公开(公告)号：US20250072065A1

公开(公告)日：2025-02-27

申请号：US18405526

申请日：2024-01-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jung-Hung CHANG ,  Shih-Cheng CHEN ,  Chia-Hao YU ,  Chia-Cheng TSAI ,  Kuo-Cheng CHIANG ,  Chih-Hao WANG

IPC: H01L29/06 ,  H01L21/764 ,  H01L29/08 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

Abstract: A device includes: a substrate; a stack of semiconductor channels on the substrate; a gate structure wrapping around the semiconductor channels; a source/drain region abutting the semiconductor channels; and a hybrid structure between the source/drain region and the substrate. The hybrid structure includes: a first semiconductor layer under the source/drain region; and an isolation region extending vertically from an upper surface of the first semiconductor layer to a level above a bottom surface of the first semiconductor layer.

公开(公告)号：US20250070085A1

公开(公告)日：2025-02-27

申请号：US18401949

申请日：2024-01-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsang-Jiuh Wu ,  Shih-Che Lin ,  Cheng-Chun Tsai ,  Ping-Jung Wu ,  Hao-Wen Ko

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00

Abstract: A method includes: forming first bond pads along a wafer; bonding a first die to a first set of the first bond pads, the first die being electrically connected to the wafer; depositing a gap-fill dielectric over the wafer and around the first die; forming openings in the gap-fill dielectric; forming first active through vias in physical contact with the second set of the first bond pads and first dummy through vias in physical contact with the third set of the first bond pads, the first active through vias being electrically connected to the wafer, the first dummy through vias being electrically isolated from the wafer; forming second bond pads along the first die, the first active through vias, and the first dummy through vias; and bonding a second die to the first die and to a first active via of the first active through vias.

公开(公告)号：US20250070011A1

公开(公告)日：2025-02-27

申请号：US18401789

申请日：2024-01-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chao Chou ,  Cheng-Chi Chuang ,  Chih-Hao Wang ,  Ching-Wei Tsai ,  Shang-Wen Chang

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065

Abstract: A method includes forming first integrated circuit devices and second integrated circuit devices on a semiconductor substrate of a wafer, forming a metal layer as a part of the wafer, and forming a transistor comprising a first source/drain region connected to the first integrated circuit devices. The transistor is farther away from the semiconductor substrate than the metal layer. An electrical connector is formed on a surface of the wafer, and is electrically connected to a second source/drain region of the transistor.

公开(公告)号：US20250070007A1

公开(公告)日：2025-02-27

申请号：US18516039

申请日：2023-11-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Jung Wu ,  Ken-Yu Chang ,  Hao-Wen Ko ,  Tsang-Jiuh Wu

IPC: H01L23/498 ,  H01L21/768 ,  H01L23/538 ,  H01L27/06

Abstract: A method includes bonding a top die to a bottom die, depositing a first dielectric liner on the top die, and depositing a gap-fill layer on the first dielectric liner. The gap-fill layer has a first thermal conductivity value higher than a second thermal conductivity value of silicon oxide. The method further includes etching the gap-fill layer and the first dielectric liner to form a through-opening, wherein a metal pad in the bottom die is exposed to the through-opening, depositing a second dielectric liner lining the through-opening, filling the through-opening with a conductive material to form a through-via connecting to the metal pad, and forming a redistribution structure over and electrically connecting to the top die and the through-via.

公开(公告)号：US20250070004A1

公开(公告)日：2025-02-27

申请号：US18944831

申请日：2024-11-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jing-Cheng Lin

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/03 ,  H01L25/10

Abstract: A method for forming a package structure may comprise applying a die and vias on a carrier having an adhesive layer and forming a molded substrate over the carrier and around the vias, and the ends of the vias and mounts on the die exposed. The vias may be in via chips with one or more dielectric layers separating the vias. The via chips 104 may be formed separately from the carrier. The dielectric layer of the via chips may separate the vias from, and comprise a material different than, the molded substrate. An RDL having RDL contact pads and conductive lines may be formed on the molded substrate. A second structure having at least one die may be mounted on the opposite side of the molded substrate, the die on the second structure in electrical communication with at least one RDL contact pad.

公开(公告)号：US20250067946A1

公开(公告)日：2025-02-27

申请号：US18455886

申请日：2023-08-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Hsing-Kuo Hsia ,  Chih-Wei Tseng ,  Hua-Kung Chiu ,  Jui Lin Chao

IPC: G02B6/42 ,  H01L33/00

Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes an optical package having a first surface and a second surface opposite the first surface, a laser die package having a third surface and a fourth surface opposite the third surface, wherein the first surface is planar with the third surface and the second surface is planar with the fourth surface, a first silicon support attached to both the second surface and the fourth surface, and an interposer attached to both the first surface and the third surface, wherein the interposer is free of a silicon substrate.

公开(公告)号：US12239033B2

公开(公告)日：2025-02-25

申请号：US17863273

申请日：2022-07-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Chieh Mo ,  Shih-Chi Kuo

IPC: H01L45/00 ,  H01L27/24 ,  H10B63/00 ,  H10N70/00 ,  H10N70/20

Abstract: A memory cell includes: a first electrode; a resistive material layer comprising one horizontal portion and two vertical portions that are respectively coupled to ends of the horizontal portion; and a second electrode, wherein the second electrode is partially surrounded by a top boundary of the U-shaped profile and the first electrode extends along part of a bottom boundary of the U-shaped profile.

公开(公告)号：US12237418B2

公开(公告)日：2025-02-25

申请号：US18365315

申请日：2023-08-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Huan-Chieh Su ,  Chih-Hao Wang ,  Kuo-Cheng Chiang ,  Wei-Hao Wu ,  Zhi-Chang Lin ,  Jia-Ni Yu ,  Yu-Ming Lin ,  Chung-Wei Hsu

IPC: H01L29/51 ,  H01L21/768 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L29/78

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

公开(公告)号：US12237417B2

公开(公告)日：2025-02-25

申请号：US18061862

申请日：2022-12-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Yin Chen ,  Che-Cheng Chang ,  Chih-Han Lin ,  Horng-Huei Tseng

IPC: H01L21/82 ,  H01L21/3213 ,  H01L21/66 ,  H01L21/67 ,  H01L21/8234 ,  H01L29/423 ,  H01L29/49 ,  H01L29/51 ,  H01L29/66 ,  H01L29/78 ,  G01N21/88

Abstract: A FinFET structure with a gate structure having two notch features therein and a method of forming the same is disclosed. The FinFET notch features ensure that sufficient spacing is provided between the gate structure and source/drain regions of the FinFET to avoid inadvertent shorting of the gate structure to the source/drain regions. Gate structures of different sizes (e.g., different gate widths) and of different pattern densities can be provided on a same substrate and avoid inadvertent of shorting the gate to the source/drain regions through application of the notched features.

公开(公告)号：US12237399B2

公开(公告)日：2025-02-25

申请号：US17458672

申请日：2021-08-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-En Cheng ,  Yung-Cheng Lu ,  Chi On Chui ,  Wei-Yang Lee

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786

Abstract: A method of forming a semiconductor device includes forming a sacrificial layer over a first stack of nanostructures and an isolation region. A dummy gate structure is formed over the first stack of nanostructures, and a first portion of the sacrificial layer. A second portion of the sacrificial layer is removed to expose a sidewall of the first stack of nanostructures adjacent the dummy gate structure. A spacer layer is formed over the dummy gate structure. A first portion of the spacer layer physically contacts the first stack of nanostructures.