Device for forming electric circuits on a lead frame
    2.
    发明授权
    Device for forming electric circuits on a lead frame 失效
    用于在引线框架上形成电路的装置

    公开(公告)号:US5108023A

    公开(公告)日:1992-04-28

    申请号:US603986

    申请日:1990-10-26

    摘要: The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34'). The axis (S) passes through the center of the recess (45) and interconnects the two studs (35, 35' ).

    摘要翻译: 本发明涉及一种用于在引线框架上形成电路的装置,该装置具有多个处理点,其中每个处理点设置有半导体芯片。 在接合期间,为了实现将半导体芯片(8)电连接到引线框架的连接指(5)所需的最佳超声波功率传递,单个引线框架(1)位于加热的支承元件(19) )和相应构造的保持板(40)。 在根据本发明的装置(50)的情况下,用于具有相应构造的窗状凹部(45)的接触构件(换能器)设置的保持板(40)相对于轴承元件(19)可移动地安装, 围绕在保持板(40)的纵向方向上定位在两个间隔开的螺柱(35,35')上的至少一个轴线(S),每个轴线布置在弹簧元件(34,34')上。 轴线(S)通过凹部(45)的中心并且互连两个螺栓(35,35')。