摘要:
A wafer probe head assembly for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs formed on a wafer to be tested includes an adapter board and a probe card assembly including a space transformer and a contactor carrying substrate having a substantially planar bottom surface with printed or plated circuit traces formed thereon and a plurality of contactors plated to or photo-lithographically formed on the traces and arranged to simultaneously ohmically engage the contact pads of one or more ICs on a wafer under test. The contactors may include resilient supporting structures attached to or integrated with the signal carrying circuit traces. The probe card assembly may also include one or more substrate layers with the circuit traces and vias formed on and/or within the substrate layers to facilitate connection of the tester to the contactors.
摘要:
A FCC catalyst having improved coke selectivity and a FCC process for converting hydrocarbon feedstocks to lower boiling products. The catalyst comprises a crystalline aluminosilicate zeolite, gibbsite, rare earth metal compound and a silica matrix prepared from at least one of a silica sol made by an ion-exchange process and an acidic silica sol prepared by mixing sodium silicate, an acid and an aluminum salt of an acid.
摘要:
An asynchronous motor is supplied with power from an AC line voltage via a variable speed drive including a rectifier bridge connected to the AC line voltage, a DC voltage intermediate circuit including a capacitor and an inverter including switches and connected to the phase windings of the motor. A system for controlling the power supply to the motor includes a device for controlled resumption of motor speed after supply of power to the motor is interrupted.
摘要:
A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.
摘要:
A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1st layer of conductive material to form a ground plane, plurality of metallic 1st traces on a 2nd side of the substrate having widths of approximately 25 microns or less, developing 1st ribs of photoresist forming 1st walls rising above upper surface of an adjacent seed layer trace, depositing 1st conductive signal traces having a thickness exceeding 25 microns into channels and over seed layer traces and stripping the ribs to leave 1st conductive traces having a height-to-transverse ratio exceeding 1.
摘要:
A process for making a multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces, comprising of providing an insulative substrate having a first side coated with a layer of conductive metal intended to form a ground plane; providing a plurality of seed layer traces of a predetermined width of approximately 25 microns or less separated from each other by a predetermined distance of approximately 25 microns or less on a second side of the insulative substrate, the narrowness of such separation being essentially limited only by characteristics of the photoresist material to be deposited and developed therebetween and to withstand subsequent processing; developing ribs or barriers of photoresist forming vertical walls rising above the spaces separating the seed layer traces and defining valleys or channels thereover; depositing a desired thickness of conductive material over the seed layer traces and in the valleys or channels between the vertical walls; stripping away the resist ribs or barriers to leave conductive traces to be variously used as ground lines, signal lines and power lines; repeating the previous steps to develop a plurality of circuit boards; stacking the several circuit boards and joining them together with layers of insulative material; identifying particular ones of the traces as signal lines and other traces as power lines and/or ground lines; interconnecting at least some of the ground lines on one board to ground lines and/or ground planes on other boards by conductors extending through vias; interconnecting signal lines to signal input and output terminals; and perhaps to signal lines on other boards through vias; and interconnecting power lines to power input and output terminals, and perhaps to power lines on other boards through vias.
摘要:
This invention relates to a device for measuring currents used in a converter (1) powered by a DC power source and equipped with six switches (T1, T2, T3, T4, T5, T6) associated with diodes (D1, D2, D3, D4, D5, D6) and controlled by a control circuit (2) and a microcontroller (3), and equipped with current sensors (Su, Sv, Sw) each located between the switch and the diode associated with a lower channel, and secondly the return conductor to the DC power source supplying "direct" signals (Isu, Isv, Isw) in phase with the currents (Ia, Ib, Ic) output from the converter, characterized by the fact that it includes means (A46, A62) of calculating an "indirect" replacement signal (Iai) equal to the sum of two "direct" signals (-Isu and -Isw) and a second "indirect" replacement signal (Ici) equal to the sum of the two "direct" signals (-Isu and -Isw) and means (Cu, Cw) for switching either a "direct" signal (Isu or Isw) or an "indirect" replacement signal (Iai or Ici) so as to send to the microcontroller (3) two signals reconstructed from the two phase currents (Ia* and Ic*), each composed of either the "direct" signal (Isu or Isw) or, during the PWM steps in which the lower branch transistor is not controlled, the "indirect" replacement signal (Iai, Ici).