公开(公告)号：US20120188708A1

公开(公告)日：2012-07-26

申请号：US13012078

申请日：2011-01-24

申请人： SESHASAYEE ANKIREDDI ,  VADIM GEKTIN

发明人： SESHASAYEE ANKIREDDI ,  VADIM GEKTIN

IPC分类号： G06F1/20 ,  G06F1/16

CPC分类号： H01L23/367 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10515 ,  H05K2201/2036

摘要： A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

摘要翻译： 堆叠的微处理器封装结构包括一个或多个微处理器封装，微处理器封装包括设置在基板上的一个或多个微处理器管芯，卫星管芯，热耦合到微处理器管芯并热连接到系统冷却的热总线，以及电源总线 向微处理器提供电源并连接到系统电源。 微处理器封装可以包括为层叠模块提供机械保护和/或热隔离或热冷却路径的模块盖。 可变高度支座提供从堆叠的微处理器封装的基板到系统板的信号连接。

公开(公告)号：US08331094B2

公开(公告)日：2012-12-11

申请号：US13012078

申请日：2011-01-24

申请人： Seshasayee Ankireddi ,  Vadim Gektin

发明人： Seshasayee Ankireddi ,  Vadim Gektin

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/48

CPC分类号： H01L23/367 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10515 ,  H05K2201/2036

摘要： A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

摘要翻译： 堆叠的微处理器封装结构包括一个或多个微处理器封装，微处理器封装包括设置在基板上的一个或多个微处理器管芯，卫星管芯，热耦合到微处理器管芯并热连接到系统冷却的热总线，以及电源总线 向微处理器提供电源并连接到系统电源。 微处理器封装可以包括为层叠模块提供机械保护和/或热隔离或热冷却路径的模块盖。 可变高度支座提供从堆叠的微处理器封装的基板到系统板的信号连接。

公开(公告)号：US20120153453A1

公开(公告)日：2012-06-21

申请号：US12971737

申请日：2010-12-17

申请人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

发明人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/42 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/27849 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83014 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83211 ,  H01L2224/83815 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16171 ,  H01L2924/16251 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/01032

摘要： A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.

摘要翻译： 给出了一种用于组装半导体封装的方法，其包括通过反溅射清洗芯片的表面和散热装置的表面。 该方法包括在目标接合区域上用粘合剂层，阻挡层和保护层依次涂覆芯片的表面和除热装置的表面。 将芯片和散热装置放置在载体夹具中并预热至目标温度。 然后将金属热界面材料（TIM）预成型件机械地轧制到芯片的表面上，并且将第一和第二载体固定装置附接在一起，使得芯片表面上的金属TIM层结合到 散热装置通过无助焊剂工艺。 该方法包括在回流炉中加热接合的载体夹具。

公开(公告)号：US08368205B2

公开(公告)日：2013-02-05

申请号：US12971737

申请日：2010-12-17

申请人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

发明人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

IPC分类号： H01L23/34

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/42 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/27849 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83014 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83211 ,  H01L2224/83815 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16171 ,  H01L2924/16251 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/01032

摘要： A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.

摘要翻译： 给出了一种用于组装半导体封装的方法，其包括通过反溅射清洗芯片的表面和散热装置的表面。 该方法包括在目标接合区域上用粘合剂层，阻挡层和保护层依次涂覆芯片的表面和除热装置的表面。 将芯片和散热装置放置在载体夹具中并预热至目标温度。 然后将金属热界面材料（TIM）预成型件机械地轧制到芯片的表面上，并且将第一和第二载体固定装置附接在一起，使得芯片表面上的金属TIM层连接到芯片的涂覆表面 散热装置通过无助焊剂工艺。 该方法包括在回流炉中加热接合的载体夹具。