公开(公告)号：US20070214965A1

公开(公告)日：2007-09-20

申请号：US11800753

申请日：2007-05-07

申请人： William Burdick

发明人： William Burdick

IPC分类号： C12C13/00

CPC分类号： C12C11/00 ,  C12C7/00 ,  C12C7/205 ,  C12C7/26 ,  C12C7/28 ,  C12C11/003 ,  C12C13/10

摘要： A commercial multiple barrel beer brewing apparatus includes a brew kettle at a first location; a hopped wort holding vessel; a chiller for chilling the hopped wort stored in the holding vessel to a temperature range of approximately 29° F. to 40° F.; a transportation vessel on a vehicle to transport chilled hopped wort to a brew pub; a first conduit between the chilled hopped wort holding vessel and the transportation vessel; a fermentation vessel located a brew pub; and a second conduit between the transportation vessel and the fermentation vessel.

摘要翻译： 商业多桶啤酒酿造设备包括在第一位置的冲泡水壶; 一个跳过的麦芽汁控制船; 用于将储存在储存容器中的跳过的麦芽汁冷却至约29°F至40°F的温度范围的冷却器; 车辆上的运输船，将冷冻的麦芽汁运送到酿造酒吧; 冷冻的跳过的麦芽汁保存容器和运输容器之间的第一管道; 位于酿造酒吧的发酵容器; 以及在运输容器和发酵容器之间的第二导管。

公开(公告)号：US20070188175A1

公开(公告)日：2007-08-16

申请号：US11352833

申请日：2006-02-13

申请人： William Burdick ,  Richard Frey ,  James Sabatini

发明人： William Burdick ,  Richard Frey ,  James Sabatini

IPC分类号： G01V3/00

CPC分类号： G01R33/3415 ,  G01R33/34007 ,  G01R33/34084 ,  G01R33/3621 ,  G01R33/3692 ,  G01R33/422 ,  G01R33/481 ,  G01R33/4812

摘要： An improved magnetic resonance (MR) imaging system (10) is provided. A plurality of receiver coils (12) may be configured to supply respective coil output signals based on a plurality of magnetic resonance response signals sensed by the receiver coils. Each receiver coil defines an enclosure constituting a Faraday cage. At least one circuit device (22) is disposed in the enclosure (24) to condition the coil output signal. This enclosure enables the circuit device (22) to be shielded from electromagnetic interference.

摘要翻译： 提供改进的磁共振（MR）成像系统（10）。 多个接收器线圈（12）可以被配置为基于由接收器线圈感测的多个磁共振响应信号来提供相应的线圈输出信号。 每个接收器线圈限定构成法拉第笼的外壳。 至少一个电路装置（22）设置在外壳（24）中以调节线圈输出信号。 该外壳使电路设备（22）能够屏蔽电磁干扰。

公开(公告)号：US20070012965A1

公开(公告)日：2007-01-18

申请号：US11183363

申请日：2005-07-15

申请人： Peter Sandvik ,  Dale Brown ,  William Burdick ,  James Rose ,  Donna Sherman ,  Jonathan Short ,  Naresh Rao

发明人： Peter Sandvik ,  Dale Brown ,  William Burdick ,  James Rose ,  Donna Sherman ,  Jonathan Short ,  Naresh Rao

IPC分类号： H01L31/0328 ,  H01L21/00

CPC分类号： H01L31/02162 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14658 ,  H01L31/0203 ,  H01L31/0312 ,  H01L31/101 ,  H01L2224/48227 ,  H04N5/32

摘要： One photodetection system includes a wide bandgap photodetector array which is physically and electrically integrated on a flexible interconnect layer including electrical connections, which is packaged in a manner for being electrically integrated with processing electronics such that the packaging and the processing electronics are configured for obtaining and processing signals detected by the photodetector array, or which includes both the flexible interconnect layer and processing electronics packaging features. Another photodetection system includes a wide bandgap focal plane array module including a photodetector pixel array, scan registers, a substrate supporting the array and the scan registers, and electrical interconnections coupling each pixel to at least two of the scan registers.

摘要翻译： 一个光电检测系统包括宽带隙光电检测器阵列，其物理和电学上集成在包括电连接的柔性互连层上，该电连接被封装为与处理电子器件电气集成的方式，使得封装和处理电子器件被配置用于获得和 处理由光电检测器阵列检测到的信号，或者包括柔性互连层和处理电子器件封装特征两者。 另一光电检测系统包括宽带隙焦平面阵列模块，其包括光电检测器像素阵列，扫描寄存器，支撑阵列的基板和扫描寄存器，以及将每个像素耦合到至少两个扫描寄存器的电互连。

公开(公告)号：US20050286682A1

公开(公告)日：2005-12-29

申请号：US10881950

申请日：2004-06-29

申请人： John Tkaczyk ,  William Burdick ,  Naresh Rao

发明人： John Tkaczyk ,  William Burdick ,  Naresh Rao

IPC分类号： A61B6/03 ,  G01N23/04 ,  G01T1/20 ,  G01T1/29 ,  H05G1/64

CPC分类号： G01T1/2928 ,  G01T1/2018

摘要： A detector module for use in an imaging system is provided. The detector comprises at least one sensor array configured for receiving X-ray signals and converting the X-ray signals to corresponding electrical signals, at least one electronic device configured for converting the electrical signals to a corresponding digital signal and a switching circuit coupling the sensor array and the electronic device, wherein the switching circuit is configured for routing the electrical signals from the sensor array to the electronic device.

摘要翻译： 提供了一种用于成像系统中的检测器模块。 所述检测器包括至少一个传感器阵列，其被配置用于接收X射线信号并将X射线信号转换成相应的电信号，至少一个电子设备被配置为将电信号转换成对应的数字信号，以及将传感器 阵列和电子设备，其中开关电路被配置为将电信号从传感器阵列路由到电子设备。

公开(公告)号：US20060133198A1

公开(公告)日：2006-06-22

申请号：US11003054

申请日：2004-12-03

申请人： Rayette Fisher ,  William Burdick ,  James Rose

发明人： Rayette Fisher ,  William Burdick ,  James Rose

IPC分类号： H04B17/00

CPC分类号： H01L27/14601

摘要： A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.

摘要翻译： 一种大面积传感器阵列，包括具有正面和背面的基底，多个换能器，设置在基板的前侧，并以XY平面中的二维换能器阵列的形式图案化，多个连接器被设置 在衬底的背面，其中连接器电耦合到换能器元件。 此外，堆叠的换能器阵列包括设置在第一层中的电子器件，包括正面和背面的衬底，设置在衬底上的电互连层和设置在第三层中的多个换能器，其中换能器电耦合 到设置在第一层中的电子设备。

公开(公告)号：US20060068576A1

公开(公告)日：2006-03-30

申请号：US10955408

申请日：2004-09-30

申请人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

发明人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

IPC分类号： H01L21/3205

CPC分类号： H05K3/20 ,  H05K1/0393 ,  H05K2201/0317 ,  H05K2203/016

摘要： A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect. A detector for use in an imaging system comprises the aforementioned interconnect.

摘要翻译： 一种用于制造互连的方法，包括提供载体衬底，其中所述载体衬底包括多个互连迹线和多个输入/输出触点; 提供具有第一侧和第二侧的柔性基板，将牺牲层的第二侧设置在柔性基板的第一侧上以形成第一组件，将载体基板设置在第一组件上; 以及去除所述牺牲层和所述载体衬底以形成所述互连。 用于成像系统的检测器包括上述互连。

公开(公告)号：US20070254468A1

公开(公告)日：2007-11-01

申请号：US11824206

申请日：2007-06-29

申请人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

发明人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

IPC分类号： H01L21/3205

CPC分类号： H05K3/20 ,  H05K1/0393 ,  H05K2201/0317 ,  H05K2203/016

摘要： A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect.

摘要翻译： 一种用于制造互连的方法，包括提供载体衬底，其中所述载体衬底包括多个互连迹线和多个输入/输出触点; 提供具有第一侧和第二侧的柔性基板，将牺牲层的第二侧设置在柔性基板的第一侧上以形成第一组件，将载体基板设置在第一组件上; 以及去除牺牲层和载体衬底以形成互连。

公开(公告)号：US20070207237A1

公开(公告)日：2007-09-06

申请号：US11800752

申请日：2007-05-07

申请人： William Burdick

发明人： William Burdick

IPC分类号： C12C11/00

CPC分类号： C12C11/00 ,  C12C7/00 ,  C12C7/205 ,  C12C7/26 ,  C12C7/28 ,  C12C11/003 ,  C12C13/10

摘要： A method for distributed production of beer includes the steps of: producing multiple barrels of hopped wort in a brew kettle; chilling the hopped wort and transferring it to a transportation vessel on a vehicle; transporting the chilled hopped wort to a brew pub; transferring the hopped wort into a fermentation vessel at the brew pub; elevating the hopped wort to an appropriate fermentation temperature; and adding a predetermined amount of yeast cells to the hopped wort in the fermentation vessel to produce beer.

摘要翻译： 啤酒分布式生产的方法包括以下步骤：在冲泡水壶中生产多桶啤酒花; 将麦芽汁倒入冰箱中，将其转移到交通工具上的运输船上; 将冷冻的麦芽汁运送到酿造酒吧; 将啤酒麦芽汁转移到酿造酒吧的发酵罐中; 将跳过的麦芽汁提升至合适的发酵温度; 并将预定量的酵母细胞加入发酵容器中的啤酒花啤酒中。

公开(公告)号：US20060092615A1

公开(公告)日：2006-05-04

申请号：US10975952

申请日：2004-10-28

申请人： William Burdick ,  James Rose ,  John Tkaczyk ,  Oded Meirav ,  Jerome Arenson ,  David Hoffman

发明人： William Burdick ,  James Rose ,  John Tkaczyk ,  Oded Meirav ,  Jerome Arenson ,  David Hoffman

IPC分类号： H05K1/14

CPC分类号： H05K1/147 ,  H05K2201/10151

摘要： An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.

摘要翻译： 一种用于电子设备的互连结构，其中所述互连结构包括包括柔性材料的第一基底，其中所述第一基底包括前侧和后侧，并且其中所述第一基底构造成在前面接收传感器 侧; 以及耦合到所述第一基板的背面并且包括刚性材料的第二基板。 用于成像系统的检测器模块包括上述互连结构。

公开(公告)号：US20050285264A1

公开(公告)日：2005-12-29

申请号：US10877256

申请日：2004-06-28

申请人： William Burdick ,  James Rose ,  Michael Rumsey

发明人： William Burdick ,  James Rose ,  Michael Rumsey

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01R12/00 ,  H05K1/11 ,  H05K1/18

CPC分类号： H01R12/62 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10719 ,  H01L2924/00

摘要： A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece.

摘要翻译： 本发明的高密度电互连系统具有至少一个基片和柔性环绕互连组件，该基片和柔性环绕互连组件从基片的第一表面延伸到基片的第二表面，其中布置柔性环绕互连 围绕基片的外表面。