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公开(公告)号：US4685331A
公开(公告)日：1987-08-11
申请号：US721535
申请日：1985-04-10
CPC分类号： G01F1/698 , G01F1/6842 , G01F1/6845 , G05D7/0635 , Y10T137/7759
摘要： A mass flowmeter and controller measures the mass flow rate of liquid or gaseous fluids and controls the flow rate of the fluids being utilized in a processing operation. A series of flow channels and blocked channels are micro-etched from a silicon substrate leaving an integral membrane suspended across the channels. A heater-sensor thin film resistor, diode or transistor is formed on the membranes and the substrate during manufacture to sense the temperature at particular locations. A cover housing matching channels and grooves forms flow and stagnant blocked conduits in the structure. Through a bridge circuit a signal indicative of mass flow is produced. This signal is passed to a control valve armature coil in an in-line flow control valve. The controller includes a sensor module containing monitored flow and blocked channels and passive by-pass channels as required for additional flow capacity, a control valve cartridge, an overall housing and the magnetic armature coil which controls the flow of fluid through the valve and the sensor module.
摘要翻译： 质量流量计和控制器测量液体或气体流体的质量流量并控制在处理操作中使用的流体的流速。 从硅衬底对一系列流动通道和阻塞通道进行微蚀刻，留下悬挂在通道上的整体膜。 在制造期间，在膜和基板上形成加热器传感器薄膜电阻器，二极管或晶体管以感测特定位置处的温度。 匹配通道和凹槽的盖壳在结构中形成流动和停滞的阻塞管道。 通过桥接电路产生指示质量流量的信号。 该信号被传递到在线流量控制阀中的控制阀电枢线圈。 该控制器包括一个传感器模块，该传感器模块包含监控流量和阻塞通道以及额外流量所需的被动旁通通道，控制阀芯，整体外壳和磁性衔铁线圈，其控制通过阀门和传感器的流体流动 模块。
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公开(公告)号：US4542650A
公开(公告)日：1985-09-24
申请号：US526860
申请日：1983-08-26
申请人： Wayne G. Renken , Dan B. LeMay
发明人： Wayne G. Renken , Dan B. LeMay
CPC分类号： G01F1/6842 , G01F1/6845 , G01F1/696 , G01F1/6965
摘要： The flow meter (10), particularly useful in monitoring flow in semiconductor manufacturing operations, measures mass flow rate of fluids and is fabricated by providing spaced webs (16) deposited on a silicon substrate (11) and fluid flow grooves (13) etched across a substrate surface and extending under the spaced webs. The webs 16 include a low thermal conductivity layer deposited in spaced aligned portions of the substrate and electrically resistive pathways deposited on the layer portions (61). The webs act as temperature sensors and/or heaters. Heat is added to the flowing fluid and a differential temperature is measured on a bridge circuit as is known in the art to measure flow rate. A cover (12) has etched grooves (14a) which match the grooves (13) of the substrate to form a fluid passageway in which the web bisects the passageway forming an "air-foil" like bridging member extending completely across (or cantilevered across) in transverse relation to the flat sides of the substrate on either side of the groove. Normally multiple series of webs and multiple grooves are employed to provide redundancy of the flow meter channels in the event contaminants plug a particular channel.
摘要翻译： 特别适用于监测半导体制造操作中的流量的流量计（10）测量流体的质量流量，并且通过提供沉积在硅衬底（11）上的间隔的腹板（16）和跨越 衬底表面并在间隔开的网下延伸。 腹板16包括沉积在衬底的间隔对齐的部分中的低热导率层和沉积在层部分（61）上的电阻通路。 纤维网作为温度传感器和/或加热器。 将热量添加到流动的流体中，并且在桥式电路上测量差分温度，如本领域已知的测量流速。 盖（12）具有与衬底的凹槽（13）匹配的蚀刻槽（14a），以形成流体通道，在该通道中，幅材将形成“空气箔”的通道平分成像桥接构件完全横跨（或悬臂跨过） ）与槽的任一侧上的基板的平坦侧呈横向关系。 通常，在污染物堵塞特定通道的情况下，采用多系列腹板和多个凹槽来提供流量计通道的冗余。
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公开(公告)号：US4690371A
公开(公告)日：1987-09-01
申请号：US790279
申请日：1985-10-22
CPC分类号： F16K31/082 , H01F7/1615 , H01F7/18 , H01F7/122
摘要： A modulating valve is described for controlling the flow of a working fluid through a flow orifice. The valve includes a encapsulated armature having a permanent magnet and a pair of soft iron pole pieces within its interior. The armature is axially movable by the passage of current through one or a dual pair of solenoid coils surrounding the armature. A thin webbed sealing disk is stretched over the end of an armature housing extension and acts to close or modulate flow of working fluid by varying the axial clearance between the disk and a stationary annular seat of the flow orifice. The armature is supported on flexure guide springs that allow armature axial motion when axial magnetic forces are applied to the armature. These axial forces are provided by the interaction of the solenoid coil(s) and the field of the permanent magnet. A magnetic field gradient produced by the permanent magnet allows the coil to apply a force to the armature in either the valve opening or valve closing direction, depending on the coil current polarity. An armature velocity signal is used in a closed loop servo control of valve position to suppress valve oscillation and over shoot when a change in valve position is commanded.
摘要翻译： 描述了用于控制通过流动孔口的工作流体的流动的调节阀。 该阀包括其内部具有永磁体和一对软铁极片的封装电枢。 电枢可以通过电流通过围绕电枢的一对或双对电磁线圈而轴向移动。 薄的网状密封盘在电枢壳体延伸部的端部被拉伸，并且通过改变圆盘和流动孔口的固定的环形座之间的轴向间隙来作用来闭合或调节工作流体的流动。 电枢被支撑在弯曲导向弹簧上，当轴向磁力施加到电枢时允许电枢轴向运动。 这些轴向力由螺线管线圈与永磁体的磁场相互作用而提供。 由永久磁铁产生的磁场梯度允许线圈根据线圈电流极性在电磁阀或阀门关闭方向上向衔铁施加力。 电枢速度信号用于阀门位置的闭环伺服控制，以便在命令阀位置变化时抑制阀振动和过冲。
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公开(公告)号：US20130029433A1
公开(公告)日：2013-01-31
申请号：US13361869
申请日：2012-01-30
申请人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony Dibiase
发明人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony Dibiase
CPC分类号： H01L21/67253 , G03F7/70616 , G03F7/7085 , G03F7/70875 , Y10T29/4913
摘要： An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译： 仪器包括基板，分布在基板表面上的位置处的多个传感器，表面上的至少一个电子处理部件，横跨表面延伸并连接到传感器和处理部件的电导体，以及设置在传感器 ，处理部件和导体。 覆盖物和基材与生产基材具有相似的材料性质。 盖被配置为电磁屏蔽传感器，导体或处理部件。 仪器具有与生产基底大致相同的厚度和/或平坦度。 要强调的是，提供这个摘要是为了符合要求摘要的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US08046193B2
公开(公告)日：2011-10-25
申请号：US12107007
申请日：2008-04-21
CPC分类号： G05B23/0254
摘要： A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.
摘要翻译： 传感器网络从过程工具收集时间序列数据，并将数据提供给分析系统，其中使用模式分析技术来识别结构并基于分析指令或复合模型监视后续数据。 来自多个过程运行的时间序列数据用于形成包括变化的数据结构的复合模型。 与复合模型的比较给出了工具健康的指示。 传感器网络可以具有用于更简化配置的分布式存储器。
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公开(公告)号：US07819033B2
公开(公告)日：2010-10-26
申请号：US12106998
申请日：2008-04-21
申请人： Wayne G. Renken
发明人： Wayne G. Renken
IPC分类号： G01D7/02
CPC分类号： H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
摘要翻译： 一种测量装置，其包括具有测量晶片在制造期间可能经历的加工条件的传感器的基板。 基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。 设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。
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公开(公告)号：US08104342B2
公开(公告)日：2012-01-31
申请号：US12034041
申请日：2008-02-20
申请人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony DiBiase
发明人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony DiBiase
IPC分类号： G01D11/24
CPC分类号： H01L21/67253 , G03F7/70616 , G03F7/7085 , G03F7/70875 , Y10T29/4913
摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。
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公开(公告)号：US07757574B2
公开(公告)日：2010-07-20
申请号：US11302763
申请日：2005-12-13
申请人： Wayne G. Renken , Mei H. Sun
发明人： Wayne G. Renken , Mei H. Sun
IPC分类号： G01D7/02
CPC分类号： G01D9/005 , H01L21/67253 , H01L22/34 , H01L2224/48091 , Y10T29/4913 , H01L2924/00014
摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
摘要翻译： 一种测量装置，其包含具有测量晶片在制造过程中可能经历的加工条件的传感器的基板。 基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。 设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。 可以通过真空或合适的材料提供隔离，并且相变材料可以位于电子设备附近以保持低温。
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公开(公告)号：US20090056441A1
公开(公告)日：2009-03-05
申请号：US12034041
申请日：2008-02-20
申请人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony DiBiase
发明人： Mei H. Sun , Mark Wiltse , Wayne G. Renken , Zachary Reid , Tony DiBiase
CPC分类号： H01L21/67253 , G03F7/70616 , G03F7/7085 , G03F7/70875 , Y10T29/4913
摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。
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10.发明授权Process condition measuring device and method for measuring shear force on a surface of a substrate that undergoes a polishing or planarization process 有权用于测量经历抛光或平坦化处理的基板表面上的剪切力的工艺条件测量装置和方法公开(公告)号：US07497134B2
公开(公告)日：2009-03-03
申请号：US11861207
申请日：2007-09-25
IPC分类号： G01L1/16
CPC分类号： G01L1/148 , G01L5/0047 , G01L9/0042 , G01L9/0073
摘要： At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译： 当构件与抛光或平坦化表面接触并压靠在抛光或平坦化表面上并且在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。 优选地，结构和结构的表面具有与诸如半导体晶片或平板显示面板的实际基板基本上相同的性质（例如以下的一个或多个：尺寸和摩擦系数）。
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