公开(公告)号：US12279466B2

公开(公告)日：2025-04-15

申请号：US17428988

申请日：2020-02-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Franz Eberhard

IPC: H10H20/857 ,  H10H20/01 ,  H10H20/831

Abstract: An optoelectronic semiconductor device may include a first and second semiconductor layer having a first and second conductivity type, respectively, a first contact structure, a contact layer, and a separating layer. Contact holes are arranged in the separating layer. The optoelectronic semiconductor device may include portions of a conductive layer arranged over a side of the separating layer facing away from the contact layer. The portions of the conductive layer are each connected to a conducting material in the contact holes. The first contact structure is connected to the contact layer via the portions of the conductive layer and the conducting material. A length of each of the portions is greater than a greatest width of the portions. The length denotes a shortest distance between an associated contact hole and a conductive material between adjacent portions, and the width is measured perpendicular to the length.

公开(公告)号：US12278194B2

公开(公告)日：2025-04-15

申请号：US17602051

申请日：2020-04-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl

IPC: H01L27/15 ,  H01L23/544 ,  H01L25/16 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H10H20/857

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip and an electronic first storage medium. The first storage medium electrically stores first component information. The component can be uniquely identified via the first component information. The optoelectronic component also includes a second storage medium which can be read out wirelessly at least in an unmounted state of the component. The second storage medium stores second component information that is representative of the first component information.

公开(公告)号：US12266744B2

公开(公告)日：2025-04-01

申请号：US17284825

申请日：2018-10-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mei See Boon ,  Hui Chiang Teoh ,  Tomin Liu ,  Hui Ying Pee ,  Asliza Alias ,  Lay Teng Tan ,  Yuan Liang ,  Alex Kheng Hooi Lim ,  Wing Yew Wong

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/62

Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

公开(公告)号：US12261409B2

公开(公告)日：2025-03-25

申请号：US17441868

申请日：2020-03-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sven Gerhard ,  Bernhard Stojetz

IPC: H01S5/00 ,  H01S5/02 ,  H01S5/10 ,  H01S5/12 ,  H01S5/20 ,  H01S5/22 ,  H01S5/026

Abstract: The invention relates to an edge-emitting semiconductor laser diode, having: —a semiconductor layer sequence, which comprises a bottom surface, a ridge waveguide on a top surface facing away from the bottom surface, and a side surface which is arranged transverse to the top surface, and —a first recess, which extends from the bottom surface to the top surface, wherein —a first region of the semiconductor layer sequence is removed from the side surface in the region of the first recess. The invention further relates to a method for producing a plurality of edge-emitting semiconductor laser diodes.

公开(公告)号：US12261256B2

公开(公告)日：2025-03-25

申请号：US17430254

申请日：2020-02-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Hubert Halbritter ,  Erwin Lang ,  Julia Stolz ,  Andreas Rausch ,  Simon Schwalenberg

IPC: H01L33/50 ,  H01L33/60

Abstract: The invention relates to various aspects of an optoelectronic component or an arrangement comprising such a component for various applications, in particular in the automotive sector and for visual displays. The arrangements are characterized by simple manufacture and fast switching times.

公开(公告)号：US12256629B2

公开(公告)日：2025-03-18

申请号：US17531382

申请日：2021-11-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Maxim Tchoul

IPC: H10K85/10 ,  C09K11/77 ,  H01L33/50 ,  H10K50/11 ,  H10K71/00 ,  H10K101/10 ,  H10K102/00

Abstract: A method for preparing a wavelength converting film is disclosed. The method comprising mixing at least one phosphor, a polysiloxane and optionally an organic solvent, thereby preparing a mixture, placing the mixture on a substrate, pre-curing the mixture on the substrate, thereby preparing a wavelength converting film. Furthermore, a wavelength converting film is disclosed, a method for preparing a light-emitting device and a light-emitting device.

公开(公告)号：US12205522B2

公开(公告)日：2025-01-21

申请号：US17677857

申请日：2022-02-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thorsten Baumheinrich ,  Peter Brick ,  Jean-Jacques Drolet ,  Hubert Halbritter ,  Laura Kreiner ,  Jens Richter ,  Thomas Schwarz ,  Paul Ta ,  Kilian Regau ,  Christopher Soell ,  Hoa Vu ,  Christopher Wiesmann ,  Patrick Hoerner ,  Jong Park ,  Kanishk Chand

IPC: G09G3/32 ,  B60K35/00 ,  B60K35/22 ,  G09G5/10

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US12199224B2

公开(公告)日：2025-01-14

申请号：US17421950

申请日：2020-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Jens Eberhard

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

Abstract: In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

公开(公告)号：US12199222B2

公开(公告)日：2025-01-14

申请号：US17824429

申请日：2022-05-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Xue Wang ,  Petrus Sundgren ,  Laura Kreiner

IPC: H01L33/52 ,  B60K35/00 ,  B60K35/22 ,  H01L25/075 ,  H01L33/04 ,  H01L33/50 ,  H01L33/60

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US12198606B2

公开(公告)日：2025-01-14

申请号：US17515057

申请日：2021-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thorsten Baumheinrich ,  Peter Brick ,  Jean-Jacques Drolet ,  Hubert Halbritter ,  Laura Kreiner ,  Jens Richter ,  Thomas Schwarz ,  Paul Ta ,  Kilian Regau ,  Christopher Soell ,  Hoa Vu ,  Christopher Wiesmann ,  Patrick Hoerner ,  Jong Park ,  Kanishk Chand

IPC: G09G3/32 ,  B60K35/00 ,  G09G5/10 ,  B60K35/22

Abstract: Disclosed are various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.