公开(公告)号：US20090052178A1

公开(公告)日：2009-02-26

申请号：US12288376

申请日：2008-10-20

Applicant: Werner Marchl ,  Werner Spath ,  Gunter Waitl

Inventor： Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC: F21V29/00

CPC classification number: H01L25/0753 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00012

Abstract: A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Abstract translation: 包括多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体，其中第一主区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。

公开(公告)号：US07446347B2

公开(公告)日：2008-11-04

申请号：US10362614

申请日：2001-08-22

Applicant: Georg Bogner ,  Herbert Brunner ,  Wolfgang Lex ,  Gunter Waitl

Inventor： Georg Bogner ,  Herbert Brunner ,  Wolfgang Lex ,  Gunter Waitl

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L25/13 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.

Abstract translation: 本发明涉及一种光电子元件，其具有安装在柔性芯片支撑件（6）上的半导体芯片（1），其中用于电连接半导体芯片（1）的导体轨道（3,5）体现在第一 主面，并且在其上设置有填充有辐射透过介质，特别是填充剂化合物的壳体框架（7）。 本发明还公开了一种显示装置，照明或背光装置及其制造方法。

公开(公告)号：US20080265266A1

公开(公告)日：2008-10-30

申请号：US11575705

申请日：2005-09-20

Applicant: Georg Bogner ,  Herbert Brunner ,  Michael Hiegler ,  Gunter Waitl

Inventor： Georg Bogner ,  Herbert Brunner ,  Michael Hiegler ,  Gunter Waitl

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Abstract translation: 公开了一种用于光电子部件的壳体，其包括具有芯片安装表面的载体。 与载体分开制造的光学元件被施加到载体上。 芯片安装表面和光学元件限定了分离平面，载体和光学元件之间的分离平面布置在芯片安装表面的平面内。 还公开了具有这种类型的壳体的光电子部件和这种类型的光电子部件的制造方法。

公开(公告)号：US07435997B2

公开(公告)日：2008-10-14

申请号：US10362554

申请日：2001-08-22

Applicant: Karlheinz Arndt ,  Georg Bogner ,  Herbert Brunner ,  Gunter Waitl

Inventor： Karlheinz Arndt ,  Georg Bogner ,  Herbert Brunner ,  Gunter Waitl

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.

Abstract translation: 在反射器（3）中具有多个发光二极管芯片（5）的装置（1）形成为使得发光二极管芯片（5）之间的直接视线被隔板（11）中断 ）。 这实质上提高了装置（1）的效率。

公开(公告)号：US20070290383A1

公开(公告)日：2007-12-20

申请号：US11894569

申请日：2007-08-20

Applicant: Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

Inventor： Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC: B29D11/00

CPC classification number: G02B3/0031 ,  B29D11/00278 ,  B29D11/00365 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/0056 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

Abstract translation: 公开了一种用于制造适于制造微透镜领域的透镜模具的方法。 该方法包括从由六边形安装件保持的紧密包装的球的一组模制模制透镜模具的步骤。

公开(公告)号：US20060147151A1

公开(公告)日：2006-07-06

申请号：US11314150

申请日：2005-12-21

Applicant: Mario Wanninger ,  Markus Hofmann ,  Gunter Waitl ,  Alexander Wilm

Inventor： Mario Wanninger ,  Markus Hofmann ,  Gunter Waitl ,  Alexander Wilm

IPC: G02B6/10

CPC classification number: G02B6/003 ,  B60Q1/2611 ,  F21S43/14 ,  F21S43/237 ,  F21S43/245 ,  F21S43/247 ,  F21W2103/00 ,  F21W2103/20 ,  F21W2111/00 ,  F21Y2115/10 ,  G02B6/0038 ,  G02B6/0046 ,  G02B6/0055 ,  G02B6/008

Abstract: A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.

Abstract translation: 公开了一种照明装置，其包括设置在载体上的多个半导体光源，其中来自光源的光以与载体的表面法线成设定的角度耦合到指定的光导中，并且光导设置有反射和光出射 使得光输出耦合面的外壳形成曲面段。

公开(公告)号：US20050214968A1

公开(公告)日：2005-09-29

申请号：US10514461

申请日：2004-05-14

Applicant: Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

Inventor： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

IPC: H01L21/52 ,  H01L21/60 ,  H01L23/08 ,  H01L33/62 ,  H01L21/50

CPC classification number: H01L33/62 ,  H01L21/52 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

Abstract translation: 辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。 通过使用以小于10um的层厚施加的低熔点焊料3，可以在很大程度上进行焊接工艺而不会对塑料密封剂5造成热损伤。

公开(公告)号：US20050029929A1

公开(公告)日：2005-02-10

申请号：US10840575

申请日：2004-09-24

Applicant: Alexandra Debray ,  Gunter Waitl ,  Franz Kummer ,  Franz Zwaschka ,  Andries Ellens

Inventor： Alexandra Debray ,  Gunter Waitl ,  Franz Kummer ,  Franz Zwaschka ,  Andries Ellens

IPC: C09K11/78 ,  C09K11/08 ,  C09K11/62 ,  C09K11/77 ,  C09K11/80 ,  H01L33/50 ,  H05B33/14 ,  H01J1/62 ,  H01J63/04

CPC classification number: H01L33/502 ,  C09K11/7769 ,  C09K11/7774 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/14 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The invention proposes an arrangement of luminescent materials for excitation by means of a radiation source and involving the use of a luminescent material having a Ce-activated garnet structure A3B5O12, in which the first component A contains at least one element from the group consisting of Y, Lu, Se, La, Gd, Sm and Tb and the second component B represents at least one of the elements Al, Ga and In, and a plurality of the luminescent materials are mixed together. An associated wavelength-converting casting compound and an associated light-source arrangement are further proposed.

Abstract translation: 本发明提出了一种用于通过辐射源激发的发光材料的布置，并且涉及使用具有Ce活化的石榴石结构A3B5O12的发光材料，其中第一组分A含有至少一种元素，该组分由Y ，Lu，Se，La，Gd，Sm和Tb，第二成分B表示元素Al，Ga和In中的至少一种，多个发光材料混合在一起。 进一步提出了相关联的波长转换铸塑料和相关的光源装置。

公开(公告)号：US07696590B2

公开(公告)日：2010-04-13

申请号：US12055863

申请日：2008-03-26

Applicant: Gunter Waitl ,  Herbert Brunner

Inventor： Gunter Waitl ,  Herbert Brunner

IPC: H01L31/02 ,  H01L21/50

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

Abstract translation: 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。

公开(公告)号：US20080315227A1

公开(公告)日：2008-12-25

申请号：US11631058

申请日：2005-05-18

Applicant: Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

Inventor： Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

Abstract translation: 公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。