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15 条记录 (耗时 0.03 秒)

    Electronic packaging and method of making the same
    1.
    发明申请
    Electronic packaging and method of making the same 有权
    电子封装及其制作方法

    公开(公告)号：US20060092615A1

    公开(公告)日：2006-05-04

    申请号：US10975952

    申请日：2004-10-28

    申请人： William Burdick ,  James Rose ,  John Tkaczyk ,  Oded Meirav ,  Jerome Arenson ,  David Hoffman

    发明人： William Burdick ,  James Rose ,  John Tkaczyk ,  Oded Meirav ,  Jerome Arenson ,  David Hoffman

    IPC分类号： H05K1/14

    CPC分类号： H05K1/147 ,  H05K2201/10151

    摘要： An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.

    摘要翻译： 一种用于电子设备的互连结构，其中所述互连结构包括包括柔性材料的第一基底，其中所述第一基底包括前侧和后侧，并且其中所述第一基底构造成在前面接收传感器 侧; 以及耦合到所述第一基板的背面并且包括刚性材料的第二基板。 用于成像系统的检测器模块包括上述互连结构。

    Detector for radiation imaging systems
    2.
    发明申请
    Detector for radiation imaging systems 审中-公开
    辐射成像系统检测器

    公开(公告)号：US20050286682A1

    公开(公告)日：2005-12-29

    申请号：US10881950

    申请日：2004-06-29

    申请人： John Tkaczyk ,  William Burdick ,  Naresh Rao

    发明人： John Tkaczyk ,  William Burdick ,  Naresh Rao

    IPC分类号： A61B6/03 ,  G01N23/04 ,  G01T1/20 ,  G01T1/29 ,  H05G1/64

    CPC分类号： G01T1/2928 ,  G01T1/2018

    摘要： A detector module for use in an imaging system is provided. The detector comprises at least one sensor array configured for receiving X-ray signals and converting the X-ray signals to corresponding electrical signals, at least one electronic device configured for converting the electrical signals to a corresponding digital signal and a switching circuit coupling the sensor array and the electronic device, wherein the switching circuit is configured for routing the electrical signals from the sensor array to the electronic device.

    摘要翻译： 提供了一种用于成像系统中的检测器模块。 所述检测器包括至少一个传感器阵列，其被配置用于接收X射线信号并将X射线信号转换成相应的电信号，至少一个电子设备被配置为将电信号转换成对应的数字信号，以及将传感器 阵列和电子设备，其中开关电路被配置为将电信号从传感器阵列路由到电子设备。

    Large area transducer array
    3.
    发明申请
    Large area transducer array 有权
    大面积换能器阵列

    公开(公告)号：US20060133198A1

    公开(公告)日：2006-06-22

    申请号：US11003054

    申请日：2004-12-03

    申请人： Rayette Fisher ,  William Burdick ,  James Rose

    发明人： Rayette Fisher ,  William Burdick ,  James Rose

    IPC分类号： H04B17/00

    CPC分类号： H01L27/14601

    摘要： A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.

    摘要翻译： 一种大面积传感器阵列，包括具有正面和背面的基底，多个换能器，设置在基板的前侧，并以XY平面中的二维换能器阵列的形式图案化，多个连接器被设置 在衬底的背面，其中连接器电耦合到换能器元件。 此外，堆叠的换能器阵列包括设置在第一层中的电子器件，包括正面和背面的衬底，设置在衬底上的电互连层和设置在第三层中的多个换能器，其中换能器电耦合 到设置在第一层中的电子设备。

    Lithography transfer for high density interconnect circuits
    4.
    发明申请
    Lithography transfer for high density interconnect circuits 审中-公开
    高密度互连电路的平版印刷传输

    公开(公告)号：US20060068576A1

    公开(公告)日：2006-03-30

    申请号：US10955408

    申请日：2004-09-30

    申请人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

    发明人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

    IPC分类号： H01L21/3205

    CPC分类号： H05K3/20 ,  H05K1/0393 ,  H05K2201/0317 ,  H05K2203/016

    摘要： A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect. A detector for use in an imaging system comprises the aforementioned interconnect.

    摘要翻译： 一种用于制造互连的方法，包括提供载体衬底，其中所述载体衬底包括多个互连迹线和多个输入/输出触点; 提供具有第一侧和第二侧的柔性基板，将牺牲层的第二侧设置在柔性基板的第一侧上以形成第一组件，将载体基板设置在第一组件上; 以及去除所述牺牲层和所述载体衬底以形成所述互连。 用于成像系统的检测器包括上述互连。

    Photodetection system and module
    5.
    发明申请
    Photodetection system and module 审中-公开
    光电检测系统和模块

    公开(公告)号：US20070012965A1

    公开(公告)日：2007-01-18

    申请号：US11183363

    申请日：2005-07-15

    申请人： Peter Sandvik ,  Dale Brown ,  William Burdick ,  James Rose ,  Donna Sherman ,  Jonathan Short ,  Naresh Rao

    发明人： Peter Sandvik ,  Dale Brown ,  William Burdick ,  James Rose ,  Donna Sherman ,  Jonathan Short ,  Naresh Rao

    IPC分类号： H01L31/0328 ,  H01L21/00

    CPC分类号： H01L31/02162 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14658 ,  H01L31/0203 ,  H01L31/0312 ,  H01L31/101 ,  H01L2224/48227 ,  H04N5/32

    摘要： One photodetection system includes a wide bandgap photodetector array which is physically and electrically integrated on a flexible interconnect layer including electrical connections, which is packaged in a manner for being electrically integrated with processing electronics such that the packaging and the processing electronics are configured for obtaining and processing signals detected by the photodetector array, or which includes both the flexible interconnect layer and processing electronics packaging features. Another photodetection system includes a wide bandgap focal plane array module including a photodetector pixel array, scan registers, a substrate supporting the array and the scan registers, and electrical interconnections coupling each pixel to at least two of the scan registers.

    摘要翻译： 一个光电检测系统包括宽带隙光电检测器阵列，其物理和电学上集成在包括电连接的柔性互连层上，该电连接被封装为与处理电子器件电气集成的方式，使得封装和处理电子器件被配置用于获得和 处理由光电检测器阵列检测到的信号，或者包括柔性互连层和处理电子器件封装特征两者。 另一光电检测系统包括宽带隙焦平面阵列模块，其包括光电检测器像素阵列，扫描寄存器，支撑阵列的基板和扫描寄存器，以及将每个像素耦合到至少两个扫描寄存器的电互连。

    Lithography transfer for high density interconnect circuits
    6.
    发明申请
    Lithography transfer for high density interconnect circuits 审中-公开
    高密度互连电路的平版印刷传输

    公开(公告)号：US20070254468A1

    公开(公告)日：2007-11-01

    申请号：US11824206

    申请日：2007-06-29

    申请人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

    发明人： William Burdick ,  James Rose ,  Kevin Durocher ,  James Sabatini

    IPC分类号： H01L21/3205

    CPC分类号： H05K3/20 ,  H05K1/0393 ,  H05K2201/0317 ,  H05K2203/016

    摘要： A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect.

    摘要翻译： 一种用于制造互连的方法，包括提供载体衬底，其中所述载体衬底包括多个互连迹线和多个输入/输出触点; 提供具有第一侧和第二侧的柔性基板，将牺牲层的第二侧设置在柔性基板的第一侧上以形成第一组件，将载体基板设置在第一组件上; 以及去除牺牲层和载体衬底以形成互连。

    Radiation imaging system and method
    9.
    发明申请
    Radiation imaging system and method 有权
    辐射成像系统及方法

    公开(公告)号：US20050218330A1

    公开(公告)日：2005-10-06

    申请号：US10815357

    申请日：2004-03-31

    申请人： James Rose ,  William Burdick ,  James Vartuli ,  Min-Yi Shih ,  Samhita Dasgupta

    发明人： James Rose ,  William Burdick ,  James Vartuli ,  Min-Yi Shih ,  Samhita Dasgupta

    IPC分类号： G01T1/20

    CPC分类号： G01T1/20

    摘要： An imaging system for generating an image of an object is provided. The imaging system comprises an X-ray source disposed in a spatial relationship to the object configured to transmit X-ray radiation through the object. The system further comprises at least one X-ray detecting media configured to convert the X-ray radiation transmitted through the object to optical signals. In addition, the system comprises an optical transmission conduit comprising a first end and a second end and an optical detector configured to convert optical signals to corresponding electrical signals. The first end of the optical transmission conduit is coupled to the X-ray detection device and the second end coupled to the optical detector.

    摘要翻译： 提供了一种用于生成对象的图像的成像系统。 成像系统包括与被配置成透射穿过物体的X射线辐射的物体以空间关系设置的X射线源。 该系统还包括至少一个X射线检测介质，被配置为将通过物体透射的X射线辐射转换为光信号。 另外，该系统包括一个包括第一端和第二端的光传输导管和被配置成将光信号转换成对应的电信号的光检测器。 光传输导管的第一端耦合到X射线检测装置，第二端耦合到光检测器。

    Methods and apparatus for tileable sensor array
    10.
    发明申请
    Methods and apparatus for tileable sensor array 有权
    瓦片传感器阵列的方法和装置

    公开(公告)号：US20050094763A1

    公开(公告)日：2005-05-05

    申请号：US10697515

    申请日：2003-10-30

    申请人： Donna Sherman ,  William Burdick ,  James Rose

    发明人： Donna Sherman ,  William Burdick ,  James Rose

    IPC分类号： A61B6/00 ,  A61B6/03 ,  G01N23/00 ,  G21K1/02 ,  G21K1/12 ,  H05G1/60

    CPC分类号： G21K1/025 ,  A61B6/032 ,  A61B6/4411 ,  A61B2562/02 ,  A61B2562/046

    摘要： A detector array kit that includes at least one sensor array. The sensor array has an active side at least one sensor on the flat active side configured to detect a particular form of energy. The sensor array active side has a positioning structure on the active side that is essentially transparent to the particular form of energy. The positioning structure includes a plurality of spaced compressible posts or tubes configured to compressively and frictionally engage with a complementary mounting structure. The detector kit further includes a complementary mounting structure essentially transparent to the particular form of energy.

    摘要翻译： 包括至少一个传感器阵列的检测器阵列套件。 传感器阵列具有活动侧，平面有源侧上的至少一个传感器被配置为检测特定形式的能量。 传感器阵列主动侧在活动侧具有对特定形式的能量基本上透明的定位结构。 定位结构包括多个间隔开的可压缩柱或管，其构造为与互补的安装结构压缩和摩擦地接合。 检测器套件还包括对特定形式的能量基本上透明的互补安装结构。