公开(公告)号：US06333468B1

公开(公告)日：2001-12-25

申请号：US09290310

申请日：1999-04-12

申请人： Shuhichi Endoh ,  Toshihiro Inoue ,  Satoshi Takikita

发明人： Shuhichi Endoh ,  Toshihiro Inoue ,  Satoshi Takikita

IPC分类号： H05K103

CPC分类号： H05K1/0224 ,  H05K1/0393 ,  H05K3/321 ,  H05K3/4069 ,  H05K9/0039 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0715 ,  Y10T29/49126 ,  Y10T428/249927

摘要： A thin flexible multi-layered printed circuit cable manufactured by a relatively simple process and having improved electro-magnetic interference and impedance characteristics is described. The cable includes: an insulating substrate layer; a wiring layer formed on the insulated substrate layer; a coating layer laminated on the wiring layer; a first non-woven metal fiber layer laminated on the coating layer; and a second non-woven metal fiber layer laminated on an opposite surface of the substrate layer. Because the cable is coated with a conductive non-woven or woven metal fabric, electromagnetic waves generated during transmission of high speed data are fully shielded. The non-woven or woven fabric having a wide surface area, is soft and can make good surface-to-surface contact.

摘要翻译： 描述了通过相对简单的工艺制造且具有改善的电磁干扰和阻抗特性的薄柔性多层印刷电路电缆。 电缆包括：绝缘基底层; 形成在所述绝缘基板层上的布线层; 层叠在所述布线层上的涂层; 层压在所述涂层上的第一无纺金属纤维层; 以及层压在所述基板层的相对表面上的第二非织造金属纤维层。 由于电缆涂覆有导电无纺布或编织金属织物，所以在高速数据传输过程中产生的电磁波被完全屏蔽。 具有宽表面积的无纺布或织物柔软并且可以进行良好的表面到表面的接触。

公开(公告)号：US06778139B2

公开(公告)日：2004-08-17

申请号：US10064540

申请日：2002-07-25

申请人： Ryo Suzuki ,  Shuhichi Endoh

发明人： Ryo Suzuki ,  Shuhichi Endoh

IPC分类号： H01Q138

CPC分类号： H01Q9/0421 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q9/0485

摘要： An antenna unit and a computing system utilizing the antenna unit are disclosed. The antenna is compact and can be fabricated at low cost and with high accuracy. The antenna unit comprises an antenna and a connection cable. The antenna unit is constructed by forming the antenna and the connection cable integrally on a preferably flexible insulating film using preferably the FPC (Flexible Printed Circuit) technique. The computing system comprises a body having its main operational circuits and a hinged cover having a display. The flexible printed antenna is formed integrally with its module of electric components using the FPC technique and is made to span the body and the cover. The antenna itself and the connection cable can be freely bent or folded, resulting in higher freedom in their positioning within the computer system body and cover.

摘要翻译： 公开了一种使用天线单元的天线单元和计算系统。 天线紧凑，可以低成本，高精度地制造。 天线单元包括天线和连接电缆。 天线单元通过使用优选的FPC（柔性印刷电路）技术将天线和连接电缆一体地形成在优选的柔性绝缘膜上而构成。 计算系统包括具有其主要操作电路的主体和具有显示器的铰接盖。 柔性印刷天线使用FPC技术与其电气部件的模块一体地形成并且被制成跨越主体和盖。 天线本身和连接电缆可以自由弯曲或折叠，从而在计算机系统主体和盖子内定位更高的自由度。

公开(公告)号：US5502893A

公开(公告)日：1996-04-02

申请号：US299725

申请日：1994-09-01

申请人： Shuhichi Endoh ,  Motoi Suga

发明人： Shuhichi Endoh ,  Motoi Suga

IPC分类号： H05K1/05 ,  H05K3/38 ,  H05K3/44 ,  H05K3/42

CPC分类号： H05K1/056 ,  H05K2203/0315 ,  H05K3/445 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and high humidity since both the metal core and the organic non-conductive layer are firmly adhered. An organic non-conductive layer is formed over the metal core (e.g., of aluminum) with a metal plated layer (e.g., nickel) therebetween for protecting the metal core. A metal oxide layer is also used for enhancing adhesive force. By utilizing such a metal oxide layer, it is possible to more effectively prevent the organic non-conductive layer from separating from the plated layer (and thus the metal core). Further, the protecting metal plated layer can protect the metal core from erosion caused by contact with a strong alkali solution, etc. as may be used in a process of forming the metal oxide layer. Still further, copper plating inside the through hole can be performed easily.

摘要翻译： 一种金属芯印刷电路板及其制造方法，其中即使在高温高湿环境下，有机非导电层也不会与金属芯分离，因为金属芯和有机非导电层都是 牢牢坚持 在金属芯（例如铝）上形成有机非导电层，其间具有用于保护金属芯的金属镀层（例如镍）。 金属氧化物层也用于增强粘附力。 通过利用这种金属氧化物层，可以更有效地防止有机非导电层与镀层（因此金属芯）分离。 此外，保护金属镀层可以保护金属芯免受与形成金属氧化物层的过程中可能使用的强碱溶液等接触的侵蚀。 此外，可以容易地进行贯通孔内的镀铜。

公开(公告)号：US5374788A

公开(公告)日：1994-12-20

申请号：US132020

申请日：1993-10-05

申请人： Shuhichi Endoh ,  Motoi Suga

发明人： Shuhichi Endoh ,  Motoi Suga

IPC分类号： H05K1/05 ,  H05K3/38 ,  H05K3/44 ,  H05K1/09

CPC分类号： H05K1/056 ,  H05K2203/0315 ,  H05K3/445 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and high humidity since both the metal core and the organic non-conductive layer are firmly adhered. An organic non-conductive layer is formed over the metal core (e.g., of aluminum) with a metal plated layer (e.g., nickel) therebetween for protecting the metal core. A metal oxide layer is also used for enhancing adhesive force. By utilizing such a metal oxide layer, it is possible to more effectively prevent the organic non-conductive layer from separating from the plated layer (and thus the metal core). Further, the protecting metal plated layer can protect the metal core from erosion caused by contact with a strong alkali solution, etc. as may be used in a process of forming the metal oxide layer. Still further, copper plating inside the through hole can be performed easily.

摘要翻译： 一种金属芯印刷电路板及其制造方法，其中即使在高温高湿环境下，有机非导电层也不会与金属芯分离，因为金属芯和有机非导电层都是 牢牢坚持 在金属芯（例如铝）上形成有机非导电层，其间具有用于保护金属芯的金属镀层（例如镍）。 金属氧化物层也用于增强粘附力。 通过利用这种金属氧化物层，可以更有效地防止有机非导电层与镀层（因此金属芯）分离。 此外，保护金属镀层可以保护金属芯免受与形成金属氧化物层的过程中可能使用的强碱溶液等接触的侵蚀。 此外，可以容易地进行贯通孔内的镀铜。