剂构件附接到 附接基座的内表面具有基本上U形的部分或基本上为J形的部分。 凸缘的前端插入到密封剂构件的内部，并且通过密封剂构件的粘附力附接安装底座。