BARRIER STRUCTURES AND METHODS OF FORMING SAME TO FACILITATE SILICON CARBIDE EPITAXY AND SILICON CARBIDE-BASED MEMORY FABRICATION
    1.
    发明申请
    BARRIER STRUCTURES AND METHODS OF FORMING SAME TO FACILITATE SILICON CARBIDE EPITAXY AND SILICON CARBIDE-BASED MEMORY FABRICATION 审中-公开
    阻挡层结构及其形成方法来制备碳化硅外壳和基于碳化硅的记忆体制造

    公开(公告)号:US20120056194A1

    公开(公告)日:2012-03-08

    申请号:US12876028

    申请日:2010-09-03

    IPC分类号: H01L29/24 H01L21/20

    摘要: Embodiments of the invention relate generally to semiconductors and semiconductor fabrication techniques, and more particularly, to devices, integrated circuits, substrates, wafers and methods to form barrier structures to facilitate formation of silicon carbide epitaxy on a substrate, such as a silicon-based substrate, for fabricating various silicon carbide-based semiconductor devices, including silicon carbide-based memory elements and cells. In some embodiments, a semiconductor wafer includes a silicon substrate, a barrier-seed layer disposed over the silicon substrate, and a silicon carbide layer formed over the barrier-seed layer. The semiconductor wafer can be used to form a variety of SiC-based semiconductor devices. In one embodiment, a silicon carbide-based memory element is formed to include barrier-seed layer, multiple silicon carbide layers formed over the barrier-seed layer, and a dielectric layer formed over the multiple silicon carbide layers.

    摘要翻译: 本发明的实施例一般涉及半导体和半导体制造技术,更具体地,涉及用于形成阻挡结构以便于在诸如硅基底层之类的衬底上形成碳化硅外延的器件,集成电路,衬底,晶片和方法 ,用于制造各种基于碳化硅的存储元件和电池的基于碳化硅的半导体器件。 在一些实施例中,半导体晶片包括硅衬底,设置在硅衬底上的阻挡种子层和形成在阻挡种子层上的碳化硅层。 半导体晶片可用于形成各种SiC基半导体器件。 在一个实施例中,形成基于碳化硅的存储元件以包括阻挡种子层,在阻挡种子层上形成的多个碳化硅层以及形成在多个碳化硅层上的电介质层。

    SUBSTRATES AND METHODS OF FABRICATING DOPED EPITAXIAL SILICON CARBIDE STRUCTURES WITH SEQUENTIAL EMPHASIS
    2.
    发明申请
    SUBSTRATES AND METHODS OF FABRICATING DOPED EPITAXIAL SILICON CARBIDE STRUCTURES WITH SEQUENTIAL EMPHASIS 审中-公开
    基质和方法制备具有顺序渗透性的掺杂的外延硅碳化物结构

    公开(公告)号:US20110042686A1

    公开(公告)日:2011-02-24

    申请号:US12543478

    申请日:2009-08-18

    IPC分类号: H01L29/24 H01L21/04

    摘要: Embodiments of the invention relate generally to semiconductors and semiconductor fabrication techniques, and more particularly, to devices, integrated circuits, substrates, and methods to form silicon carbide structures, including doped epitaxial layers (e.g., P-doped silicon carbide epitaxial layers), by supplying sources of silicon and carbon with sequential emphasis. In some embodiments, a method of forming an epitaxial layer of silicon carbide can include depositing a layer in the presence of a silicon source, and purging gaseous materials subsequent to depositing the layer. Further, the method can include converting the layer into a sub-layer of silicon carbide in the presence of a carbon source and a dopant, and purging other gaseous materials. In some embodiments, the presence of the silicon source can be independent of the presence of the carbon source and/or the dopant.

    摘要翻译: 本发明的实施例一般涉及半导体和半导体制造技术,更具体地涉及用于形成碳化硅结构的器件,集成电路,衬底和方法,包括掺杂的外延层(例如,P掺杂的碳化硅外延层),由 依次强调硅和碳的供应来源。 在一些实施例中,形成碳化硅外延层的方法可以包括在硅源的存在下沉积层,以及在沉积层之后吹扫气态材料。 此外,该方法可以包括在碳源和掺杂剂的存在下将层转化为碳化硅的子层,并且清除其它气态材料。 在一些实施例中,硅源的存在可以独立于碳源和/或掺杂剂的存在。

    SUBSTRATES AND METHODS OF FABRICATING EPITAXIAL SILICON CARBIDE STRUCTURES WITH SEQUENTIAL EMPHASIS
    3.
    发明申请
    SUBSTRATES AND METHODS OF FABRICATING EPITAXIAL SILICON CARBIDE STRUCTURES WITH SEQUENTIAL EMPHASIS 审中-公开
    基质和方法制备具有顺序渗透性的外源性碳化硅结构

    公开(公告)号:US20110042685A1

    公开(公告)日:2011-02-24

    申请号:US12543473

    申请日:2009-08-18

    IPC分类号: H01L29/24 C30B23/00

    摘要: Embodiments of the invention relate generally to semiconductors and semiconductor fabrication techniques, and more particularly, to devices, integrated circuits, substrates, and methods to form silicon carbide structures, including epitaxial layers, by supplying sources of silicon and carbon with sequential emphasis. In at least some embodiments, a method of forming an epitaxial layer of silicon carbide can include depositing a layer on a substrate in the presence of a silicon source, and purging gaseous materials subsequent to depositing the layer. Further, the method can include converting the layer into a sub-layer of silicon carbide in the presence of a carbon source, and purging other gaseous materials subsequent to converting the layer. The presence of the silicon source can be independent of the presence of the carbon source. In some embodiments, dopants, such as n-type dopants, can be introduced during the formation of the epitaxial layer of silicon carbide.

    摘要翻译: 本发明的实施例一般涉及半导体和半导体制造技术,更具体地涉及通过以顺序强调提供硅和碳的源来形成包括外延层的碳化硅结构的器件,集成电路,衬底和方法。 在至少一些实施例中,形成碳化硅外延层的方法可以包括在硅源的存在下在衬底上沉积层,以及在沉积层之后吹扫气态材料。 此外,该方法可以包括在碳源的存在下将层转化为碳化硅的子层,以及在转换层之后吹扫其它气态材料。 硅源的存在可以独立于碳源的存在。 在一些实施例中,可以在形成碳化硅外延层期间引入掺杂剂,例如n型掺杂剂。

    Method and device for stimulating the brain
    4.
    发明申请
    Method and device for stimulating the brain 有权
    刺激大脑的方法和装置

    公开(公告)号:US20050033380A1

    公开(公告)日:2005-02-10

    申请号:US10910043

    申请日:2004-08-03

    摘要: A method for stimulating a particular area of a brain using a stimulation device includes detecting a spatial structure of a head and determining electrical and/or magnetic properties of at least one part of anatomical structures of the head. An energy amount to be provided by the stimulation device for stimulating the particular area of the brain is calculated automatically based on the spatial structure of the head and the determined electrical and/or magnetic properties of at least one part of the anatomical structures of the head.

    摘要翻译: 使用刺激装置刺激大脑特定区域的方法包括检测头部的空间结构并确定头部的至少一部分解剖结构的电和/或磁性质。 基于头部的空间结构以及头部解剖结构的至少一部分所确定的电和/或磁特性,自动地计算由用于刺激大脑的特定区域的刺激装置提供的能量量 。

    Environmental sensor
    5.
    发明申请
    Environmental sensor 审中-公开
    环境传感器

    公开(公告)号:US20070273394A1

    公开(公告)日:2007-11-29

    申请号:US10558695

    申请日:2004-06-07

    IPC分类号: G01R27/26

    摘要: Multi functional sensors are described. A silicon based sensor utilizes metal layers arranged as resistors around a central pair if resistors separated by a humidity sensitive polymer with one of the central resistors being a heater. This enables temperature humidity wind speed and direction to be measured. In another embodiment an array of resistors is printed onto a flexible substrate to form the basis of an array of sensors. A soil moisture sensor, which is also useful as a leaf wetness sensor, incorporates a novel self calibrating capacitive sensor structure. The flexible substrate is rolled into a stake that can be inserted in the soil so that below ground sensors measure soil moisture and above ground sensors measure temperature, light, humidity, wind speed and direction.

    摘要翻译: 描述了多功能传感器。 硅基传感器利用金属层作为中心对周围的电阻器布置,如果电阻器被湿度敏感的聚合物隔开,其中一个中央电阻器是加热器。 这样可以测量温度湿度风速和方向。 在另一个实施例中,将电阻器阵列印刷到柔性基板上以形成传感器阵列的基础。 土壤湿度传感器也可用作叶湿度传感器,结合了一种新型的自校准电容传感器结构。 将柔性基材卷成可插入土壤的桩,以便地下传感器测量土壤湿度,地上传感器测量温度,光照,湿度,风速和方向。

    Method and device for stimulating the brain
    6.
    发明授权
    Method and device for stimulating the brain 有权
    刺激大脑的方法和装置

    公开(公告)号:US07711431B2

    公开(公告)日:2010-05-04

    申请号:US10910043

    申请日:2004-08-03

    IPC分类号: A61N1/08

    摘要: A method for stimulating a particular area of a brain using a stimulation device includes detecting a spatial structure of a head and determining electrical and/or magnetic properties of at least one part of anatomical structures of the head. An energy amount to be provided by the stimulation device for stimulating the particular area of the brain is calculated automatically based on the spatial structure of the head and the determined electrical and/or magnetic properties of at least one part of the anatomical structures of the head.

    摘要翻译: 使用刺激装置刺激大脑特定区域的方法包括检测头部的空间结构并确定头部的至少一部分解剖结构的电和/或磁性质。 基于头部的空间结构以及头部解剖结构的至少一部分所确定的电和/或磁特性,自动地计算由用于刺激大脑的特定区域的刺激装置提供的能量量 。