Abstract:
Disclosed herein are optical interference multilayer coatings having region provided by a physical vapor deposition process and region provided by a chemical vapor deposition process. Also disclosed herein are methods of making such coatings, as well as lamps comprising a light-transmissive envelope, at least a portion of the surface of the light-transmissive envelope being provided with the optical interference multilayer coating noted above. Such coatings, when used on lamps, may advantageously offer improved energy efficiencies for such lamps.
Abstract:
Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.
Abstract:
An improved seal for an electric lamp is provided. An oxidation-resistant coating is provided on the current conductor where the outer lead joins the seal foil, preferably at the pinch seal. The coating is preferably a chromium layer covered by a chromium layer or a silver layer covered by a layer of hydrogenated silicon oxy carbon polymer. The coating is preferably applied via sputtering where the coating is subject to high energy electron or ion bombardment during sputtering. Preferably the coating is applied via sputtering at increased deposition pressure.
Abstract:
The invention is related to a reflector lamp comprising a parabolic primary reflecting section, a parabolic or spheric secondary reflecting section joined to the primary reflecting section, a parabolic or spheric tertiary reflecting section joined to the secondary reflecting section, and an incandescent or discharge light source. The secondary and tertiary reflecting sections have faceted surfaces which longitudinally extend along the surface thereof so that most (at least 50%) or substantially all the light reflected by the faceted surfaces avoids the light source and thus the light, which would be absorbed or scattered by the light source, is minimized or substantially eliminated.
Abstract:
Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.
Abstract:
Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.
Abstract:
A reflector lamp has a generally parabolic shaped housing (12) with an interior surface coated with a layer (14) of silver having a protective layer (16) of a stable protective oxide, such as silica, disposed thereon. An intermediate layer (18), such as a layer of elemental silicon, protects the silver layer during deposition of the silica layer and is completely or substantially consumed during formation of the silica layer. The lamp includes a light source (48) having a longitudinal axis (x) disposed on the parabolic reflector axis and preferably disposed outward of the parabolic focus (F). During lamp fabrication, the protective coating is preferably annealed to improve reflectance. The preferred lamp will have a lumens per watt greater than 14.
Abstract:
A reflector lamp has a generally parabolic shaped housing (12) with an interior surface coated with a layer (14) of silver having a protective layer (16) of a stable protective oxide, such as silica, disposed thereon. An intermediate layer (18), such as a layer of elemental silicon, protects the silver layer during deposition of the silica layer and is completely or substantially consumed during formation of the silica layer. The lamp includes a light source (48) having a longitudinal axis (x) disposed on the parabolic reflector axis and preferably disposed outward of the parabolic focus (F). During lamp fabrication, the protective coating is preferably annealed to improve reflectance. The preferred lamp will have a lumens per watt greater than 14.
Abstract:
A magnetron sputtering device and method for applying an interference layer to a substrate includes a magnetron sputtering chamber (A) which houses a substrate carrying assembly (B). The substrate carrying assembly comprises a primary rotation table (10), rotating about its central vertical axis (12) and at least one secondary table (36) mounted to an upper surface (14) of the primary rotation table. Substrates (42) are either horizontally or vertically loaded on to the secondary table. The substrates rotate about their symmetrical axis. First and second targets (50a, 50b) are housed by the chamber and are disposed on opposite sides of the chamber. The primary rotation table rotates the substrates between a position adjacent a first target where a layer having a low refractive index is applied to the substrates and a position adjacent a second target where a layer having a high refractive index is applied to the substrates.
Abstract:
Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.