公开(公告)号：US5087985A

公开(公告)日：1992-02-11

申请号：US465196

申请日：1990-02-13

申请人： Koichi Kitaura ,  Shoji Kigoshi ,  Hisao Hisaki

发明人： Koichi Kitaura ,  Shoji Kigoshi ,  Hisao Hisaki

IPC分类号： G02B1/08 ,  G02B5/30

CPC分类号： G02B1/08 ,  G02B5/30 ,  G02B5/3033

摘要： The present invention concerns a polarizer for visible light, comprising a polyvinyl alcohol-based polarizing element wherein not less than 60% of dichromophore is iodine, and a protective film. The said polarizing element has at least three absorption bands in an ultraviolet region of 210 nm to 400 nm and also has a UA value of not smaller than 4.0 which value represents ultraviolet absorption characteristics. Consequently, the polarizer of the invention possesses both superior polarization characteristics and high heat and humidity resistance. The polarizer of the invention having these characteristics is used for liquid crystal display and is suitable particularly for such uses as display in watches and electronic calculators, terminal dispaly in personal computers and word processor, picture display in portable television sets, and display in automobiles and aircraft.

公开(公告)号：US06303219B1

公开(公告)日：2001-10-16

申请号：US08945221

申请日：1997-12-01

申请人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

发明人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

IPC分类号： H01L2160

CPC分类号： H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110° C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170° C. after having been cured, a storage elastic modulus E′ of 20 to 100 MPa at 150° C. and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：US06716529B2

公开(公告)日：2004-04-06

申请号：US09940513

申请日：2001-08-29

申请人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

发明人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

IPC分类号： B32B2738

CPC分类号： H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

摘要翻译： 一种用于半导体连接基板的粘合片，其由在基板上具有粘合剂层的层压体组成，其中所述粘合剂层包含热塑性树脂（A）和环氧树脂（B），并且所述环氧树脂（B）含有至少一种环氧树脂 选自（I）含二环戊二烯骨架的环氧树脂的树脂（B），（II）含萜骨架的环氧树脂和（III）含有联苯骨架的环氧树脂作为必要成分; 用于TAB的粘合剂背衬带由在柔性有机绝缘膜上具有粘合剂层和保护膜层的层压体组成。 用于半导体连接基板的粘合片，用于TAB的粘合剂背衬带和用于本发明的引线接合连接用粘合剂背衬带具有优异的粘合强度，绝缘性，尺寸精度等，并且可以提高 分别用于高密度封装的半导体集成电路连接基板和半导体器件。