SYSTEM AND METHOD FOR AUTONOMOUS SCANNING PROBE MICROSCOPY WITH IN-SITU TIP CONDITIONING

    公开(公告)号:US20220155339A1

    公开(公告)日:2022-05-19

    申请号:US17581888

    申请日:2022-01-22

    IPC分类号: G01Q30/06 G01Q80/00 G06N3/08

    摘要: A method for assessing the quality of a tip of a scanning probe microscope (SPM) includes recording an SPM image, extracting a plurality of images of dangling bonds from the SPM image, feeding the extracted images of dangling bonds into a convolution neural network one image at a time, analyzing each of the plurality of images of dangling bonds using the convolution neural network, assigning each of the plurality of images of dangling bonds one of a sharp tip status or a double tip status, and determining whether the number of the plurality of images of dangling bonds of the SPM image assigned the double tip status exceeds a predetermined threshold. A method of automatically conditioning a tip of a scanning probe microscope (SPM) during imaging of a sample and a method of mass-producing atomistic quantum dots, qubits, or particular atom orbital occupation are also provided.

    AUTOMATED ATOMIC SCALE FABRICATION

    公开(公告)号:US20220130033A1

    公开(公告)日:2022-04-28

    申请号:US17429443

    申请日:2020-02-14

    IPC分类号: G06T7/00 G01Q30/04

    摘要: A method for autonomously applying a dangling bond pattern to a substrate for atom scale device fabrication includes inputting the pattern, initiating a patterning process, scanning the substrate using a scanning probe microscope (SPM) to generate an SPM image of the substrate, feeding the SPM image into a trained convolution neural network (CNN), analyzing the SPM image using the CNN to identify substrate defects, determining a defect free substrate area for pattern application; and applying the pattern to the substrate in that area. An atom scale electronic component includes functional patches on a substrate and wires electrically connecting the functional patches. Training a CNN includes recording a Scanning Tunneling Microscope (STM) image of the substrate, extracting images of defects from the STM image, labeling pixel-wise the defect images, and feeding the extracted and labeled images of defects into a CNN to train the CNN for semantic segmentation.

    SYSTEM AND METHOD FOR AUTONOMOUS SCANNING PROBE MICROSCOPY WITH IN-SITU TIP CONDITIONING

    公开(公告)号:US20210373045A1

    公开(公告)日:2021-12-02

    申请号:US16981512

    申请日:2019-03-19

    IPC分类号: G01Q30/06 G01Q80/00 G06N3/08

    摘要: A method for assessing the quality of a tip of a scanning probe microscope (SPM) includes recording an SPM image, extracting a plurality of images of dangling bonds from the SPM image, feeding the extracted images of dangling bonds into a convolution neural network one image at a time, analyzing each of the plurality of images of dangling bonds using the convolution neural network, assigning each of the plurality of images of dangling bonds one of a sharp tip status or a double tip status, and determining whether the number of the plurality of images of dangling bonds of the SPM image assigned the double tip status exceeds a predetermined threshold. A method of automatically conditioning a tip of a scanning probe microscope (SPM) during imaging of a sample and a method of mass-producing atomistic quantum dots, qubits, or particular atom orbital occupation are also provided.

    MULTIPLE SILICON ATOM QUANTUM DOT AND DEVICES INCLUSIVE THEREOF

    公开(公告)号:US20200044150A1

    公开(公告)日:2020-02-06

    申请号:US16318626

    申请日:2017-07-19

    IPC分类号: H01L45/00 H01L27/24

    摘要: A multiple-atom silicon quantum dot is provided that includes multiple dangling bonds on an otherwise H-terminated in silicon surface, each dangling bonds having one of three ionization states of +1, 0 or −1 and corresponding respectively to 0, 1, or 2 electrons in a dangling bond state. The dangling bonds together in close proximity and having the dangling bond states energetically in the silicon band gap with selective control of the ionization state of one of the dangling bonds. A new class of electronics elements is provided through the inclusion of at least one input and at least one output to the multiple dangling bonds. Selective modification or creation of a dangling bond is also detailed.