公开(公告)号：US12199224B2

公开(公告)日：2025-01-14

申请号：US17421950

申请日：2020-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Jens Eberhard

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

Abstract: In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

公开(公告)号：US20220029074A1

公开(公告)日：2022-01-27

申请号：US17421950

申请日：2020-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Jens Eberhard

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L33/00

Abstract: In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.

公开(公告)号：US20190189855A1

公开(公告)日：2019-06-20

申请号：US16221872

申请日：2018-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Tobias Gebuhr ,  Artöm Khassanov

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L21/02 ,  G03F7/16 ,  G02B6/42

CPC classification number: H01L33/44 ,  G02B6/4239 ,  G03F7/165 ,  H01L21/02126 ,  H01L33/504 ,  H01L33/52

Abstract: An optoelectronic device includes an active layer stack that generates or detects radiation, a radiation entrance or radiation exit surface including an inorganic material, and a protective layer disposed over the radiation entrance or radiation exit surface and including chemical compounds each containing an anchor group and a head group, wherein the anchor group is bonded to the inorganic material, and an encapsulation laterally surrounding at least the active layer stack or at least the active layer stack and the protective layer.

公开(公告)号：US20190181303A1

公开(公告)日：2019-06-13

申请号：US16326985

申请日：2017-08-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Richard Scheicher

IPC: H01L33/46 ,  H01L33/60 ,  H01L33/40

Abstract: An optoelectronic device includes at least one optoelectronic semiconductor chip that emits radiation, at least one metallic reflecting surface, at least one functional component having a component surface different from the metallic reflecting surface, and a barrier layer stack for protection against corrosive gases arranged both on the at least one metallic reflecting surface and the component surface, wherein the barrier layer stack includes at least one inorganic oxide, oxynitride or nitride layer and at least one plasma-polymerized siloxane layer.

公开(公告)号：US10243110B2

公开(公告)日：2019-03-26

申请号：US15555964

申请日：2016-03-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel ,  Gudrun Lindberg

IPC: H01L21/44 ,  H01L33/44 ,  C09D183/08 ,  C08G77/385 ,  G02B6/42

Abstract: The invention relates to an optoelectronic device (1) comprising at least one outer surface (2) containing silicone (20), chemical compounds, comprising an anchor group (3) and a head group (4), being bonded to the silicone via the anchor group, and the adhesion of the regions of the silicone (2) present on the outer surface being reduced owing to the head groups of the chemical compounds. A method for producing an optoelectronic device is also disclosed.

公开(公告)号：US20220262990A1

公开(公告)日：2022-08-18

申请号：US17616913

申请日：2020-05-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel

IPC: H01L33/56 ,  H01L33/60 ,  H01L23/31 ,  H01L33/62 ,  H01L23/498 ,  H01L23/29

Abstract: In an embodiment an optoelectronic component includes a carrier having a mounting surface including a reflective coating, a semiconductor chip arranged on the carrier and a corrosion protection layer located on the semiconductor chip, the semiconductor chip being arranged in a vertical direction between the reflective coating and the corrosion protection layer, wherein the reflective coating includes a barrier layer disposed in the vertical direction in places between the semiconductor chip and the reflective coating, wherein the barrier layer includes an inorganic material and serves as an additional corrosion protection layer for the reflective coating, wherein the barrier layer has a vertical layer thickness between 1 nm and 100 nm, inclusive, and wherein the corrosion protection layer has a vertical layer thickness between 10 nm and 5000 nm, inclusive.

公开(公告)号：US20190157525A1

公开(公告)日：2019-05-23

申请号：US16091321

申请日：2017-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Reeswinkel

IPC: H01L33/56 ,  H01L27/02 ,  H01L33/62 ,  H01L33/60 ,  H01L23/00

CPC classification number: H01L33/56 ,  H01L24/73 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.