Abstract:
A low noise (1/f) junction field effect transistor (JFET) is disclosed, wherein multiple implants push a conduction path of the transistor away from the surface of a layer upon which the transistor is formed. In this manner, current flow in the conduction path is less likely to be disturbed by defects that may exist at the surface of the layer, thereby mitigating (1/f) noise.
Abstract:
The disclosure herein pertains to fashioning a low noise junction field effect transistor (JFET) where transistor gate materials are utilized in forming and electrically isolating active areas of a the JFET. More particularly, active regions are self aligned with patterned gate electrode material and sidewall spacers which facilitate desirably locating the active regions in a semiconductor substrate. This mitigates the need for additional materials in the substrate to isolate the active regions from one another, where such additional materials can introduce noise into the JFET. This also allows a layer of gate dielectric material to remain over the surface of the substrate, where the layer of gate dielectric material provides a substantially uniform interface at the surface of the substrate that facilitates uninhibited current flow between the active regions, and thus promotes desired device operation.
Abstract:
An n-type isolation structure is disclosed which includes an n-type BISO layer in combination with a shallow n-well, in an IC. The n-type BISO layer is formed by implanting n-type dopants into a p-type IC substrate in addition to a conventional n-type buried layer (NBL), prior to growth of a p-type epitaxial layer. The n-type dopants in the BISO implanted layer diffuse upward from the p-type substrate to between one-third and two-thirds of the thickness of the p-type epitaxial layer. The shallow n-type well extends from a top surface of the p-type epitaxial layer to the n-type BISO layer, forming a continuous n-type isolation structure from the top surface of the p-type epitaxial layer to the p-type substrate. The width of the n-type BISO layer may be less than the thickness of the epitaxial layer, and may be used alone or with the NBL to isolate components in the IC.
Abstract:
The disclosure herein pertains to fashioning a low noise junction field effect transistor (JFET) where transistor gate materials are utilized in forming and electrically isolating active areas of a the JFET. More particularly, active regions are self aligned with patterned gate electrode material and sidewall spacers which facilitate desirably locating the active regions in a semiconductor substrate. This mitigates the need for additional materials in the substrate to isolate the active regions from one another, where such additional materials can introduce noise into the JFET. This also allows a layer of gate dielectric material to remain over the surface of the substrate, where the layer of gate dielectric material provides a substantially uniform interface at the surface of the substrate that facilitates uninhibited current flow between the active regions, and thus promotes desired device operation.
Abstract:
The leakage current of an OTP-EPROM cell formed using buried channel PMOS technology can be reduced. The reduction in leakage current of the OTP-EPROM can be achieved by blocking implantation of the Vtp implant into a channel region of an n-well that substantially underlies a floating gate structure. The Vtp implant can be blocked by providing a mask overlying the surface of the channel region of the n-well during implantation of the Vtp implant.
Abstract:
Methods of fabrication and devices include field plates formed during capacitor formation. Isolation structures are formed in a semiconductor substrate. Well regions are formed in the semiconductor substrate. Drain extension regions are formed in the well regions. A gate dielectric layer is formed over the device. A gate electrode layer is formed that serves as the gate electrode and a bottom capacitor plate. The gate electrode and the gate dielectric layer are patterned to form gate structures. Source and drain regions are formed within the well regions and the drain extension regions. A silicide blocking layer is formed that also serves as a capacitor dielectric. Field plates and a top capacitor plate are formed on the blocking layer.
Abstract:
A transistor can be fabricated to exhibit reduced channel hot carrier effects. According to one aspect of the present invention, a method for fabricating a transistor structure includes implanting a first dopant into a lightly doped drain (LDD) region to form a shallow region therein. The first dopant penetrates the substrate to a depth that is less than the LDD junction depth. A second dopant is implanted into the substrate beyond the LDD junction depth to form a source/drain region. The implantation of the second dopant overpowers a substantial portion of the first dopant to define a floating ring in the LDD region that mitigates channel hot carrier effects.
Abstract:
A junction field-effect transistor (JFET) includes a substrate having a first-type semiconductor surface including a topside surface, and a top gate of a second-type formed in the semiconductor surface. A first-type drain and a first-type source are formed on opposing sides of the top gate. A first deep trench isolation region has an inner first trench wall and an outer first trench wall surrounding the top gate, the drain and the source, and extends vertically to a deep trench depth from the topside surface. A second-type sinker formed in semiconductor surface extends laterally outside the outer first trench wall. The sinker extends vertically from the topside surface to a second-type deep portion which is both below the deep trench depth and laterally inside the inner first trench wall to provide a bottom gate.
Abstract:
A low noise (1/f) junction field effect transistor (JFET) is disclosed, wherein multiple implants push a conduction path of the transistor away from the surface of a layer upon which the transistor is formed. In this manner, current flow in the conduction path is less likely to be disturbed by defects that may exist at the surface of the layer, thereby mitigating (1/f) noise.
Abstract:
Fashioning a low noise (1/f) junction field effect transistor (JFET) is disclosed, where multiple implants are performed to push a conduction path of the transistor away from the surface of a layer upon which the transistor is formed. In this manner, current flow in the conduction path is less likely to be disturbed by defects that may exist at the surface of the layer, thereby mitigating (1/f) noise.