公开(公告)号：US20110057326A1

公开(公告)日：2011-03-10

申请号：US12991720

申请日：2009-12-01

申请人： Takayuki Kai ,  Kazushi Higashi ,  Takeshi Kita ,  Hitoshi Yamanishi ,  Takafumi Okuma

发明人： Takayuki Kai ,  Kazushi Higashi ,  Takeshi Kita ,  Hitoshi Yamanishi ,  Takafumi Okuma

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/31116 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/124 ,  H01L27/1248 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/13024

摘要： An electrode on a first surface of a semiconductor substrate and a second surface of the semiconductor substrate are connected with each other by a through electrode. A through hole is formed through the semiconductor substrate from the second surface of the semiconductor substrate to an interlayer insulating film on the first surface, and an insulating film is formed on a side surface and a bottom surface of the through hole as well as on the second surface of the semiconductor substrate, so that by simultaneously etching the insulating film on the bottom surface of the through hole and the interlayer insulating film, thus formed, the through hole is formed so as to reach the electrode on the first surface of the semiconductor substrate.

摘要翻译： 半导体衬底的第一表面上的电极和半导体衬底的第二表面通过通孔彼此连接。 从半导体衬底的第二表面到第一表面的层间绝缘膜通过半导体衬底形成通孔，并且在通孔的侧表面和底表面上形成绝缘膜，并且在 第二表面，从而通过同时蚀刻通孔底面上的绝缘膜和形成的层间绝缘膜，形成通孔以到达半导体的第一表面上的电极 基质。

公开(公告)号：US07846546B2

公开(公告)日：2010-12-07

申请号：US11524104

申请日：2006-09-20

申请人： Koji Shibata ,  Takeshi Kita ,  Koji Shiba ,  Takashi Kino ,  Hideo Sano ,  Yoichi Okubo ,  Shigeru Yao

发明人： Koji Shibata ,  Takeshi Kita ,  Koji Shiba ,  Takashi Kino ,  Hideo Sano ,  Yoichi Okubo ,  Shigeru Yao

IPC分类号： B32B5/16

CPC分类号： C04B35/565 ,  C04B2235/483 ,  Y10T428/24942 ,  Y10T428/24992 ,  Y10T428/259 ,  Y10T428/2991 ,  Y10T428/2993

摘要： Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.

摘要翻译： 含有导电性无机物质和电磁波吸收材料的碳化硅系微粒是由碳化硅系材料的粒子内部构成的微细粒子和由主要由碳组成的导电性无机物形成的表面层， 其中存在导电无机物质与颗粒表面梯度增加的组成比的梯度层，并且导电无机物质梯度层的厚度为1至500nm。 本发明的电磁波吸收材料可以选择性地吸收宽带1〜300GHz的电磁波。

公开(公告)号：US20090243120A1

公开(公告)日：2009-10-01

申请号：US12408829

申请日：2009-03-23

申请人： Takeshi KITA ,  Kazushi HIGASHI

发明人： Takeshi KITA ,  Kazushi HIGASHI

IPC分类号： H01L23/48 ,  H01L21/66

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2224/05552

摘要： A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

摘要翻译： 提供一种半导体元件，其包括半导体衬底，设置在衬底上的电路元件和形成在衬底中的通孔，该通孔在其侧壁上具有条状凹凸结构，所述通孔形成在厚度方向上的条纹 半导体衬底。

公开(公告)号：US20070062719A1

公开(公告)日：2007-03-22

申请号：US11524104

申请日：2006-09-20

申请人： Koji Shibata ,  Takeshi Kita ,  Koji Shiba ,  Takashi Kino ,  Hideo Sano ,  Yoichi Okubo ,  Shigeru Yao

发明人： Koji Shibata ,  Takeshi Kita ,  Koji Shiba ,  Takashi Kino ,  Hideo Sano ,  Yoichi Okubo ,  Shigeru Yao

IPC分类号： B05D5/12 ,  H01B3/44

CPC分类号： C04B35/565 ,  C04B2235/483 ,  Y10T428/24942 ,  Y10T428/24992 ,  Y10T428/259 ,  Y10T428/2991 ,  Y10T428/2993

摘要： Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.

摘要翻译： 含有导电性无机物质和电磁波吸收材料的碳化硅系微粒是由碳化硅系材料的粒子内部构成的微细粒子和由主要由碳组成的导电性无机物形成的表面层， 其中存在导电无机物质与颗粒表面梯度增加的组成比的梯度层，并且导电无机物质梯度层的厚度为1至500nm。 本发明的电磁波吸收材料可以选择性地吸收宽带1〜300GHz的电磁波。

公开(公告)号：US4110394A

公开(公告)日：1978-08-29

申请号：US685604

申请日：1976-05-12

申请人： Teizo Shimada ,  Takeshi Kita ,  Kiyoshi Mochizuki ,  Takahiro Komiya

发明人： Teizo Shimada ,  Takeshi Kita ,  Kiyoshi Mochizuki ,  Takahiro Komiya

IPC分类号： B29B7/00 ,  B29C47/00 ,  B29C47/10 ,  B29C47/16 ,  B29C47/20 ,  B29C47/22 ,  B29C47/40 ,  B29C47/92 ,  B29D23/04

CPC分类号： B29C47/92 ,  B29C47/1036 ,  B29C2947/92161 ,  B29C2947/92333 ,  B29C2947/9258 ,  B29C2947/9259 ,  B29C2947/926 ,  B29C2947/92647 ,  B29C2947/92657 ,  B29C2947/92828 ,  B29C2947/92885 ,  B29C2947/92952 ,  B29C47/0023 ,  B29C47/0033 ,  B29L2023/003

摘要： In a process for forming a resin body, the thickness of the body is altered by altering the feed rate of raw material to an extruder and the screw rate of the extruder screw in such a relationship to alter the quantity extrusion rate without altering the amount of resin within the extruder.

摘要翻译： 在形成树脂体的方法中，通过改变原料对挤出机的进料速率和挤出机螺杆的螺杆转速这样的关系来改变坯体的厚度，以改变挤出量，而不改变树脂体的量 树脂在挤出机内。

公开(公告)号：US4135871A

公开(公告)日：1979-01-23

申请号：US771494

申请日：1977-02-24

申请人： Sadao Murai ,  Takeshi Kita ,  Kiyoshi Mochizuki

发明人： Sadao Murai ,  Takeshi Kita ,  Kiyoshi Mochizuki

IPC分类号： B29C47/00 ,  B29C47/20 ,  B29C47/22 ,  B29D23/04

CPC分类号： B29C47/20 ,  B29C47/0023 ,  B29C47/22 ,  B29C47/8895 ,  B29C47/90 ,  B29C47/902 ,  B29C47/908 ,  B29C47/0026 ,  B29C47/0033 ,  B29C47/0066 ,  B29L2023/003

摘要： Resin tubes having thick walled portions and thin walled portions are formed by providing a specially configured orifice on an extruder and varying the rate at which the extruded resin tube is pulled from the extruder. The orifice is shaped to form a thin tubular opening and a thick tubular opening communicating with one another, the thick tubular opening being adjacent and down-stream of the thin opening. When the extruded resin tube is pulled at a high speed the thin tubular opening is filled with resin that passes through but does not fill the thick tubular opening. At the slow pulling speed the resin fills at least the open-end portion of the thick tubular opening thereby forming a thick walled portion of the resin tube.

摘要翻译： 通过在挤出机上设置特别设计的孔口并改变从挤出机拉出挤出的树脂管的速率，形成具有厚壁部分和薄壁部分的树脂管。 孔口成形为形成薄的管状开口和彼此连通的厚的管状开口，厚的管状开口邻近薄的开口的下游。 当挤出的树脂管被高速拉动时，薄的管状开口填充有通过但不填充厚的管状开口的树脂。 在缓慢的拉伸速度下，树脂填充至少厚的管状开口的开口端，从而形成树脂管的厚壁部分。

公开(公告)号：US07994634B2

公开(公告)日：2011-08-09

申请号：US12408829

申请日：2009-03-23

申请人： Takeshi Kita ,  Kazushi Higashi

发明人： Takeshi Kita ,  Kazushi Higashi

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2224/05552

摘要： A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

摘要翻译： 提供一种半导体元件，其包括半导体衬底，设置在衬底上的电路元件和形成在衬底中的通孔，该通孔在其侧壁上具有条状凹凸结构，所述通孔形成在厚度方向上的条纹 半导体衬底。

公开(公告)号：US4036930A

公开(公告)日：1977-07-19

申请号：US616525

申请日：1975-09-24

申请人： Sadao Murai ,  Takeshi Kita ,  Kiyoshi Mochizuki

发明人： Sadao Murai ,  Takeshi Kita ,  Kiyoshi Mochizuki

IPC分类号： B29B7/00 ,  B29C47/00 ,  B29C47/20 ,  B29C47/22 ,  B29C47/34 ,  B29C47/88 ,  B29C47/92 ,  B29D23/04

CPC分类号： B29C47/34 ,  B29C47/22 ,  B29C47/92 ,  B29C2947/9239 ,  B29C2947/92457 ,  B29C2947/926 ,  B29C2947/92647 ,  B29C47/0023 ,  B29C47/0066 ,  B29L2023/003

摘要： Resin tubes having thick walled portions and thin walled portions are formed by providing a specially configured orifice on an extruder and varying the rate at which the extruded resin tube is pulled from the extruder. The orifice is shaped to form a thin tubular opening and a thick tubular opening communicating with one another, the thick tubular opening being adjacent and down-stream of the thin opening. When the extruded resin tube is pulled at a high speed the thin tubular opening is filled with resin that passes through but does not fill the thick tubular opening. At the slow pulling speed the resin fills at least the open-end portion of the thick tubular opening thereby forming a thick walled portion of the resin tube.

摘要翻译： 通过在挤出机上设置特别设计的孔口并改变从挤出机拉出挤出的树脂管的速率，形成具有厚壁部分和薄壁部分的树脂管。 孔口成形为形成薄的管状开口和彼此连通的厚的管状开口，厚的管状开口邻近薄的开口的下游。 当挤出的树脂管被高速拉动时，薄的管状开口填充有通过但不填充厚的管状开口的树脂。 在缓慢的拉伸速度下，树脂填充至少厚的管状开口的开口端，从而形成树脂管的厚壁部分。