摘要:
A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.
摘要:
A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.
摘要:
A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that occurs when picked up with a suction nozzle, are pressed against a substrate (4) with a preset load using a suction nozzle with a flat suction surface (11b) so as to correct deformation; the suction nozzle (11) is controlled to move up to make up for a decrease in the distance between the oppositely spaced IC chip and the substrate (4) that is caused by thermal expansion due to the heating for melting solder bumps (1a) on the electrodes; and the suction nozzle (11) is controlled to move down to mitigate the effect of a pulling-apart force applied to the molten parts as the thermally expanded parts cool down and contract.
摘要:
A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
摘要:
A structure for pattern formation adapted for optically forming a pattern, characterized by comprising: a photocatalyst-containing layer provided on a substrate, the photocatalyst-containing layer containing a material of which the wettability is variable through photocatalytic action upon pattern-wise exposure.
摘要:
In the present invention, a provision of a method for manufacturing a color filter capable of forming a highly sophisticated pattern, to be formed easily at a low cost is desired. The present invention achieves the above mentioned object by providing a method for manufacturing a color filter comprising: (1) forming a light shielding part on a transparent base material; (2) forming a wettability changeable layer which the wettability changes by the function of a photocatalyst, on the surface of the transparent base material on the side with the light shielding part formed; (3) placing the photocatalyst containing layer of the photocatalyst containing layer side substrate which is the photocatalyst containing layer containing a photocatalyst formed on the base member, and the wettability changeable layer with a gap of 200 μm or less, and irradiating an energy from a predetermined direction to form a pixel part forming part comprising a lyophilic area where the contact angle to a liquid is lowered compared with the state before the energy irradiation to the wettability changeable layer, in a pattern; and (4) coloring the pixel part forming part by the ink jet method so as to form a pixel part.
摘要:
The present invention discloses a method of producing a pattern-formed structure, comprising the processes of: preparing a substrate for a pattern-formed structure having a characteristic-modifiable layer whose characteristic at a surface thereof can be modified by the action of photocatalyst; preparing a photocatalyst-containing-layer side substrate having a photocatalyst-containing layer formed on a base material, the photocatalyst-containing layer containing photocatalyst; arranging the substrate for a pattern-formed structure and the photocatalyst-containing-layer side substrate such that the characteristic-modifiable layer faces the photocatalyst-containing layer with a clearance of no larger than 200 μm therebetween; and irradiating energy to the characteristic-modifiable layer from a predetermined direction, and modifying characteristic of a surface of the characteristic-modifiable layer, thereby forming a pattern at the characteristic-modifiable layer. According to this method, a highly precise pattern can be formed without necessity to carry out any post-treatment after exposure. Further, there is no concern that the pattern-formed structure itself deteriorates because the produced pattern-formed structure is free of the photocatalyst.
摘要:
A main object of the present invention is to provide a manufacturing method of a pattern formed body which makes it possible to form property varied patterns having a desired line width, even when plural pattern formed bodies are manufactured. To achieve the object, the invention provides a manufacturing method of pattern formed bodies, comprising: a pattern-forming step of radiating vacuum-ultraviolet light onto a patterning substrate, a surface property of which is varied by the vacuum-ultraviolet light, through a photomask having at least a transparent substrate and a light shielding part to form a pattern formed body having a property varied pattern, in which the surface property of the patterning substrate is varied; and a step of repeating the pattern-forming step to manufacture a plurality of the pattern formed bodies, wherein an interval between the transparent substrate and the patterning substrate upon the pattern-forming step is set into the range of 0.1 μm to 200 μm.
摘要:
In the present invention, the problem of stability deterioration of the obtained conductive pattern substrate at the time of forming a conductive pattern by an additive method when a layer having reactivity remains on the substrate is to be solved. According to pattern exposure with a photo catalyst substrate 4 having a photo catalyst layer 3 laminated on a second substrate 5 superimposed onto a wettability changeable substrate 1 with a wettability changeable layer 3 laminated on a first substrate 2, a wettability pattern is formed. And furthermore, by adhering a conductive coating solution, or the like, a conductive pattern substrate without containing a photo catalyst can be manufactured.
摘要:
An EL device comprising a first electrode, an EL layer formed on the first electrode, and a second electrode formed on the EL layer, wherein at least one layer of a material whose wettability changes when light is applied thereto is formed. The invention provides EL devices that can be simply produced, and processes for producing the same.