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公开(公告)号：US08115292B2
公开(公告)日：2012-02-14
申请号：US12604613
申请日：2009-10-23
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Anthony Yi Sheng Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Anthony Yi Sheng Sun
IPC分类号： H01L23/02
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US08772921B2
公开(公告)日：2014-07-08
申请号：US13347683
申请日：2012-01-10
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
IPC分类号： H01L23/02
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US20100109142A1
公开(公告)日：2010-05-06
申请号：US12604613
申请日：2009-10-23
申请人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
发明人： Chin Hock Toh , Yao Huang Huang , Ravi Kanth Kolan , Wei Liang Yuan , Susanto Tanary , Yi Sheng Anthony Sun
IPC分类号： H01L23/498 , H05K1/11 , H05K3/10
CPC分类号： H01L21/563 , H01L21/486 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15311 , H05K3/3478 , H05K2201/09481 , H05K2201/09509 , H05K2201/09572 , H05K2201/10378 , H05K2203/043 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。
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公开(公告)号：US20100109169A1
公开(公告)日：2010-05-06
申请号：US12431363
申请日：2009-04-28
申请人： Ravi Kanth KOLAN , Anthony Yi-Sheng Sun , Chin Hock Toh , Catherine Bee Liang Ng , Xue Ren Zhang
发明人： Ravi Kanth KOLAN , Anthony Yi-Sheng Sun , Chin Hock Toh , Catherine Bee Liang Ng , Xue Ren Zhang
CPC分类号： H01L23/3128 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/16 , H01L23/3114 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/19 , H01L24/81 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/06181 , H01L2224/12105 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2224/81005 , H01L2224/81801 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/00012 , H01L2224/81 , H01L2924/00 , H01L2224/83 , H01L2224/11 , H01L2224/03
摘要： A stiffener is provided for use in making semiconductor devices. The stiffener and method of use provided prevent or reduce warpage of a semiconductor package during the assembly process. More particularly, the stiffener functions to prevent or reduce warpage during molding of an assembly of wafers and/or dies. The stiffener may be positioned above the backside or non-active side of an assembly of wafer and/or dies during molding. The presence of the stiffener prevents or reduces warpage caused by CTE mismatch between the mold material and the wafer and/or under the high temperatures encountered in the process of molding. After molding, the stiffener may continue to provide support to the assembly.
摘要翻译： 提供加强件用于制造半导体器件。 加强件和使用方法在组装过程中防止或减少半导体封装的翘曲。 更具体地，加强件用于在模制晶片和/或模具的组件期间防止或减少翘曲。 在模制期间，加强件可以位于晶片和/或模具的组件的背侧或非活动侧上方。 加强件的存在防止或减少由模具材料和晶片之间和/或在模制过程中遇到的高温下的CTE失配引起的翘曲。 在模制之后，加强件可以继续为组件提供支撑。
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公开(公告)号：US08143719B2
公开(公告)日：2012-03-27
申请号：US12133377
申请日：2008-06-05
申请人： Chin Hock Toh , Hao Liu , Ravi Kanth Kolan
发明人： Chin Hock Toh , Hao Liu , Ravi Kanth Kolan
CPC分类号： H01L23/481 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/0554 , H01L2224/05573 , H01L2224/05647 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/812 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/18161 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
摘要翻译： 公开了一种包括具有第一和第二主表面的基板的管芯。 模具具有至少一个未填充的穿过基底的主表面的通孔。 未填充的通孔用作排气口以释放组装期间产生的压力。
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公开(公告)号：US08426246B2
公开(公告)日：2013-04-23
申请号：US13400578
申请日：2012-02-21
申请人： Chin Hock Toh , Hao Liu , Ravi Kanth Kolan
发明人： Chin Hock Toh , Hao Liu , Ravi Kanth Kolan
IPC分类号： H01L21/00
CPC分类号： H01L23/481 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/0554 , H01L2224/05573 , H01L2224/05647 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/812 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/18161 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
摘要翻译： 公开了一种包括具有第一和第二主表面的基板的管芯。 模具具有至少一个未填充的穿过基底的主表面的通孔。 未填充的通孔用作排气口以释放组装期间产生的压力。
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公开(公告)号：US08586465B2
公开(公告)日：2013-11-19
申请号：US12133376
申请日：2008-06-05
申请人： Hao Liu , Yi Sheng Anthony Sun , Ravi Kanth Kolan , Chin Hock Toh
发明人： Hao Liu , Yi Sheng Anthony Sun , Ravi Kanth Kolan , Chin Hock Toh
IPC分类号： H01L21/768
CPC分类号： H01L24/80 , H01L21/768 , H01L21/76898 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2221/68377 , H01L2224/0554 , H01L2224/05573 , H01L2224/1132 , H01L2224/1147 , H01L2224/13025 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16237 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83856 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings.
摘要翻译： 公开了一种用于制造包装用模具的方法。 提供具有第一和第二主表面的模具。 在模具的第一主表面上形成通孔和掩模层。 掩模包括露出通孔的掩模开口。 掩模开口用导电材料填充。 该方法包括回流以至少部分地填充通孔和接触开口，以在掩模开口中的通孔和表面接触中形成通孔接触。
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公开(公告)号：US08384203B2
公开(公告)日：2013-02-26
申请号：US12505552
申请日：2009-07-20
CPC分类号： H01L21/568 , H01L21/50 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L21/78 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/03 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2221/68345 , H01L2224/0231 , H01L2224/0237 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24227 , H01L2224/2518 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01029 , H01L2924/01033 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2224/82 , H01L2924/00
摘要： A structural member for use in semiconductor packaging is disclosed. The structural member includes a plurality of packaging regions to facilitate packaging dies in, for example, a wafer format. A packaging region has a die attach region surrounded by a peripheral region. A die is attached to the die attach region. In one aspect, the die attach region has opening through the surfaces of the structural member for accommodating a die. Through-vias disposed are in the peripheral regions. The structural member reduces warpage that can occur during curing of the mold compound used in encapsulating the dies. In another aspect, the die attach region does not have an opening. In such cases, the structural member serves as an interposer between the die and a substrate.
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公开(公告)号：US08399985B2
公开(公告)日：2013-03-19
申请号：US13244630
申请日：2011-09-25
申请人： Ravi Kanth Kolan , Hao Liu , Chin Hock Toh
发明人： Ravi Kanth Kolan , Hao Liu , Chin Hock Toh
IPC分类号： H01L23/36
CPC分类号： H01L25/0657 , H01L21/50 , H01L23/10 , H01L23/24 , H01L23/3128 , H01L24/81 , H01L24/97 , H01L25/50 , H01L2224/13111 , H01L2224/16 , H01L2224/73253 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： A chip package includes a carrier having a first and a second major surface. The first major surface includes an active region surrounded by an inactive region. The chip package includes contact pads in the active region for mating with chip contacts of a chip. A support structure is disposed on the inactive region of the first major surface. The support structure forms a dam that surrounds the active region. When a chip or chip stack is mounted in the active region, spacing exists between the dam and the chip or chip stack. The spacing creates convention paths for heat dissipation.
摘要翻译： 芯片封装包括具有第一和第二主表面的载体。 第一主表面包括被非活性区域包围的有源区域。 芯片封装包括有源区中的接触焊盘，用于与芯片的芯片触点配合。 支撑结构设置在第一主表面的无活性区域上。 支撑结构形成围绕活动区域的坝。 当芯片或芯片堆叠安装在有源区域中时，坝和芯片或芯片堆叠之间存在间隔。 间距创建了用于散热的常规路径。
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公开(公告)号：US08030761B2
公开(公告)日：2011-10-04
申请号：US12125924
申请日：2008-05-23
申请人： Ravi Kanth Kolan , Hao Liu , Chin Hock Toh
发明人： Ravi Kanth Kolan , Hao Liu , Chin Hock Toh
IPC分类号： H01L23/36
CPC分类号： H01L25/0657 , H01L21/50 , H01L23/10 , H01L23/24 , H01L23/3128 , H01L24/81 , H01L24/97 , H01L25/50 , H01L2224/13111 , H01L2224/16 , H01L2224/73253 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： A chip package includes a carrier having a first and a second major surface. The first major surface includes an active region surrounded by an inactive region. The chip package includes contact pads in the active region for mating with chip contacts of a chip. A support structure is disposed on the inactive region of the first major surface. The support structure forms a dam that surrounds the active region. When a chip or chip stack is mounted in the active region, spacing exists between the dam and the chip or chip stack. The spacing creates convention paths for heat dissipation.
摘要翻译： 芯片封装包括具有第一和第二主表面的载体。 第一主表面包括被非活性区域包围的有源区域。 芯片封装包括有源区中的接触焊盘，用于与芯片的芯片触点配合。 支撑结构设置在第一主表面的无活性区域上。 支撑结构形成围绕活动区域的坝。 当芯片或芯片堆叠安装在有源区域中时，坝和芯片或芯片堆叠之间存在间隔。 间距创建了用于散热的常规路径。
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