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    Method and system for reducing the peak current in refreshing dynamic random access memory devices
    1.
    发明授权
    Method and system for reducing the peak current in refreshing dynamic random access memory devices 失效
    刷新动态随机存取存储器件中降低峰值电流的方法和系统

    公开(公告)号：US07349277B2

    公开(公告)日：2008-03-25

    申请号：US11431371

    申请日：2006-05-09

    申请人： Thomas H. Kinsley ,  Jeffery W. Janzen

    发明人： Thomas H. Kinsley ,  Jeffery W. Janzen

    IPC分类号： G11C7/00

    CPC分类号： G11C11/40611 ,  G11C11/406 ,  G11C11/40615 ,  G11C11/40618 ,  G11C11/40622

    摘要： A dynamic random access memory device includes a mode register that is programmed with a delay value. In some embodiments, a offset code is also stored in the memory device. The memory device uses the delay value, which may be added to or multiplied by the offset code, to delay the initiation of a received auto-refresh or self-refresh command. A large number of dynamic random access memory devices in a system may be provided with different delay values and possibly offset codes so that the memory device do not all perform refreshes simultaneously in response to an auto-refresh or self-refresh command issued to all of the memory devices simultaneously. As a result, the peak current drawn by the memory devices resulting from the auto-refresh command or self-refresh command is maintained at a relatively low value.

    摘要翻译： 动态随机存取存储器件包括用延迟值编程的模式寄存器。 在一些实施例中，偏移代码也存储在存储器件中。 存储器件使用延迟值，该延迟值可以被添加到偏移代码或乘以偏移代码，以延迟接收的自动刷新或自刷新命令的启动。 可以为系统中的大量动态随机存取存储器件提供不同的延迟值和可能的偏移代码，使得存储器件不是都响应于自动刷新或自刷新命令而同时执行刷新 同时存储设备。 结果，由自动刷新命令或自刷新命令产生的存储器件所绘制的峰值电流保持在较低的值。

    Memory stacking system and method
    2.
    发明授权
    Memory stacking system and method 有权
    内存堆叠系统和方法

    公开(公告)号：US07269042B2

    公开(公告)日：2007-09-11

    申请号：US11413793

    申请日：2006-04-28

    申请人： Thomas H. Kinsley ,  Kevin M. Kilbuck

    发明人： Thomas H. Kinsley ,  Kevin M. Kilbuck

    IPC分类号： G11C5/00 ,  G11C7/00

    CPC分类号： G11C5/04 ,  G11C5/02 ,  G11C8/12

    摘要： A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified memory devices and a serial presence detect device. The first high density memory module is included within an electronic system. Also, an additional method of forming a stacked memory module is provided, the method requiring modification of an address buffer to include a logic block for decoding a plurality of chip select signals. A second high density memory module is also provided that includes the modified address buffer and a serial presence detect device. The second high density memory module is included within an electronic system.

    摘要翻译： 提供了一种从多个存储器件形成堆叠的存储器模块的方法。 多个存储器件中的每一个被修改为包括用于解码多个片选信号的逻辑块。 还提供了包括经修改的存储器件和串行存在检测器件的第一高密度存储器模块。 第一高密度存储器模块包括在电子系统内。 此外，提供了形成堆叠存储器模块的附加方法，该方法需要修改地址缓冲器以包括用于解码多个片选信号的逻辑块。 还提供了第二高密度存储器模块，其包括修改的地址缓冲器和串行存在检测器件。 第二高密度存储器模块包括在电子系统内。

    Memory stacking system and method
    3.
    发明授权
    Memory stacking system and method 有权

    公开(公告)号：US07046538B2

    公开(公告)日：2006-05-16

    申请号：US10932834

    申请日：2004-09-01

    申请人： Thomas H. Kinsley ,  Kevin M. Kilbuck

    发明人： Thomas H. Kinsley ,  Kevin M. Kilbuck

    IPC分类号： G11C5/02 ,  G11C8/00

    CPC分类号： G11C5/04 ,  G11C5/02 ,  G11C8/12

    摘要： A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified memory devices and a serial presence detect device. The first high density memory module is included within an electronic system. Also, an additional method of forming a stacked memory module is provided, the method requiring modification of an address buffer to include a logic block for decoding a plurality of chip select signals. A second high density memory module is also provided that includes the modified address buffer and a serial presence detect device. The second high density memory module is included within an electronic system.

    METHODS FOR SECURING SEMICONDUCTOR DEVICES USING ELONGATED FASTENERS
    4.
    发明申请
    METHODS FOR SECURING SEMICONDUCTOR DEVICES USING ELONGATED FASTENERS 有权
    使用延长的紧固件来保护半导体器件的方法

    公开(公告)号：US20100112754A1

    公开(公告)日：2010-05-06

    申请号：US12684646

    申请日：2010-01-08

    申请人： Thomas H. Kinsley

    发明人： Thomas H. Kinsley

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0657 ,  H01L24/72 ,  H01L25/0652 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/325 ,  H05K2201/10598 ,  H05K2201/10719 ,  H01L2924/00

    摘要： Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

    摘要翻译： 半导体器件组件包括诸如电子部件的元件和通过紧固件固定在一起的基板，该紧固件包括连续延伸穿过两个或更多个这样的元件中的孔的细长部分。 计算机系统包括这样的半导体器件组件。 用于将这些元件固定在一起的紧固件包括细长部分，第一端部件和第二端部件。 将多个半导体器件固定在一起的方法包括通过第一半导体器件中的孔和至少一个附加半导体器件中的孔插入紧固件的细长部分。 电路板包括与半导体器件组件中的孔阵列对应设置的多个孔。 每个孔的尺寸和构造被设计成接收用于维持半导体器件组件和电路板之间的组装关系的紧固件。

    Methods for securing semiconductor devices using elongated fasteners
    7.
    发明授权
    Methods for securing semiconductor devices using elongated fasteners 有权
    使用细长紧固件固定半导体器件的方法

    公开(公告)号：US08124456B2

    公开(公告)日：2012-02-28

    申请号：US12684646

    申请日：2010-01-08

    申请人： Thomas H. Kinsley

    发明人： Thomas H. Kinsley

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0657 ,  H01L24/72 ,  H01L25/0652 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/325 ,  H05K2201/10598 ,  H05K2201/10719 ,  H01L2924/00

    摘要： Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

    摘要翻译： 半导体器件组件包括诸如电子部件的元件和通过紧固件固定在一起的基板，该紧固件包括连续延伸穿过两个或更多个这样的元件中的孔的细长部分。 计算机系统包括这样的半导体器件组件。 用于将这些元件固定在一起的紧固件包括细长部分，第一端部件和第二端部件。 将多个半导体器件固定在一起的方法包括通过第一半导体器件中的孔和至少一个附加半导体器件中的孔插入紧固件的细长部分。 电路板包括与半导体器件组件中的孔阵列对应设置的多个孔。 每个孔的尺寸和构造被设计成接收用于维持半导体器件组件和电路板之间的组装关系的紧固件。

    MEMORY SYSTEMS, MEMORY CONTROLLERS, MEMORY MODULES AND METHODS FOR INTERFACING WITH MEMORY MODULES
    8.
    发明申请
    MEMORY SYSTEMS, MEMORY CONTROLLERS, MEMORY MODULES AND METHODS FOR INTERFACING WITH MEMORY MODULES 审中-公开
    存储器系统，存储器控制器，用于与存储器模块接口的存储器模块和方法

    公开(公告)号：US20120284480A1

    公开(公告)日：2012-11-08

    申请号：US13397392

    申请日：2012-02-15

    申请人： Brett L. Williams ,  Thomas H Kinsley

    发明人： Brett L. Williams ,  Thomas H Kinsley

    IPC分类号： G06F12/02 ,  G11C5/02

    CPC分类号： H01L27/105 ,  G11C5/04 ,  H01L25/0657 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A memory system includes a memory controller and a memory module coupled to the memory controller. One such memory module may include a memory package of a first type and a signal presence detect unit configured to provide configuration data associated with a memory package of a second type to the memory controller. The configuration data may be used to configure the memory controller to interface with the memory package of a first type.

    摘要翻译： 存储器系统包括存储器控制器和耦合到存储器控制器的存储器模块。 一个这样的存储器模块可以包括第一类型的存储器封装和信号存在检测单元，其被配置为将与第二类型的存储器封装相关联的配置数据提供给存储器控制器。 配置数据可以用于配置存储器控制器以与第一类型的存储器包接口。

    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING ELONGATED FASTENERS
    9.
    发明申请
    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING ELONGATED FASTENERS 审中-公开
    半导体器件组件，包括延长的紧固件

    公开(公告)号：US20120127674A1

    公开(公告)日：2012-05-24

    申请号：US13362742

    申请日：2012-01-31

    申请人： Thomas H. Kinsley

    发明人： Thomas H. Kinsley

    IPC分类号： H05K7/00

    CPC分类号： H01L25/0657 ,  H01L24/72 ,  H01L25/0652 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/325 ,  H05K2201/10598 ,  H05K2201/10719 ,  H01L2924/00

    摘要： Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such semiconductor device assemblies. Fasteners for securing together such elements include an elongated portion, a first end piece, and a second end piece. Methods of securing together a plurality of semiconductor devices include inserting an elongated portion of a fastener through an aperture in a first semiconductor device and an aperture in at least one additional semiconductor device. Circuit boards include a plurality of apertures disposed in an array corresponding to an array of apertures in a semiconductor device assembly. Each aperture is sized and configured to receive a fastener for maintaining an assembled relationship between the semiconductor device assembly and the circuit board.

    摘要翻译： 半导体器件组件包括诸如电子部件的元件和通过紧固件固定在一起的基板，该紧固件包括连续延伸穿过两个或更多个这样的元件中的孔的细长部分。 计算机系统包括这样的半导体器件组件。 用于将这些元件固定在一起的紧固件包括细长部分，第一端部件和第二端部件。 将多个半导体器件固定在一起的方法包括通过第一半导体器件中的孔和至少一个附加半导体器件中的孔插入紧固件的细长部分。 电路板包括与半导体器件组件中的孔阵列对应设置的多个孔。 每个孔的尺寸和构造被设计成接收用于维持半导体器件组件和电路板之间的组装关系的紧固件。