摘要:
In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
摘要:
In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
摘要:
In component feeding head appratus, a head unit having a holding for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
摘要:
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.
摘要:
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.
摘要:
According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.
摘要:
According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.
摘要:
In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.
摘要:
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
摘要:
A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.