摘要:
Provided are a duty cycle correction circuit and method for correcting a duty cycle, and a semiconductor device including the duty cycle correction circuit. The duty cycle correction circuit includes a code generator configured to generate a first and a second duty code for adjusting the duty cycle of a clock to a target duty cycle, and a duty cycle corrector including a plurality of inverter circuits connected in series and whose driving capabilities are adjusted in response to the first and second duty code, wherein the duty cycle corrector is configured to correct the duty cycle of the clock based on the driving capabilities of the inverter circuits and to output a corrected clock.
摘要:
The DLL circuit includes a control circuit which controls bias currents of the unit delay circuits according to an externally input column address strobe writing latency (CWL) signal, and/or a DCC control circuit which adjusts steps of a DCC current of the DCC according to the externally input column address strobe writing latency (CWL) signal. The CWL signal may be input by a semiconductor memory device and may be indicative of a column address strobe writing latency of the semiconductor memory device. The semiconductor memory device may be a double data rate (DDR) synchronous DRAM (SDRAM) device.
摘要:
A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.
摘要:
A memory system includes a semiconductor memory device, a memory controller for controlling the semiconductor memory device, and a memory buffer connected between the semiconductor memory device and the memory controller. The memory buffer is configured to perform error correction coding (ECC) on first data that is received from the memory controller to be stored in the semiconductor memory device and to perform ECC on second data read from the semiconductor memory device.
摘要:
A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.
摘要:
A delay locked loop adapted to delay an external clock signal and to output an internal clock signal, the delay locked loop including a renewal signal generator that outputs a renewal signal that is selectively activated and inactivated, a replica path that is active when the renewal signal is activated and is inactive when the renewal signal is inactivated, the replica path delaying the internal clock signal by a delay time of a normal path of a semiconductor device to output a replica internal clock signal when the renewal signal is activated, a control signal generator adapted to vary and to output a delay control signal according to a phase difference between the external and the replica internal clock signals, and a variable delay circuit adapted to delay the external clock signal by a time corresponding to the delay control signal and to output the internal clock signal.
摘要:
A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.
摘要:
A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.
摘要:
The DLL circuit includes a control circuit which controls bias currents of the unit delay circuits according to an externally input column address strobe writing latency (CWL) signal, and/or a DCC control circuit which adjusts steps of a DCC current of the DCC according to the externally input column address strobe writing latency (CWL) signal. The CWL signal may be input by a semiconductor memory device and may be indicative of a column address strobe writing latency of the semiconductor memory device. The semiconductor memory device may be a double data rate (DDR) synchronous DRAM (SDRAM) device.
摘要:
A delay locked loop adapted to delay an external clock signal and to output an internal clock signal, the delay locked loop including a renewal signal generator that outputs a renewal signal that is selectively activated and inactivated, a replica path that is active when the renewal signal is activated and is inactive when the renewal signal is inactivated, the replica path delaying the internal clock signal by a delay time of a normal path of a semiconductor device to output a replica internal clock signal when the renewal signal is activated, a control signal generator adapted to vary and to output a delay control signal according to a phase difference between the external and the replica internal clock signals, and a variable delay circuit adapted to delay the external clock signal by a time corresponding to the delay control signal and to output the internal clock signal.