公开(公告)号：US20110316130A1

公开(公告)日：2011-12-29

申请号：US13092159

申请日：2011-04-22

Applicant: Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

Inventor： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

IPC: H01L23/495 ,  H01L21/28

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

Abstract translation: 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。

公开(公告)号：US20120211846A1

公开(公告)日：2012-08-23

申请号：US13334006

申请日：2011-12-21

Applicant: Jun LI ,  Jianhong WANG ,  Xuesong XU ,  Jinzhong YAO ,  Wanming YU

Inventor： Jun LI ,  Jianhong WANG ,  Xuesong XU ,  Jinzhong YAO ,  Wanming YU

IPC: H01L29/82 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

Abstract translation: 一种组装磁阻随机存取存储器（MRAM）器件的方法包括提供具有开口的衬底。 将带施加到基板的表面，并且第一磁屏蔽被放置在带上和基板开口内。 在第一磁屏蔽和基板之间施加粘合剂以将第一磁屏蔽件附接到基板。 将MRAM管芯连接到第一磁屏蔽，并且MRAM管芯的接合焊盘通过电线连接到衬底上的焊盘。 第二磁屏蔽连接到MRAM管芯的顶表面。 将封装材料分配到基板上，MRAM管芯，第二磁屏蔽件和第一磁屏蔽件的一部分固化，然后去除磁带。 焊球然后可以附着到基板上。

公开(公告)号：US08466539B2

公开(公告)日：2013-06-18

申请号：US13334006

申请日：2011-12-21

Applicant: Jun Li ,  Jianhong Wang ,  Xuesong Xu ,  Jinzhong Yao ,  Wanming Yu

Inventor： Jun Li ,  Jianhong Wang ,  Xuesong Xu ,  Jinzhong Yao ,  Wanming Yu

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

Abstract translation: 一种组装磁阻随机存取存储器（MRAM）器件的方法包括提供具有开口的衬底。 将带施加到基板的表面，并且第一磁屏蔽被放置在带上和基板开口内。 在第一磁屏蔽和基板之间施加粘合剂以将第一磁屏蔽件附接到基板。 将MRAM管芯连接到第一磁屏蔽，并且MRAM管芯的接合焊盘通过电线连接到衬底上的焊盘。 第二磁屏蔽连接到MRAM管芯的顶表面。 将封装材料分配到基板上，MRAM裸片，第二磁屏蔽和第一磁屏蔽的一部分固化，然后去除胶带。 焊球然后可以附着到基板上。

公开(公告)号：US08354739B2

公开(公告)日：2013-01-15

申请号：US13092159

申请日：2011-04-22

Applicant: Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

Inventor： Yeqing Su ,  Zhigang Bai ,  Weimin Chen ,  Wei Shen ,  Jianhong Wang ,  Baoguan Yin ,  Wanming Yu

IPC: H01L23/495 ,  H01L21/28

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2224/45099

Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.

Abstract translation: 一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。 引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。 半导体管芯安装在中央区域的可拆卸基板上。 半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。 引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。 将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。 然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。 然后去除部分第一密封剂以减小包装的厚度并暴露引线。