公开(公告)号：US09076760B2

公开(公告)日：2015-07-07

申请号：US13597439

申请日：2012-08-29

申请人： Binghua Hu ,  Pinghai Hao ,  Sameer Pendharkar

发明人： Binghua Hu ,  Pinghai Hao ,  Sameer Pendharkar

IPC分类号： G01R31/26 ,  H01L29/417 ,  H01L21/00 ,  H01L29/423 ,  H01L29/808 ,  H01L29/06 ,  H01L29/10

CPC分类号： H01L29/41725 ,  G06F2101/00 ,  G06F2201/00 ,  H01L21/00 ,  H01L29/0692 ,  H01L29/1066 ,  H01L29/42316 ,  H01L29/808

摘要： A junction field-effect transistor (JFET) includes a substrate having a first-type semiconductor surface including a topside surface, and a top gate of a second-type formed in the semiconductor surface. A first-type drain and a first-type source are formed on opposing sides of the top gate. A first deep trench isolation region has an inner first trench wall and an outer first trench wall surrounding the top gate, the drain and the source, and extends vertically to a deep trench depth from the topside surface. A second-type sinker formed in semiconductor surface extends laterally outside the outer first trench wall. The sinker extends vertically from the topside surface to a second-type deep portion which is both below the deep trench depth and laterally inside the inner first trench wall to provide a bottom gate.

摘要翻译： 结型场效应晶体管（JFET）包括具有包括顶侧表面的第一类型半导体表面的衬底和形成在半导体表面中的第二类型的顶栅。 第一型漏极和第一型源形成在顶栅的相对侧上。 第一深沟槽隔离区域具有围绕顶部栅极，漏极和源极的内部第一沟槽壁和外部第一沟槽壁，并且从顶侧表面垂直延伸到深沟槽深度。 形成在半导体表面中的第二类型沉降片在外部第一沟槽壁的外侧横向延伸。 沉降片从顶侧表面垂直延伸到第二类型深部，该深部位于深沟槽深度的下方并且在内部第一沟槽壁的横向内部以提供底部门。

公开(公告)号：US08399924B2

公开(公告)日：2013-03-19

申请号：US13160759

申请日：2011-06-15

申请人： Pinghai Hao ,  Sameer Pendharkar ,  Binghua Hu ,  Qingfeng Wang

发明人： Pinghai Hao ,  Sameer Pendharkar ,  Binghua Hu ,  Qingfeng Wang

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/0847 ,  H01L21/266 ,  H01L21/823412 ,  H01L21/823418 ,  H01L29/0634 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/66659 ,  H01L29/7835

摘要： An integrated circuit containing an extended drain MOS transistor may be formed by forming a drift region implant mask with mask fingers abutting a channel region and extending to the source/channel active area, but not extending to a drain contact active area. Dopants implanted through the exposed fingers form lateral doping striations in the substrate under the mask fingers. An average doping density of the drift region under the gate is at least 25 percent less than an average doping density of the drift region at the drain contact active area. In one embodiment, the dopants diffuse laterally to form a continuous drift region. In another embodiment, substrate material between lateral doping striations remains an opposite conductivity type from the lateral doping striations.

公开(公告)号：US20110309440A1

公开(公告)日：2011-12-22

申请号：US13160759

申请日：2011-06-15

申请人： Pinghai Hao ,  Sameer Pendharkar ,  Binghua Hu ,  Qingfeng Wang

发明人： Pinghai Hao ,  Sameer Pendharkar ,  Binghua Hu ,  Qingfeng Wang

IPC分类号： H01L27/088 ,  H01L21/8234

CPC分类号： H01L29/0847 ,  H01L21/266 ,  H01L21/823412 ,  H01L21/823418 ,  H01L29/0634 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/66659 ,  H01L29/7835

摘要： An integrated circuit containing an extended drain MOS transistor may be formed by forming a drift region implant mask with mask fingers abutting a channel region and extending to the source/channel active area, but not extending to a drain contact active area. Dopants implanted through the exposed fingers form lateral doping striations in the substrate under the mask fingers. An average doping density of the drift region under the gate is at least 25 percent less than an average doping density of the drift region at the drain contact active area. In one embodiment, the dopants diffuse laterally to form a continuous drift region. In another embodiment, substrate material between lateral doping striations remains an opposite conductivity type from the lateral doping striations.

摘要翻译： 包含扩展漏极MOS晶体管的集成电路可以通过形成具有掩模手指的沟道区域的漂移区域注入掩模来形成，并且延伸到源极/沟道有源区，但不延伸到漏极接触有源区。 通过暴露的指状物注入的掺杂剂在掩模指下面的衬底中形成横向掺杂条纹。 栅极下方的漂移区域的平均掺杂密度比漏极接触有效面积处的漂移区域的平均掺杂密度小至少25％。 在一个实施例中，掺杂剂横向漫射以形成连续漂移区域。 在另一个实施例中，横向掺杂条纹之间的衬底材料与横向掺杂条纹保持相反的导电类型。

公开(公告)号：US20060286741A1

公开(公告)日：2006-12-21

申请号：US11154431

申请日：2005-06-16

申请人： Shanjen Pan ,  Sameer Pendharkar ,  Pinghai Hao ,  James Todd

发明人： Shanjen Pan ,  Sameer Pendharkar ,  Pinghai Hao ,  James Todd

IPC分类号： H01L21/8244

CPC分类号： H01L27/0629 ,  H01L29/1083 ,  H01L29/402 ,  H01L29/66659 ,  H01L29/7835

摘要： Methods of fabrication and devices include field plates formed during capacitor formation. Isolation structures are formed in a semiconductor substrate. Well regions are formed in the semiconductor substrate. Drain extension regions are formed in the well regions. A gate dielectric layer is formed over the device. A gate electrode layer is formed that serves as the gate electrode and a bottom capacitor plate. The gate electrode and the gate dielectric layer are patterned to form gate structures. Source and drain regions are formed within the well regions and the drain extension regions. A silicide blocking layer is formed that also serves as a capacitor dielectric. Field plates and a top capacitor plate are formed on the blocking layer.

摘要翻译： 制造方法和器件包括在电容器形成期间形成的场板。 在半导体衬底中形成隔离结构。 在半导体衬底中形成阱区。 在阱区域中形成漏极延伸区域。 在器件上形成栅极电介质层。 形成用作栅电极和底电容器板的栅极电极层。 对栅极电极和栅极介电层进行图案化以形成栅极结构。 源区和漏区形成在阱区和漏极延伸区内。 形成也用作电容器电介质的硅化物阻挡层。 在阻挡层上形成场板和顶部电容器板。

公开(公告)号：US20050215018A1

公开(公告)日：2005-09-29

申请号：US11135544

申请日：2005-05-24

申请人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

发明人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

IPC分类号： H01L21/265 ,  H01L21/336 ,  H01L21/338 ,  H01L29/02 ,  H01L29/08 ,  H01L29/78 ,  H01L47/00

CPC分类号： H01L29/0847 ,  H01L21/26586 ,  H01L29/6659 ,  H01L29/7833

摘要： A transistor can be fabricated to exhibit reduced channel hot carrier effects. According to one aspect of the present invention, a method for fabricating a transistor structure includes implanting a first dopant into a lightly doped drain (LDD) region to form a shallow region therein. The first dopant penetrates the substrate to a depth that is less than the LDD junction depth. A second dopant is implanted into the substrate beyond the LDD junction depth to form a source/drain region. The implantation of the second dopant overpowers a substantial portion of the first dopant to define a floating ring in the LDD region that mitigates channel hot carrier effects.

摘要翻译： 可以制造晶体管以显示减少的通道热载体效应。 根据本发明的一个方面，制造晶体管结构的方法包括将第一掺杂剂注入到轻掺杂漏极（LDD）区域中以在其中形成浅区域。 第一掺杂剂将衬底渗透至小于LDD结深度的深度。 将第二掺杂剂注入超过LDD结深度的衬底中以形成源/漏区。 第二掺杂剂的注入超过第一掺杂剂的大部分，以限定LDD区域中的浮动环，其缓和了通道热载流子效应。

公开(公告)号：US07989853B2

公开(公告)日：2011-08-02

申请号：US12537589

申请日：2009-08-07

申请人： Pinghai Hao ,  Sameer Pendharkar ,  Philip L. Hower ,  Marie Denison

发明人： Pinghai Hao ,  Sameer Pendharkar ,  Philip L. Hower ,  Marie Denison

IPC分类号： H01L29/66 ,  H01L21/337

CPC分类号： H01L27/098 ,  H01L29/0649 ,  H01L29/1058 ,  H01L29/402 ,  H01L29/808

摘要： A dual channel JFET which can be integrated in an IC without adding process steps is disclosed. Pinch-off voltage is determined by lateral width of a first, vertical, channel near the source contact. Maximum drain voltage is determined by drain to gate separation and length of a second, horizontal, channel under the gate. Pinch-off voltage and maximum drain potential are dependent on lateral dimensions of the drain and gate wells and may be independently optimized. A method of fabricating the dual channel JFET is also disclosed.

摘要翻译： 公开了可以集成在IC中而不添加工艺步骤的双通道JFET。 夹断电压由源触点附近的第一垂直通道的横向宽度决定。 最大漏极电压由漏极到栅极间隔和栅极下方的第二个水平沟道的长度决定。 夹断电压和最大漏极电位取决于漏极和栅极阱的横向尺寸，并且可以独立优化。 还公开了制造双通道JFET的方法。

公开(公告)号：US07208364B2

公开(公告)日：2007-04-24

申请号：US11154431

申请日：2005-06-16

申请人： Shanjen Pan ,  Sameer Pendharkar ,  Pinghai Hao ,  James R. Todd

发明人： Shanjen Pan ,  Sameer Pendharkar ,  Pinghai Hao ,  James R. Todd

IPC分类号： H01L21/8238

CPC分类号： H01L27/0629 ,  H01L29/1083 ,  H01L29/402 ,  H01L29/66659 ,  H01L29/7835

摘要： Methods of fabrication and devices include field plates formed during capacitor formation. Isolation structures are formed in a semiconductor substrate. Well regions are formed in the semiconductor substrate. Drain extension regions are formed in the well regions. A gate dielectric layer is formed over the device. A gate electrode layer is formed that serves as the gate electrode and a bottom capacitor plate. The gate electrode and the gate dielectric layer are patterned to form gate structures. Source and drain regions are formed within the well regions and the drain extension regions. A silicide blocking layer is formed that also serves as a capacitor dielectric. Field plates and a top capacitor plate are formed on the blocking layer.

摘要翻译： 制造方法和器件包括在电容器形成期间形成的场板。 在半导体衬底中形成隔离结构。 在半导体衬底中形成阱区。 在阱区域中形成漏极延伸区域。 在器件上形成栅极电介质层。 形成用作栅电极和底电容器板的栅极电极层。 对栅极电极和栅极介电层进行图案化以形成栅极结构。 源区和漏区形成在阱区和漏极延伸区内。 形成也用作电容器电介质的硅化物阻挡层。 在阻挡层上形成场板和顶部电容器板。

公开(公告)号：US20050064670A1

公开(公告)日：2005-03-24

申请号：US10669111

申请日：2003-09-23

申请人： Shanjen Pan ,  James Todd ,  Sameer Pendharkar ,  Tsutomu Kubota ,  Pinghai Hao

发明人： Shanjen Pan ,  James Todd ,  Sameer Pendharkar ,  Tsutomu Kubota ,  Pinghai Hao

IPC分类号： H01L21/336 ,  H01L29/06 ,  H01L29/08 ,  H01L29/10 ,  H01L29/423 ,  H01L29/45 ,  H01L29/49 ,  H01L29/78

CPC分类号： H01L29/66659 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/0852 ,  H01L29/1033 ,  H01L29/1083 ,  H01L29/1087 ,  H01L29/42368 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/7835

摘要： Depletion drain-extended MOS transistor devices and fabrication methods for making the same are provided, in which a compensated channel region is provided with p and n type dopants to facilitate depletion operation at Vgs=0, and an adjust region is implanted in the substrate proximate the channel side end of the thick gate dielectric structure for improved breakdown voltage rating. The compensated channel region is formed by overlapping implants for an n-well and a p-well, and the adjust region is formed using a Vt adjust implant with a mask exposing the adjust region.

摘要翻译： 提供消耗漏极扩展MOS晶体管器件及其制造方法，其中补偿沟道区域设置有p型和n型掺杂剂以便于在Vgs = 0时耗尽操作，并且将调整区域注入到衬底中 厚栅电介质结构的通道侧端用于提高击穿电压额定值。 补偿通道区域由n阱和p阱的重叠植入物形成，并且使用具有暴露调整区域的掩模的Vt调整植入物形成调整区域。

公开(公告)号：US07235451B2

公开(公告)日：2007-06-26

申请号：US10378402

申请日：2003-03-03

申请人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

发明人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

IPC分类号： H01L21/336

CPC分类号： H01L29/66659 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/0847 ,  H01L29/7835

摘要： Semiconductor devices and manufacturing methods therefor are disclosed, in which a drain-extended MOS transistor comprises a self-aligned floating region proximate one end of the transistor gate and doped with a first type dopant to reduce channel hot carrier degradation, as well as an oppositely doped first source/drain laterally spaced from the first end of the gate structure in a semiconductor body. The device may further comprise a resurf region doped to a lower concentration than the floating region to facilitate improved breakdown voltage performance. A method of fabricating a drain-extended MOS transistor in a semiconductor device is disclosed, comprising providing first dopants to a floating region in a semiconductor body, which is self-aligned with the first end of a gate structure, and providing second dopants to source/drains of the semiconductor body, wherein the first and second dopants are different.

摘要翻译： 公开了半导体器件及其制造方法，其中漏极扩展MOS晶体管包括靠近晶体管栅极的一端的自对准浮置区，并掺杂有第一类型掺杂剂以减少通道热载流子劣化，以及相反地 掺杂的第一源极/漏极在半导体本体中与栅极结构的第一端横向间隔开。 该器件还可以包括掺杂到比浮置区域更低的浓度的复现区域，以便于改进的击穿电压性能。 公开了一种在半导体器件中制造漏极扩展MOS晶体管的方法，包括：向半导体本体中的浮置区域提供第一掺杂物，所述浮置区域与栅极结构的第一端自对准，并提供第二掺杂剂到源极 /半导体主体的漏极，其中第一和第二掺杂剂是不同的。

公开(公告)号：US07135373B2

公开(公告)日：2006-11-14

申请号：US10670434

申请日：2003-09-23

申请人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

发明人： Pinghai Hao ,  Shanjen Pan ,  Sameer Pendharkar

IPC分类号： H01L21/336

CPC分类号： H01L29/0847 ,  H01L21/26586 ,  H01L29/6659 ,  H01L29/7833

摘要： A transistor can be fabricated to exhibit reduced channel hot carrier effects. According to one aspect of the present invention, a method for fabricating a transistor structure includes implanting a first dopant into a lightly doped drain (LDD) region to form a shallow region therein. The first dopant penetrates the substrate to a depth that is less than the LDD junction depth. A second dopant is implanted into the substrate beyond the LDD junction depth to form a source/drain region. The implantation of the second dopant overpowers a substantial portion of the first dopant to define a floating ring in the LDD region that mitigates channel hot carrier effects.