公开(公告)号：US5545915A

公开(公告)日：1996-08-13

申请号：US376566

申请日：1995-01-23

Applicant: Donald R. Disney ,  Wayne A. Sozansky ,  James M. Himelick

Inventor： Donald R. Disney ,  Wayne A. Sozansky ,  James M. Himelick

IPC: H01L23/58 ,  H01L29/06 ,  H01L29/10 ,  H01L29/78 ,  H01L29/76 ,  H01L29/94

CPC classification number: H01L29/7802 ,  H01L23/585 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/41766 ,  H01L2924/0002 ,  Y10S148/044

Abstract: A semiconductor device characterized by a field limiting ring formed by a number of field limiting cells that define wells which are laterally diffused to form a continuous equipotential ring between interior and exterior regions of a semiconductor device. A number of active cells are formed in the interior region, and are therefore delineated from the exterior region of the device. Each of these active cells is a transistor, and preferably a field-effect transistor, whose structure is essentially identical to the field limiting cells, except that their wells are not merged but instead are isolated from each other. The field limiting ring increases the breakdown voltage and the ruggedness of device, and therefore enables the device to sustain high voltages when the device is in the off-state. The process does not require masking, implanting and diffusion steps for the sole purpose of forming the field limiting ring, but is instead fully integrated with the semiconductor process for forming the active cells. The field limiting cells also contribute to forward current conduction when the device is in the on-state, thereby lowering the on-resistance of the device.

Abstract translation: 一种半导体器件，其特征在于由许多场限制电池形成的场限制环，所述场限制电池限定了横向扩散以在半导体器件的内部和外部区域之间形成连续等电位环的阱。 在内部区域中形成多个活性细胞，因此从装置的外部区域划出。 这些有源电池中的每一个都是晶体管，优选场效应晶体管，其结构基本上与场限制电池相同，不同之处在于它们的阱不被合并，而是相互隔离。 场限制环增加了击穿电压和器件的坚固性，因此当器件处于关断状态时，器件能够维持高电压。 该方法不需要用于形成场限制环的唯一目的的掩蔽，植入和扩散步骤，而是与用于形成活性细胞的半导体工艺完全整合。 当器件处于导通状态时，场限制单元还有助于正向电流传导，从而降低器件的导通电阻。

公开(公告)号：US5461008A

公开(公告)日：1995-10-24

申请号：US249815

申请日：1994-05-26

Applicant: Richard M. Sutherland ,  Howard E. Harrell ,  Wayne A. Sozansky ,  George C. Wolf

Inventor： Richard M. Sutherland ,  Howard E. Harrell ,  Wayne A. Sozansky ,  George C. Wolf

IPC: B08B17/00 ,  B23D59/02 ,  H01L21/301 ,  H01L21/302 ,  H01L21/304 ,  H01L21/463

CPC classification number: B08B17/00 ,  B23D59/02 ,  Y10T83/041 ,  Y10T83/0443

Abstract: A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.

Abstract translation: 在通过锯切切割硅晶片期间抑制硅颗粒粘附到IC接合焊盘的方法及其腐蚀。 加入有机酸的阴离子以锯制冷却水。

公开(公告)号：US20080310115A1

公开(公告)日：2008-12-18

申请号：US11818827

申请日：2007-06-15

Applicant: Scott D. Brandenburg ,  Ralph S. Taylor ,  Wayne A. Sozansky

Inventor： Scott D. Brandenburg ,  Ralph S. Taylor ,  Wayne A. Sozansky

IPC: H05K7/20 ,  H01S4/00

CPC classification number: H01L23/3733 ,  H01L23/42 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2924/01019 ,  H01L2924/01079 ,  Y10T29/49002 ,  H01L2924/0665

Abstract: An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.

Abstract translation: 用于将热量从集成电路装置传导到散热器中的改进的热界面材料是复合材料，其包括限定开口的金属丝网和结合到金属丝网的开口中的硬化结构粘合剂。 改进的复合热界面材料具有优于常规热界面材料的优异的粘合性能，同时还具有出色的导热性。

公开(公告)号：US20120168208A1

公开(公告)日：2012-07-05

申请号：US12981865

申请日：2010-12-30

Applicant: WAYNE A. SOZANSKY ,  SHING YEH

Inventor： WAYNE A. SOZANSKY ,  SHING YEH

IPC: H05K1/02 ,  B23K1/20

CPC classification number: H05K3/3421 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y02P70/613

Abstract: A system and method for supporting an electronic component attached to a circuit board. Solder paste is applied to a solder pad underneath and aligned with a non-wetting region of an electronic component to form a support formed of solder to prevent electronic component lead flexing. The amount of solder for forming the support and the size of the solder pad are selected to bring the support into contact with, or in close proximity to, the non-wetting region.

Abstract translation: 一种用于支撑附接到电路板的电子部件的系统和方法。 将焊膏施加到下面的焊盘并与电子部件的非润湿区域对准以形成由焊料形成的支撑件，以防止电子部件引线弯曲。 选择用于形成载体的焊料的量和焊盘的尺寸以使支撑体与非润湿区域接触或非常接近。

公开(公告)号：US20080307643A1

公开(公告)日：2008-12-18

申请号：US11818840

申请日：2007-06-15

Applicant: Wayne A. Sozansky

Inventor： Wayne A. Sozansky

IPC: H05K3/34

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

Abstract translation: 将多个功率封装和热散热器组装到印刷电路板的改进方法包括在将功率封装的电引线焊接到印刷电路板之前将功率封装固定到散热器。 改进的过程允许功率封装的电引线在印刷电路板的引线孔中自由移动，因为实现了散热器和功率封装之间的平坦的平坦表面到平坦的表面接触，从而消除或至少基本上减少了引线弯曲 这在常规工艺中发生，其中在功率封装的引线已经被焊接到印刷电路板之后发生散热器附接到功率封装。