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公开(公告)号：US08115292B2
公开(公告)日：2012-02-14
申请号：US12604613
申请日：2009-10-23
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Anthony Yi Sheng Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Anthony Yi Sheng Sun
IPC分类号： H01L23/02
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US08772921B2
公开(公告)日：2014-07-08
申请号：US13347683
申请日：2012-01-10
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
IPC分类号： H01L23/02
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US20120104628A1
公开(公告)日：2012-05-03
申请号：US13347683
申请日：2012-01-10
申请人： Chin Hock TOH , Yao Huang HUANG , Ravi Kanth KOLAN , Wei Liang YUAN , Susanto TANARY , Yi Sheng Anthony SUN
发明人： Chin Hock TOH , Yao Huang HUANG , Ravi Kanth KOLAN , Wei Liang YUAN , Susanto TANARY , Yi Sheng Anthony SUN
IPC分类号： H01L23/538 , H01L21/768
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US20100109142A1
公开(公告)日：2010-05-06
申请号：US12604613
申请日：2009-10-23
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
IPC分类号： H01L23/498 , H05K1/11 , H05K3/10
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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