公开(公告)号：US20120043564A1

公开(公告)日：2012-02-23

申请号：US13288291

申请日：2011-11-03

申请人： MICHAEL D. CAMRAS ,  WILLIAM R. IMLER ,  FRANKLIN J. WALL, JR. ,  FRANK M. STERANKA ,  MICHAEL R. KRAMES ,  HELENA TICHA ,  LADISLAV TICHY ,  Robertus G. Alferink

发明人： MICHAEL D. CAMRAS ,  WILLIAM R. IMLER ,  FRANKLIN J. WALL, JR. ,  FRANK M. STERANKA ,  MICHAEL R. KRAMES ,  HELENA TICHA ,  LADISLAV TICHY ,  Robertus G. Alferink

IPC分类号： H01L33/08

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。

公开(公告)号：US06518079B2

公开(公告)日：2003-02-11

申请号：US09741972

申请日：2000-12-20

申请人： William R. Imler

发明人： William R. Imler

IPC分类号： H01L21302

CPC分类号： H01L33/0095 ,  H01L21/78 ,  H01L33/32

摘要： A method for separating semiconductor devices is disclosed. The method includes providing a substrate having one or more epitaxial layers formed thereon, forming trenches in the one or more epitaxial layers, forming scribe lines in a surface of the substrate, wherein the locations of the scribe lines correspond to the locations of the trenches, and separating the semiconductor devices by cracking the wafer along the scribe lines.

公开(公告)号：US08748912B2

公开(公告)日：2014-06-10

申请号：US13288291

申请日：2011-11-03

申请人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall, Jr. ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

发明人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall, Jr. ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

IPC分类号： H01L33/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。

公开(公告)号：US08067254B2

公开(公告)日：2011-11-29

申请号：US12686209

申请日：2010-01-12

申请人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall, Jr. ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

发明人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall, Jr. ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

IPC分类号： H01L21/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different correlated color temperature (CCT) and are covered with an optical element that assists in mixing the light from the LEDs to produce a desired correlated color temperature. The optical element may be bonded to the phosphor converted light emitting devices. The optical element may be a dome mounted over the phosphor converted light emitting devices and filled with an encapsulant.

摘要翻译： 设备具有产生广谱光的多个磷光体转换发光器件（LED）的阵列。 磷光体转换的LED可以产生具有不同相关色温（CCT）的光，并且被有助于混合来自LED的光以产生期望的相关色温的光学元件覆盖。 光学元件可以结合到磷光体转换的发光器件上。 光学元件可以是安装在磷光体转换的发光器件上并且填充有密封剂的圆顶。

公开(公告)号：US20080186702A1

公开(公告)日：2008-08-07

申请号：US12099021

申请日：2008-04-07

申请人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

发明人： Michael D. Camras ,  William R. Imler ,  Franklin J. Wall ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy ,  Robertus G. Alferink

IPC分类号： F21V9/10

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different correlated color temperature (CCT) and are covered with an optical element that assists in mixing the light from the LEDs to produce a desired correlated color temperature. The phosphor converted LEDs may also be combined in an array with color LEDs. The color LEDs may be controlled to vary their brightness such that light with an approximately continuous broad spectrum is produced. By controlling the brightness of the color LEDs, light can be produced with a fixed brightness over a large range of white points with a high color rendering quality.

摘要翻译： 设备具有产生广谱光的多个磷光体转换发光器件（LED）的阵列。 磷光体转换的LED可以产生具有不同相关色温（CCT）的光，并且被有助于混合来自LED的光以产生期望的相关色温的光学元件覆盖。 磷光体转换的LED也可以与阵列中的彩色LED组合。 可以控制彩色LED以改变其亮度，使得产生具有近似连续的广谱的光。 通过控制彩色LED的亮度，可以在具有高显色质量的大范围白点上以固定的亮度产生光。

公开(公告)号：US07419839B2

公开(公告)日：2008-09-02

申请号：US10987241

申请日：2004-11-12

申请人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

发明人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

IPC分类号： H01L21/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。

公开(公告)号：US07276737B2

公开(公告)日：2007-10-02

申请号：US11328964

申请日：2006-01-09

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US20100109568A1

公开(公告)日：2010-05-06

申请号：US12686209

申请日：2010-01-12

申请人： Michael D. CAMRAS ,  William R. IMLER ,  Franklin J. WALL, JR. ,  Frank M. STERANKA ,  Michael R. KRAMES ,  Helena TICHA ,  Ladislav TICHY ,  Robertus G. Alferink

发明人： Michael D. CAMRAS ,  William R. IMLER ,  Franklin J. WALL, JR. ,  Frank M. STERANKA ,  Michael R. KRAMES ,  Helena TICHA ,  Ladislav TICHY ,  Robertus G. Alferink

IPC分类号： H05B37/02 ,  H01L21/50 ,  H01L33/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different correlated color temperature (CCT) and are covered with an optical element that assists in mixing the light from the LEDs to produce a desired correlated color temperature. The optical element may be bonded to the phosphor converted light emitting devices. The optical element may be a dome mounted over the phosphor converted light emitting devices and filled with an encapsulant.

摘要翻译： 设备具有产生广谱光的多个磷光体转换发光器件（LED）的阵列。 磷光体转换的LED可以产生具有不同相关色温（CCT）的光，并且被有助于混合来自LED的光以产生期望的相关色温的光学元件覆盖。 光学元件可以结合到磷光体转换的发光器件上。 光学元件可以是安装在磷光体转换的发光器件上并且填充有密封剂的圆顶。

公开(公告)号：US20090025789A1

公开(公告)日：2009-01-29

申请号：US11782359

申请日：2007-07-24

申请人： Hing Wah Chan ,  William R. Imler

发明人： Hing Wah Chan ,  William R. Imler

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  B23K31/02

CPC分类号： H01L31/054 ,  H01L24/13 ,  H01L24/16 ,  H01L31/0547 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13101 ,  H01L2224/16237 ,  H01L2924/00014 ,  Y02E10/52 ,  Y10T156/10 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A system may include a solar cell comprising a first electrical contact, an optical element comprising a second electrical contact, and a solder bump in contact with the first electrical contact and the second electrical contact. The solar cell is to generate charge carriers in response to received photons.Some aspects provide fabrication of a solder bump on an electrical contact of a solar cell, placement of the solder bump in contact with an electrical contact of an optical element, and melting of the solder bump to couple the electrical contact of the solar cell to the electrical contact of the optical element.

摘要翻译： 系统可以包括太阳能电池，其包括第一电接触，包括第二电接触的光学元件和与第一电接触和第二电触点接触的焊料凸块。 太阳能电池响应于接收到的光子而产生电荷载体。 一些方面提供了在太阳能电池的电接触件上制造焊料凸块，将焊料凸块与光学元件的电接触件接触的位置以及焊接凸块的熔化以将太阳能电池的电接触耦合到 光学元件的电接触。

公开(公告)号：US07009213B2

公开(公告)日：2006-03-07

申请号：US10633054

申请日：2003-07-31

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。