Electrochemical etching apparatus and method for spirally etching a
workpiece
    1.
    发明授权
    Electrochemical etching apparatus and method for spirally etching a workpiece 失效
    用于螺旋蚀刻工件的电化学蚀刻装置和方法

    公开(公告)号:US5865984A

    公开(公告)日:1999-02-02

    申请号:US885608

    申请日:1997-06-30

    CPC classification number: C25F7/00

    Abstract: Disclosed is an electrochemical etching apparatus including a fixture for holding a workpiece; a nozzle, positioned opposite the fixture and facing the workpiece, for impinging an etchant onto the workpiece; and an electrode for applying a voltage between the electrode and the workpiece; wherein, in operation, one of the fixture and nozzle are rotated and the nozzle is moved radially outwardly so that the workpiece is spirally etched. Also disclosed is a method of spirally etching a workpiece.

    Abstract translation: 公开了一种电化学蚀刻装置,其包括用于保持工件的固定装置; 与所述固定装置相对并面对所述工件的喷嘴,用于将蚀刻剂撞击到所述工件上; 以及用于在电极和工件之间施加电压的电极; 其中,在操作中,夹具和喷嘴中的一个旋转,并且喷嘴径向向外移动,使得工件被螺旋蚀刻。 还公开了螺旋蚀刻工件的方法。

    IC WAPER CARRIER SEALED FROM AMBIENT ATMOSPHERE DURING TRANSPORTATION FROM ONE PROCESS TO THE NEXT
    4.
    发明申请
    IC WAPER CARRIER SEALED FROM AMBIENT ATMOSPHERE DURING TRANSPORTATION FROM ONE PROCESS TO THE NEXT 审中-公开
    在从一个过程运输到下一个运输过程中的环境空气中密封的IC卡擦拭器

    公开(公告)号:US20100051501A1

    公开(公告)日:2010-03-04

    申请号:US12201553

    申请日:2008-08-29

    CPC classification number: H01L21/67393

    Abstract: A wafer carrying structure is provided that allows more efficient operation of the opening and closing mechanisms. More specifically, the wafer carrier includes pressure relief structures that provide appropriate pressure equalization during the opening and closing operations of the wafer carrier. This allows doors on the wafer to be more easily opened and closed while also providing significant environmental isolation for the wafers during transport operations. Relief structures specifically designed to remain closed except for those brief periods of time where pressure relief is necessary to equalize pressure during opening and closing of the carrier.

    Abstract translation: 提供了允许更有效地操作打开和关闭机构的晶片承载结构。 更具体地,晶片载体包括在晶片载体的打开和关闭操作期间提供适当的压力平衡的压力释放结构。 这允许晶片上的门更容易地打开和关闭,同时还在运输操作期间为晶片提供显着的环境隔离。 特别设计为保持关闭的救济结构,除了需要压力释放以在打开和关闭载体的过程中平衡压力的短暂时间内。

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